US6150188A
Expired / Lapsed
US
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Integrated circuits using optical fiber interconnects formed through a semiconductor wafer and methods for forming same
Assignee: Micron Technology Inc
•
Filing: 1998-02-26
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Granted: 2000-11-21
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Expires: 2018-02-26
Abstract
Abstract An integrated circuit with a number of optical fibers that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical fibers include a cladding layer and a core formed in the high aspect ratio hole. These optical fibers are used to transmit signals between functional circuits on the semiconductor wafer and functional circuits on the back of the wafer or beneath the wafer.
Inventors
- 👤 Joseph E. Geusic
- 👤 Kie Y. Ahn
- 👤 Leonard Forbes
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 08:45
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/43; H; H10; H10W; H10W20/00; H10W20/20
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
84 words
A method for interconnecting first and second integrated circuits, wherein the first integrated circuit is formed on a working surface of a first semiconductor substrate, the method comprising: forming at least one high aspect ratio hole through the first semiconductor substrate; forming an optical fiber with a cladding layer and a core in the at least one high aspect ratio hole, the optical fiber having first and second ends; and coupling the first integrated circuit to the second integrated circuit through the optical fiber.
Claim 2
Independent Claim
84 words
A method for interconnecting first and second integrated circuits, wherein the first integrated circuit is formed on a working surface of a first semiconductor substrate, the method comprising: forming at least one high aspect ratio hole through the first semiconductor substrate; forming an optical fiber with a cladding layer and a core in the at least one high aspect ratio hole, the optical fiber having first and second ends; and coupling the first integrated circuit to the second integrated circuit through the optical fiber.
Claim 3
Dependent Claim
26 words
The method of claim 1, and further comprising forming the second integrated circuit on a second surface, opposite the working surface of the first semiconductor substrate.
Claim 4
Dependent Claim
51 words
The method of claim 1, and further comprising: forming the second integrated circuit in a working surface of a second semiconductor substrate; and bonding the first and second semiconductor substrates together such that the first and second integrated circuits are coupled together through the optical fiber in the first semiconductor substrate.
Claim 5
Dependent Claim
37 words
The method of claim 3, wherein bonding the first and second semiconductor substrates together comprises bonding surfaces of the first and second semiconductor substrates that are opposite the working surfaces of the first and second semiconductor substrates.
Claim 6
Dependent Claim
43 words
The method of claim 3, wherein bonding the first and second semiconductor substrates together comprises bonding a working surface of the second semiconductor substrate with a surface of the first semiconductor substrate that is opposite the working surface of the first semiconductor substrate.
Claim 7
Dependent Claim
59 words
The method of claim 1, wherein forming at least one high aspect ratio hole comprises: forming etch pits at selected locations in the first surface of the semiconductor substrate; and performing an anodic etch of the first semiconductor substrate such that high aspect ratio holes are formed through the first semiconductor substrate at the location of the etch pits.
Claim 8
Dependent Claim
41 words
The method of claim 1, wherein coupling the first integrated circuit to the second integrated circuit comprises forming optical transmitters and receivers on opposite ends of the optical fiber so as to transmit signals between the first and second integrated circuits.
Claim 9
Dependent Claim
47 words
The method of claim 7, wherein forming an optical transmitter comprises forming a gallium arsenide optical transmitter that is bonded to a surface of the first semiconductor substrate and forming an optical receiver comprises forming a silicon photodiode detector at an opposite end of the optical fiber.
Claim 10
Dependent Claim
24 words
The method of claim 1, wherein forming the optical fiber comprises forming a cladding layer of SiO 2 and forming a core of polysilicon.
Claim 11
Dependent Claim
26 words
The method of claim 1, wherein forming the optical fiber comprises forming a cladding layer of Al 2 O 3 and forming a core of polysilicon.
Claim 12
Dependent Claim
28 words
The method of claim 1, wherein forming the optical fiber comprises forming a cladding layer of SiO 2 and forming a core of Al 2 O 3 .
