US5024735A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for manufacturing interconnects with fine lines and spacing
Assignee: Electrochemical Systems Inc
•
Filing: 1989-02-15
•
Granted: 1991-06-18
•
Expires: 2009-02-15
Abstract
Abstract Metallic or non-metallic wires or bristles are attached to a hollow, cylindrical core. The wires or fibers are quite fine in diameter. Space is provided in the core in the shape of perforations for the transfer of electrolyte, which is fed from the hollow inner portion of the cylinder, along the fibers, to the copper substrate on an imaged substrate. Electrical or non-electrical sources are employed. The wires may be electrically connected through the metal cylinder to the positive pole (anode) of the DC power source. The non-conductive fibers make direct contact with the metal to be etched. In the electrical device within the hollow cylinder but separated from the cylinder is positioned a perforated or mesh copper, which is connected electrically to the negative pole (cathode) of the DC power supply. A cell is now made between the copper laminate and the perforated copper inside the cylinder. Copper from the laminate (anode) is removed and deposited on the perforated copper (cathode). The same apparatus is used for electroforming applications. The wires can be connected to the negative pole of the rectifier, while an anodically insoluble conductive substrate can be used in place of the counter-electrode within the hollow cylinder. By contacting an activated or metallic substrate with negatively charged fibers one can deposit metal in the exposed areas.
Inventors
- 👤 Igor V. Kadija
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 21:30
CPC Classifications
C; C25; C25F; C25F7/00; C25D; C25D5/00; C25D5/02; C25D17/00; C25D17/10; C25D17/14; H; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K3/068; H05K3/07
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
54 words
The method of making fine line and spacing interconnects comprising the steps of: applying an electrolyte to an imaged substrate; applying electricity to said imaged substrate via said electrolyte by contacting said substrate with an electrically conductive brush; and moving said brush in a vibratory motion relative to the plane of said imaged substrate.
Claim 2
Independent Claim
54 words
The method of making fine line and spacing interconnects comprising the steps of: applying an electrolyte to an imaged substrate; applying electricity to said imaged substrate via said electrolyte by contacting said substrate with an electrically conductive brush; and moving said brush in a vibratory motion relative to the plane of said imaged substrate.
Claim 3
Dependent Claim
16 words
The method of claim 1 further including the step of: depositing material on said imaged substrate.
Claim 4
Dependent Claim
16 words
The method of claim 1 further including the step of: removing material from said imaged substrate.
Claim 5
Independent Claim
60 words
A method of making fine line and spacing interconnects for electronic packaging, comprising the steps of: surrounding an imaged substrate with an electrolyte; contacting metal on the imaged substrate with electrically conductive fibers of a brush; connecting said electrically conductive fibers to a power source; and moving said brush in vibratory motion relative to a plane of the imaged substrate.
Claim 6
Independent Claim
60 words
A method of making fine line and spacing interconnects for electronic packaging, comprising the steps of: surrounding an imaged substrate with an electrolyte; contacting metal on the imaged substrate with electrically conductive fibers of a brush; connecting said electrically conductive fibers to a power source; and moving said brush in vibratory motion relative to a plane of the imaged substrate.
Claim 7
Dependent Claim
17 words
The method of claim 4 further comprising the step of supplying said electrolyte in a uniform manner.
Claim 8
Independent Claim
60 words
A method for making fine line and spacing interconnects comprising to an imaged substrate: permitting electrolyte to pass through a perforated member that supports a plurality of electroconductive wires; applying a first polarity electric potential to said plurality of electroconductive wires; applying a second polarity electric potential to a metallic portion mounted in proximity to said plurality of electroconductive wires.
Claim 9
Independent Claim
60 words
A method for making fine line and spacing interconnects comprising to an imaged substrate: permitting electrolyte to pass through a perforated member that supports a plurality of electroconductive wires; applying a first polarity electric potential to said plurality of electroconductive wires; applying a second polarity electric potential to a metallic portion mounted in proximity to said plurality of electroconductive wires.
Claim 10
Dependent Claim
26 words
The method of claim 6 wherein said first and second polarities produce a uniform electric field for applying said electrolyte to a surface of the substrate.
Claim 11
Dependent Claim
25 words
The method of claim 7 further comprising the step of moving said electroconductive wires on the surface of the substrate while applying a uniform pressure.
Claim 12
Dependent Claim
17 words
The method of claim 6 further comprising the step of supplying said electroylyte in a uniform manner.
Claim 13
Independent Claim
85 words
The method of etching an imaged substrate having exposed metal portions to form fine line and space interconnections, comprising the steps of: contacting the imaged substrate with a plurality of electrically conductive fibers; applying a first polarity electric potential to said plurality of electrically conductive fibers; applying second polarity electric potential in proximity to said plurality of electrically conductive fibers; moving said plurality of electrically conductive fibers across a plane of the imaged substrate, applying a uniform pressure to electrically etch and remove exposed portions.
