Patent US6072236A successfully refreshed from Google Patents.
US6072236A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Micromachined chip scale package
Assignee: Micron Technology Inc
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Filing: 1996-03-07
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Granted: 2000-06-06
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Expires: 2016-03-07
Abstract
Abstract A chip scale package comprised of a semiconductor die having a silicon blank laminated to its active surface. The bond pads of the die are accessed through apertures micromachined through the blank. The package may be employed with wire bonds, or solder or other conductive bumps may be placed in the blank apertures for flip-chip applications. Further, the package may be employed to reroute external connections of the die to other locations, such as a centralized ball grid array or in an edge-connect arrangement for direct or discrete die connect (DDC) to a carrier. It is preferred that the chip scale package be formed at the wafer level, as one of a multitude of packages so formed with a wafer-level blank, and that the entire wafer be burned-in and tested to identify the known good die (KGD) before the wafer laminate is separated into individual packages.
Inventors
- 👤 Salman Akram
- 👤 David R. Hembree
- 👤 Warren M. Farnworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:03
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/01; H10W70/05; H10W72/00; H10W72/01; H10W72/012; H10W72/01251; H10W72/01255; H10W72/20; H10W72/221; H10W72/225; H10W72/251; H10W72/252; H10W72/253; H10W72/29; H10W72/90; H10W72/921; H10W72/923; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 54
Claim 1
Independent Claim
96 words
A chip scale package for a semiconductor die, comprising: at least one semiconductor die including an integrated circuit having external electrical connections on an active side thereof; and a discrete preformed blank having a surface area no larger than a size of said at least one die, placed over said active side of said at least one die and including apertures formed therein through which said external connections of said at least one die are accessible, wherein at least some of said apertures are placed in said blank at locations remote from said external electrical connections.
Claim 2
Dependent Claim
96 words
A chip scale package for a semiconductor die, comprising: at least one semiconductor die including an integrated circuit having external electrical connections on an active side thereof; and a discrete preformed blank having a surface area no larger than a size of said at least one die, placed over said active side of said at least one die and including apertures formed therein through which said external connections of said at least one die are accessible, wherein at least some of said apertures are placed in said blank at locations remote from said external electrical connections.
Claim 3
Dependent Claim
20 words
The package of claim 1, further including circuit traces extending from said external electrical connections to said remote aperture locations.
Claim 4
Dependent Claim
24 words
The package of claim 2, wherein said circuit traces are at least partially formed on said active surface of said at least one die.
Claim 5
Dependent Claim
17 words
The package of claim 2, wherein said circuit traces are at least partially formed on said blank.
Claim 6
Dependent Claim
17 words
The package of claim 2, further including bond pads formed under said apertures at said remote locations.
Claim 7
Dependent Claim
21 words
The package of claim 2, further including remote external connection elements at said remote locations adjacent an edge of said package.
Claim 8
Dependent Claim
26 words
The package of claim 4, wherein said circuit traces are at least partially formed on a side of said blank adjacent said at least one die.
Claim 9
Dependent Claim
21 words
The package of claim 4, wherein said circuit traces are at least partially formed on an exposed side of said blank.
Claim 10
Dependent Claim
16 words
The package of claim 8, wherein said circuit traces are at least partially formed in trenches.
Claim 11
Dependent Claim
17 words
The package of claim 5, wherein said remote locations are arranged adjacent an edge of said package.
Claim 12
Dependent Claim
31 words
The package of claim 10, further including a trench in an exposed side of said blank extending from at least some of said remote bond pad apertures toward said package edge.
Claim 13
Dependent Claim
21 words
The package of claim 6, wherein said remote external connection elements comprise metallized trenches in an exposed side of said blank.
Claim 14
Dependent Claim
35 words
The package of claim 12, wherein said trenches extend to said external connections of said at least one die, define said circuit traces, and communicate with said external connections of said at least one die.
Claim 15
Dependent Claim
107 words
A chip scale package for a semiconductor die, comprising: at least one semiconductor die including an integrated circuit having external electrical connections on an active side thereof; and a discrete preformed blank having a surface area no larger than a size of said at least one die, placed over said active side of said at least one die and including apertures formed therein through which said external connections of said at least one die are accessible and said at least one semiconductor die further including bond pads accessible through said apertures at locations remote from said external die connections and in electrical communication therewith through circuit traces.
