Process for forming an integrated circuit

Claim 2

A process for forming an integrated circuit comprising: forming a dielectric layer overlying a substrate; depositing an electrode material over the dielectric layer; depositing a layer of photoresist over the electrode material; patterning the photoresist; exposing the photoresist to deep ultraviolet light baking the photoresist using a dehydration bake; and etching portions of the electrode material using a chemical system comprising inorganic components.

Claim 3

The process of claim 1 wherein the substrate is a semiconductor wafer, the electrode material is polycrystalline silicon and the dielectric layer is silicon dioxide.

Claim 4

The process of claim 1 in which the photoresist is positive photoresist.

Claim 5

The process of claim 1 in which the photoresist is negative photoresist.

Claim 6

The process of claim 1 in which the inorganic components used in the etch step are selected from the group consisting of nitrogen halides, sulfur halides, hydrogen halides, bimolecular halides and mixtures thereof.

Claim 7

The process of claim 5 in which the inorganic components used in the etch step are selected from the group consisting of helium, hydrogen chloride, hydrogen iodide, nitrogen trifluoride, sulfur hexafluoride, bimolecular chlorine and mixtures thereof.

Claim 8

The process of claim 1 in which the deep ultraviolet light exposure is conducted using a wavelength of 320 nanometers or less.

Claim 9

The process of claim 1 in which the dehydration bake step is conducted at a temperature of at least 125° C.

Claim 10

In the manufacture of an integrated circuit, a process for the selective plasma etch of polysilicon relative to silicon dioxide comprising: forming a silicon dioxide dielectric layer on the surface of a monocrystalline silicon wafer; forming a polysilicon gate material layer on the silicon dioxide layer; depositing a layer of photoresist over the polysilicon layer; exposing selected portions of the photoresist to ultraviolet light through a photomask; stripping off the exposed portions of the photoresist; exposing the remaining photoresist to deep ultraviolet light; baking the remaining photoresist in a dehydration bake step; and selectively plasma etching the portions of the polysilicon layer bared by the mask pattern using a chemical system comprising inorganic components selected from the group consisting of nitrogen halides, sulfur halides, hydrogen halides, bimolecular halides and mixtures thereof.

Claim 11

In the manufacture of an integrated circuit, a process for the selective plasma etch of polysilicon relative to silicon dioxide comprising: forming a silicon dioxide dielectric layer on the surface of a monocrystalline silicon wafer; forming a polysilicon gate material layer on the silicon dioxide layer; depositing a layer of photoresist over the polysilicon layer; exposing selected portions of the photoresist to ultraviolet light through a photomask; stripping off the exposed portions of the photoresist; exposing the remaining photoresist to deep ultraviolet light; baking the remaining photoresist in a dehydration bake step; and selectively plasma etching the portions of the polysilicon layer bared by the mask pattern using a chemical system comprising inorganic components selected from the group consisting of nitrogen halides, sulfur halides, hydrogen halides, bimolecular halides and mixtures thereof.

Claim 12

The process of claim 9 in which the inorganic components used in the plasma etch step are selected from the group consisting of helium, hydrogen chloride, hydrogen iodide, nitrogen trifluoride, sulfur hexafluoride, bimolecular chlorine and mixtures thereof.

Claim 13

The process of claim 9 in which the deep ultraviolet light exposure is conducted using a wavelength of 320 nanometers or less, and in which the dehydration bake step is conducted at a temperature of at least 125° C.

Claim 14

The process of claim 9 in which the photoresist contains no carbon.

Claim 15

In the manufacture of an integrated circuit, a process for the selective plasma etch of polysilicon relative to silicon dioxide comprising: forming a silicon dioxide dielectric layer on the surface of a monocrystalline silicon wafer; forming a polysilicon gate material layer on the silicon dioxide layer; depositing a layer of photoresist over the polysilicon layer; exposing selected portions of the photoresist to ultraviolet light through a photomask; stripping off the exposed portions of the photoresist; performing a photoresist carbon-binding pretreatment comprising: subjecting the remaining exposed photoresist to a deep ultraviolet light treatment in which the ultraviolet light has a wavelength of 320 nanometers or less; and subjecting the remaining exposed photoresist to a dehydrogenation bake step having a temperature of at least 125° C.; selectively plasma etching the portions of the polysilicon layer bared by the mask pattern using a chemical system comprising inorganic components are selected from the group consisting of helium, hydrogen chloride, hydrogen iodide, nitrogen trifluoride, sulfur hexafluoride, bimolecular chlorine and mixtures thereof, in which the ratio of etch rates of polysilicon to silicon dioxide is at least 100:1.

Claim 16

In the manufacture of an integrated circuit, a process for the selective plasma etch of polysilicon relative to silicon dioxide comprising: forming a silicon dioxide dielectric layer on the surface of a monocrystalline silicon wafer; forming a polysilicon gate material layer on the silicon dioxide layer; depositing a layer of photoresist over the polysilicon layer; exposing selected portions of the photoresist to ultraviolet light through a photomask; stripping off the exposed portions of the photoresist; performing a photoresist carbon-binding pretreatment comprising: subjecting the remaining exposed photoresist to a deep ultraviolet light treatment in which the ultraviolet light has a wavelength of 320 nanometers or less; and subjecting the remaining exposed photoresist to a dehydrogenation bake step having a temperature of at least 125° C.; selectively plasma etching the portions of the polysilicon layer bared by the mask pattern using a chemical system comprising inorganic components are selected from the group consisting of helium, hydrogen chloride, hydrogen iodide, nitrogen trifluoride, sulfur hexafluoride, bimolecular chlorine and mixtures thereof, in which the ratio of etch rates of polysilicon to silicon dioxide is at least 100:1.

Claim 17

The process of claim 1, wherein the electrode material is a gate electrode material and the dielectric layer is a gate dielectric layer.