Claim 14
Independent Claim
85 words
The method of etching an imaged substrate having exposed metal portions to form fine line and space interconnections, comprising the steps of: contacting the imaged substrate with a plurality of electrically conductive fibers; applying a first polarity electric potential to said plurality of electrically conductive fibers; applying second polarity electric potential in proximity to said plurality of electrically conductive fibers; moving said plurality of electrically conductive fibers across a plane of the imaged substrate, applying a uniform pressure to electrically etch and remove exposed portions.
Claim 15
Dependent Claim
17 words
The method of claim 10 further comprising the step of supplying said electrolyte in a uniform manner.
Claim 16
Dependent Claim
26 words
The method of claim 10 wherein said step of moving comprises the step of applying a vibratory motion parallel to the plane of the imaged substrate.
Claim 17
Independent Claim
125 words
A method of electroforming a fine-line and space interconnecting pattern on a substrate, comprising the steps of: creating a negative photo-resist pattern on the substrate; sensitizing exposed portions of the substrate with an electroless activator; and depositing a conductive material on said exposed portions of the substrate with a uniform fibrous material, wherein said fibrous material comprises a plurality of electrically conductive fibers, said step of depositing comprising the steps of: applying a first polarity electrical potential to said plurality of electrically conductive fibers; applying a second polarity electrical potential in proximity to said plurality of electrically conductive fibers to generate a uniform electric field over the surface of the substrate; and contacting the fibers over the surface of the substrate with a uniform pressure.
Claim 18
Independent Claim
125 words
A method of electroforming a fine-line and space interconnecting pattern on a substrate, comprising the steps of: creating a negative photo-resist pattern on the substrate; sensitizing exposed portions of the substrate with an electroless activator; and depositing a conductive material on said exposed portions of the substrate with a uniform fibrous material, wherein said fibrous material comprises a plurality of electrically conductive fibers, said step of depositing comprising the steps of: applying a first polarity electrical potential to said plurality of electrically conductive fibers; applying a second polarity electrical potential in proximity to said plurality of electrically conductive fibers to generate a uniform electric field over the surface of the substrate; and contacting the fibers over the surface of the substrate with a uniform pressure.
Claim 19
Dependent Claim
33 words
The method of claim 13 further comprising the step of moving said fibers over the surface of the substrate with a vibratory motion parallel to a plane of the surface of the substrate.
Claim 20
Independent Claim
77 words
A method of making fine line and spacing interconnects comprising the steps of: surrounding a substrate having a developed photo-resist pattern thereon with an etching solution; applying fibers to metal on the substrate through said etching solution with a uniform pressure and uniform etching solution distribution to produce fine spacing and lines on the substrate; and moving said fibers across the surface of the substrate with a vibratory motion parallel to a plane of the substrate surface.
Claim 21
Independent Claim
77 words
A method of making fine line and spacing interconnects comprising the steps of: surrounding a substrate having a developed photo-resist pattern thereon with an etching solution; applying fibers to metal on the substrate through said etching solution with a uniform pressure and uniform etching solution distribution to produce fine spacing and lines on the substrate; and moving said fibers across the surface of the substrate with a vibratory motion parallel to a plane of the substrate surface.
Claim 22
Independent Claim
55 words
A method of making fine line and space interconnects comprising the steps of: applying an etching solution to an imaged substrate; contacting the imaged substrate with a brush applying uniform pressure and providing uniform distribution of the etching solution; and moving said brush in a vibratory motion parallel to a plane of the imaged substrate.
Claim 23
Independent Claim
55 words
A method of making fine line and space interconnects comprising the steps of: applying an etching solution to an imaged substrate; contacting the imaged substrate with a brush applying uniform pressure and providing uniform distribution of the etching solution; and moving said brush in a vibratory motion parallel to a plane of the imaged substrate.
Claim 24
Dependent Claim
12 words
The method of claim 16 wherein said brush is planar in shape.
Claim 25
Independent Claim
74 words
A method of etching an imaged substrate having exposed metal portions to form fine line and space interconnections, comprising the steps of: (a) applying a chemical etchant to the imaged substrate; (b) applying a chemical etchant with a uniform etchant distribution with a fibrous material applying a uniform pressure to the imaged substrate; (c) moving the brush in a vibratory motion relative to a plane of the imaged substrate to dislodge etched metal portions.
Claim 26
Independent Claim
74 words
A method of etching an imaged substrate having exposed metal portions to form fine line and space interconnections, comprising the steps of: (a) applying a chemical etchant to the imaged substrate; (b) applying a chemical etchant with a uniform etchant distribution with a fibrous material applying a uniform pressure to the imaged substrate; (c) moving the brush in a vibratory motion relative to a plane of the imaged substrate to dislodge etched metal portions.
Claim 27
Dependent Claim
13 words
The method of claim 18 wherein said fibrouse material comprises a planar brush.
References Cited (Backward Citations)
US2590927A
Cited
DE2150748A1
Cited
JPS5461040A
Cited
US4159934A
Cited
US4417962A
Cited
JPS56169798A
Cited
JPS59185777A
Cited
JPS63297588A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-06-17 | 1994-12-17 | 1995-06-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-06-17 | 1998-12-17 | 1999-06-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-06-17 | 2002-12-17 | 2003-06-18 | $7700.00 | Window Closed / Lapsed |