Claim 16
Dependent Claim
107 words
A chip scale package for a semiconductor die, comprising: at least one semiconductor die including an integrated circuit having external electrical connections on an active side thereof; and a discrete preformed blank having a surface area no larger than a size of said at least one die, placed over said active side of said at least one die and including apertures formed therein through which said external connections of said at least one die are accessible and said at least one semiconductor die further including bond pads accessible through said apertures at locations remote from said external die connections and in electrical communication therewith through circuit traces.
Claim 17
Dependent Claim
27 words
The package of claim 14, wherein said apertures are filled with a conductive material selected from the group comprising: solder, a conductive polymer, and a plated metal.
Claim 18
Dependent Claim
19 words
The package of claim 15, further including a metal layer over said bond pads and under said conductive material.
Claim 19
Dependent Claim
16 words
The package of claim 16, wherein walls of said apertures are covered with said metal layer.
Claim 20
Dependent Claim
110 words
A chip scale package for a semiconductor die, comprising: at least one semiconductor die including an integrated circuit having external electrical connections on an active side thereof; and a preformed blank having a surface area no larger than a size of said at least one die, placed over said active side of said at least one die and including apertures formed therein through which said external connections of said at least one die are accessible, wherein at least some of said apertures are placed in said blank at locations remote from said external electrical connections, and having circuit traces extending from said remote apertures locations to said external electrical connections.
Claim 21
Dependent Claim
110 words
A chip scale package for a semiconductor die, comprising: at least one semiconductor die including an integrated circuit having external electrical connections on an active side thereof; and a preformed blank having a surface area no larger than a size of said at least one die, placed over said active side of said at least one die and including apertures formed therein through which said external connections of said at least one die are accessible, wherein at least some of said apertures are placed in said blank at locations remote from said external electrical connections, and having circuit traces extending from said remote apertures locations to said external electrical connections.
Claim 22
Dependent Claim
24 words
The package of claim 18, wherein said circuit traces are at least partially formed on said active surface of said at least one die.
Claim 23
Dependent Claim
21 words
The package of claim 18, wherein said circuit traces are at least partially formed on an exposed side of said blank.
Claim 24
Dependent Claim
17 words
The package of claim 18, further including bond pads formed under said apertures at said remote locations.
Claim 25
Dependent Claim
21 words
The package of claim 18, further including remote external connection elements at said remote locations adjacent an edge of said package.
Claim 26
Dependent Claim
16 words
The package of claim 20, wherein said circuit traces are at least partially formed in trenches.
Claim 27
Dependent Claim
17 words
The package of claim 21, wherein said remote locations are arranged adjacent an edge of said package.
Claim 28
Dependent Claim
31 words
The package of claim 24, further including a trench in an exposed side of said blank extending from at least some of said remote bond pad apertures toward said package edge.
Claim 29
Dependent Claim
21 words
The package of claim 22, wherein said remote external connection elements comprise metallized trenches in an exposed side of said blank.
Claim 30
Dependent Claim
35 words
The package of claim 25, wherein said trenches extend to said external connections of said at least one die, define said circuit traces, and communicate with said external connections of said at least one die.
Claim 31
Dependent Claim
139 words
A chip scale package for a semiconductor die, comprising: at least one semiconductor die including an integrated circuit having external electrical connections on an active side thereof; and a preformed blank having a surface area no larger than a size of said at least one die, placed over said active side of said at least one die and including apertures formed therein through which said external connections of said at least one die are accessible, wherein at least some of said apertures are placed in said blank at locations remote from said external electrical connections, having bond pads formed under said apertures at said remote locations arranged adjacent an edge of said package, and including a trench in an exposed side of said blank extending from at least some of said remote bond pad apertures toward said package edge.
Claim 32
Dependent Claim
139 words
A chip scale package for a semiconductor die, comprising: at least one semiconductor die including an integrated circuit having external electrical connections on an active side thereof; and a preformed blank having a surface area no larger than a size of said at least one die, placed over said active side of said at least one die and including apertures formed therein through which said external connections of said at least one die are accessible, wherein at least some of said apertures are placed in said blank at locations remote from said external electrical connections, having bond pads formed under said apertures at said remote locations arranged adjacent an edge of said package, and including a trench in an exposed side of said blank extending from at least some of said remote bond pad apertures toward said package edge.