Claim 13
Dependent Claim
51 words
The method of claim 1, wherein forming the optical fiber comprises forming a core with a hole that runs substantially along the center of the optical fiber wherein the hole has a diameter that is less than 0.59 times the wavelength of the light to be transmitted in the optical fiber.
Claim 14
Dependent Claim
41 words
The method of claim 1, wherein forming the optical fiber comprises forming a cladding layer that surrounds a core layer, wherein the core layer has an index of refraction that is greater than the index of refraction of the cladding layer.
Claim 15
Dependent Claim
19 words
The method of claim 1, wherein forming the optical fiber comprises forming the cladding layer using atomic layer epitaxy.
Claim 16
Independent Claim
122 words
A method for forming an integrated circuit in a semiconductor wafer with an optical fiber that extends through the semiconductor wafer, the method comprising: forming a functional circuit in a first surface of the semiconductor wafer; forming a number of etch pits in the first surface of the semiconductor wafer at selected locations in the functional circuit; performing an anodic etch of the semiconductor wafer such that high aspect ratio holes are formed through the semiconductor wafer from the first surface to a second, opposite surface; forming a cladding layer of an optical fiber on an inner surface of the high aspect ratio holes; forming a core layer of the optical fiber; and selectively coupling the optical fiber to the functional circuit.
Claim 17
Independent Claim
122 words
A method for forming an integrated circuit in a semiconductor wafer with an optical fiber that extends through the semiconductor wafer, the method comprising: forming a functional circuit in a first surface of the semiconductor wafer; forming a number of etch pits in the first surface of the semiconductor wafer at selected locations in the functional circuit; performing an anodic etch of the semiconductor wafer such that high aspect ratio holes are formed through the semiconductor wafer from the first surface to a second, opposite surface; forming a cladding layer of an optical fiber on an inner surface of the high aspect ratio holes; forming a core layer of the optical fiber; and selectively coupling the optical fiber to the functional circuit.
Claim 18
Dependent Claim
21 words
The method of claim 15, wherein forming a cladding layer comprises forming an oxide layer in the high aspect ratio holes.
Claim 19
Dependent Claim
34 words
The method of claim 15, wherein forming the core layer comprises forming a layer of an oxide with an index of refraction that is greater than the index of refraction of the cladding layer.
Claim 20
Dependent Claim
48 words
The method of claim 15, wherein forming the core layer comprises forming a layer with a hole that extends substantially along the length of the optical fiber with a diameter that is less than 0.59 times the wavelength of light used to transmit signals over the optical fiber.
Claim 21
Independent Claim
75 words
A method for forming an optical fiber through a semiconductor substrate, the method comprising: forming at least one high aspect ratio hole through the semiconductor substrate that passes through the semiconductor substrate from a first working surface to a surface opposite the first working surface; forming a cladding layer of an optical fiber on an inner surface of the at least one high aspect ratio hole; and forming a core layer of the optical fiber.
Claim 22
Independent Claim
75 words
A method for forming an optical fiber through a semiconductor substrate, the method comprising: forming at least one high aspect ratio hole through the semiconductor substrate that passes through the semiconductor substrate from a first working surface to a surface opposite the first working surface; forming a cladding layer of an optical fiber on an inner surface of the at least one high aspect ratio hole; and forming a core layer of the optical fiber.
Claim 23
Dependent Claim
21 words
The method of claim 19, wherein forming a cladding layer comprises forming an oxide layer in the high aspect ratio holes.
Claim 24
Dependent Claim
34 words
The method of claim 19, wherein forming the core layer comprises forming a layer of an oxide with an index of refraction that is greater than the index of refraction of the cladding layer.
Claim 25
Dependent Claim
48 words
The method of claim 19, wherein forming the core layer comprises forming a layer with a hole that extends substantially along the length of the optical fiber with a diameter that is less than 0.59 times the wavelength of light used to transmit signals over the optical fiber.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2003-11-21 | 2004-05-22 | 2004-11-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-11-21 | 2008-05-22 | 2008-11-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-11-21 | 2012-05-22 | 2012-11-21 | $7700.00 | Window Closed / Lapsed |