Patent US6066514A successfully refreshed from Google Patents.
US6066514A
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Adhesion enhanced semiconductor die for mold compound packaging
Assignee: Micron Technology Inc
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Filing: 1997-11-03
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Granted: 2000-05-23
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Expires: 2017-11-03
Abstract
Abstract A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by electroplating or electroless coating techniques. The metal layer provides a uniform wetting surface for better adhesion of the die with the mold compound during encapsulation. The increased adhesion reduces the delamination potential of the die from the package.
Inventors
- 👤 Jerrold L. King
- 👤 J. Mike Brooks
- 👤 Walter L. Moden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:08
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/127; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/075; H10W72/30; H10W72/321; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/951; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10S; Y10S438/00; Y10S438/926; Y10S438/928
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
63 words
A method of enhancing adhesion of a semiconductor die with a mold compound, comprising: depositing a layer of at least one substantially oxide-free metal directly on at least a portion of a back side of a die; and encapsulating at least a portion of the back side of the die bearing the at least one substantially oxide-free metal layer with a mold compound.
Claim 2
Independent Claim
63 words
A method of enhancing adhesion of a semiconductor die with a mold compound, comprising: depositing a layer of at least one substantially oxide-free metal directly on at least a portion of a back side of a die; and encapsulating at least a portion of the back side of the die bearing the at least one substantially oxide-free metal layer with a mold compound.
Claim 3
Dependent Claim
10 words
The method of claim 1, wherein said depositing includes electroplating.
Claim 4
Dependent Claim
11 words
The method of claim 1, wherein said depositing includes electroless coating.
Claim 5
Dependent Claim
26 words
The method of claim 1, wherein said depositing includes depositing a plurality of metals, at least the last deposited of which comprises a substantially oxide-free metal.
Claim 6
Dependent Claim
22 words
The method of claim 1, further including selecting said at least one substantially oxide-free metal from the group comprising palladium and copper.
Claim 7
Dependent Claim
20 words
The method of claim 1, wherein said depositing is effected over an entirety of the back side of the die.
Claim 8
Dependent Claim
22 words
The method of claim 6, wherein said encapsulating is effected over the surface bearing the at least one substantially oxide-free metal layer.
Claim 9
Independent Claim
50 words
A method of enhancing adhesion of a semiconductor die with a mold compound, comprising: depositing at least one substantially oxide-free metal in contact with at least a portion of a back side of a die; and covering said at least a portion of the back side with a mold compound.
Claim 10
Independent Claim
50 words
A method of enhancing adhesion of a semiconductor die with a mold compound, comprising: depositing at least one substantially oxide-free metal in contact with at least a portion of a back side of a die; and covering said at least a portion of the back side with a mold compound.
Claim 11
Dependent Claim
10 words
The method of claim 8, wherein said depositing comprises electroplating.
Claim 12
Dependent Claim
11 words
The method of claim 8, wherein said depositing comprises electroless coating.
Claim 13
Dependent Claim
25 words
The method of claim 8, wherein said depositing comprises depositing a plurality of metals, at least the last of which comprises a substantially oxide-free metal.
Claim 14
Dependent Claim
19 words
The method of claim 8, further including selecting said at least one substantially oxide-free metal from palladium and copper.
Claim 15
Independent Claim
42 words
A method of enhancing adhesion of a semiconductor die with a mold compound, comprising: depositing at least one substantially oxide-free metal in contact with a surface of a die; and adhering a mold compound to said at least one substantially oxide-free metal.
Claim 16
Independent Claim
42 words
A method of enhancing adhesion of a semiconductor die with a mold compound, comprising: depositing at least one substantially oxide-free metal in contact with a surface of a die; and adhering a mold compound to said at least one substantially oxide-free metal.
Claim 17
Dependent Claim
10 words
The method of claim 13, wherein said depositing comprises electroplating.
Claim 18
Dependent Claim
11 words
The method of claim 13, wherein said depositing comprises electroless coating.
Claim 19
Dependent Claim
25 words
The method of claim 13, wherein said depositing comprises depositing a plurality of metals, at least the last of which comprises a substantially oxide-free metal.
Claim 20
Dependent Claim
19 words
The method of claim 13, further including selecting said at least one substantially oxide-free metal from palladium and copper.
Claim 21
Dependent Claim
24 words
The method of claim 13, wherein said adhering comprises covering at least a portion of the surface of the die with said mold compound.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-23 | 2003-11-22 | 2004-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-23 | 2007-11-22 | 2008-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-23 | 2011-11-22 | 2012-05-23 | $7700.00 | Window Closed / Lapsed |