Claim 33
Dependent Claim
20 words
The package of claim 28, further including circuit traces extending from said external electrical connections to said remote aperture locations.
Claim 34
Dependent Claim
24 words
The package of claim 29, wherein said circuit traces are at least partially formed on said active surface of said at least one die.
Claim 35
Dependent Claim
17 words
The package of claim 29, wherein said circuit traces are at least partially formed on said blank.
Claim 36
Dependent Claim
17 words
The package of claim 29, further including bond pads formed under said apertures at said remote locations.
Claim 37
Dependent Claim
21 words
The package of claim 29, further including remote external connection elements at said remote locations adjacent an edge of said package.
Claim 38
Dependent Claim
26 words
The package of claim 31, wherein said circuit traces are at least partially formed on a side of said blank adjacent said at least one die.
Claim 39
Dependent Claim
21 words
The package of claim 31, wherein said circuit traces are at least partially formed on an exposed side of said blank.
Claim 40
Dependent Claim
16 words
The package of claim 35, wherein said circuit traces are at least partially formed in trenches.
Claim 41
Dependent Claim
17 words
The package of claim 32, wherein said remote locations are arranged adjacent an edge of said package.
Claim 42
Dependent Claim
31 words
The package of claim 37, further including a trench in an exposed side of said blank extending from at least some of said remote bond pad apertures toward said package edge.
Claim 43
Dependent Claim
21 words
The package of claim 33, wherein said remote external connection elements comprise metallized trenches in an exposed side of said blank.
Claim 44
Dependent Claim
35 words
The package of claim 39, wherein said trenches extend to said external connections of said at least one die, define said circuit traces, and communicate with said external connections of said at least one die.
Claim 45
Dependent Claim
140 words
A chip scale package for a semiconductor die, comprising: at least one semiconductor die including an integrated circuit having external electrical connections on an active side thereof; and a preformed blank having a surface area no larger than a size of said at least one die, placed over said active side of said at least one die and including apertures formed therein through which said external connections of said at least one die are accessible, wherein at least some of said apertures are placed in said blank at locations remote from said external electrical connections, having remote external connection elements at said remote locations adjacent an edge of said package, wherein said remote external connection elements comprise metallized trenches in an exposed side of said blank with circuit traces extending from said external electrical connections to said remote aperture locations.
Claim 46
Dependent Claim
140 words
A chip scale package for a semiconductor die, comprising: at least one semiconductor die including an integrated circuit having external electrical connections on an active side thereof; and a preformed blank having a surface area no larger than a size of said at least one die, placed over said active side of said at least one die and including apertures formed therein through which said external connections of said at least one die are accessible, wherein at least some of said apertures are placed in said blank at locations remote from said external electrical connections, having remote external connection elements at said remote locations adjacent an edge of said package, wherein said remote external connection elements comprise metallized trenches in an exposed side of said blank with circuit traces extending from said external electrical connections to said remote aperture locations.
Claim 47
Dependent Claim
25 words
The package of claim 41, further including circuit traces that are at least partially formed on said active surface of said at least one die.
Claim 48
Dependent Claim
26 words
The package of claim 41, wherein said circuit traces are at least partially formed on a side of said blank adjacent said at least one die.
Claim 49
Dependent Claim
21 words
The package of claim 41, wherein said circuit traces are at least partially formed on an exposed side of said blank.
Claim 50
Dependent Claim
15 words
The package of claim 41, further including bond pads formed under said said remote locations.
Claim 51
Dependent Claim
33 words
The package of claim 41, wherein said trenches extend to said external of said at least one die, define said circuit traces, and communicate with said connections of said at least one die.
Claim 52
Dependent Claim
16 words
The package of claim 42 wherein said circuit traces are at least partially formed in trenches.
Claim 53
Dependent Claim
14 words
The package of claim 41, wherein said remote locations are arranged adjacent said package.
Claim 54
Dependent Claim
31 words
The package of claim 45, further including a trench in an exposed side of said blank extending from at least some of said remote bond pad apertures toward said package edge.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-06 | 2003-12-06 | 2004-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-06 | 2007-12-06 | 2008-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-06 | 2011-12-06 | 2012-06-06 | $7700.00 | Window Closed / Lapsed |