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US5933753A Expired / Lapsed US ⏱️ 0.0 years remaining

Open-bottomed via liner structure and method for fabricating same

Assignee: GlobalFoundries Inc
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Filing: 1996-12-16
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Granted: 1999-08-03
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Expires: 2016-12-16
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Abstract

Abstract This invention relates to a method of forming a bottomless liner structure. The method involves the steps of first obtaining a material having a via. Next, a first layer is deposited on the material, the first layer covering the sidewalls and bottom of the via. Finally, a second layer is sputter deposited on the first material, the material Rf biased during at least a portion of the time that the second layer is sputter deposited, such that the first layer deposited on the bottom of the via is substantially removed and substantially all of the first layer deposited on the sidewalls of the via is unaffected.

Inventors

  • 👤 Andrew H. Simon
  • 👤 Cyprian E. Uzoh

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 21:45
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/032; H10W20/033; H10W20/034; H10W20/042; H10W20/043; H10W20/054

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 97 words
A method of forming a bottomless liner structure, comprising: a) obtaining a material having a via; b) depositing a first layer on the material having the via, the first layer covering the sidewalls and bottom of the via; c) sputter depositing a second layer on the first layer, the material being Rf biased during a portion of the time that the second layer is sputter deposited, such that the first layer deposited on the bottom of the via is substantially removed and substantially all of the first layer deposited on the sidewalls of the via is unaffected.
Claim 2
Independent Claim 97 words
A method of forming a bottomless liner structure, comprising: a) obtaining a material having a via; b) depositing a first layer on the material having the via, the first layer covering the sidewalls and bottom of the via; c) sputter depositing a second layer on the first layer, the material being Rf biased during a portion of the time that the second layer is sputter deposited, such that the first layer deposited on the bottom of the via is substantially removed and substantially all of the first layer deposited on the sidewalls of the via is unaffected.
Claim 3
Dependent Claim 12 words
The method according to claim 1 wherein the material is a substrate.
Claim 4
Dependent Claim 17 words
The method according to claim 1, wherein the first layer covering the via comprises an insulating material.
Claim 5
Dependent Claim 17 words
The method according to claim 1, wherein the first layer covering the via comprises a semiconducting material.
Claim 6
Dependent Claim 17 words
The method according to claim 1, wherein the first layer covering the via comprises a conducting material.
Claim 7
Dependent Claim 34 words
The method according to claim 5 wherein the first layer covering the via is selected from the group consisting of titanium, titanium nitride, tungsten, titanium tungsten, tungsten nitride, tantalum, TaN, TaN/Ta, Ta/TaN, and Ta/TaN/Ta.
Claim 8
Dependent Claim 12 words
The method according to claim 6 wherein the first layer is TaN/Ta.
Claim 9
Dependent Claim 13 words
The method according to claim 1 wherein the second layer is a metal.
Claim 10
Dependent Claim 12 words
The method according to claim 8 wherein the second layer is copper.
Claim 11
Dependent Claim 32 words
The method according to claim 1 wherein the sputter deposition Rf biasing is active for a minimum of about 25% and a maximum of about 50% of the total sputter deposition time.

References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-08-02 2003-02-01 2003-08-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-08-02 2007-02-01 2007-08-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-08-02 2011-02-01 2011-08-03 $7700.00 Window Closed / Lapsed

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