US5402006A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound
Assignee: Texas Instruments Inc
•
Filing: 1992-11-10
•
Granted: 1995-03-28
•
Expires: 2012-11-10
Abstract
Abstract A semiconductor device (10) includes a semiconductor die (18) and a heat spreader (16) adjacent the semiconductor die (18) for carrying heat away from the semiconductor die (18). The heat spreader (16) has a copper core (30) and a cupric oxide coating (32) formed on at least a portion of the core (30). A plastic package (12) is molded onto the semiconductor die (18) and the heat spreader (16) for supporting the semiconductor die (18) and the heat spreader (16). The cupric oxide coating (32) enhances adhesion of the heat spreader (16) to the plastic package (12).
Inventors
- 👤 Bobby O'Donley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 11:39
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
80 words
A semiconductor device, comprising: a semiconductor die; a heat spreader adjacent said semiconductor die for carrying heat away from said semiconductor die, said heat spreader having a copper core and a cupric oxide coating formed on at least a portion of said core; and a plastic package molded onto said semiconductor die and said heat spreader for supporting said semiconductor die and said heat spreader, said cupric oxide coating for enhancing adhesion of said heat spreader to said plastic package.
Claim 2
Dependent Claim
80 words
A semiconductor device, comprising: a semiconductor die; a heat spreader adjacent said semiconductor die for carrying heat away from said semiconductor die, said heat spreader having a copper core and a cupric oxide coating formed on at least a portion of said core; and a plastic package molded onto said semiconductor die and said heat spreader for supporting said semiconductor die and said heat spreader, said cupric oxide coating for enhancing adhesion of said heat spreader to said plastic package.
Claim 3
Dependent Claim
17 words
The semiconductor device of claim 1 in which said heat spreader is attached to said semiconductor die.
Claim 4
Dependent Claim
19 words
The semiconductor device of claim 1, further comprising a die pad, said semiconductor die attached to said die pad.
Claim 5
Dependent Claim
17 words
The semiconductor device of claim 3 in which said heat spreader is bonded to said die pad.
Claim 6
Dependent Claim
27 words
The semiconductor device of claim 1 in which said plastic package is molded onto said heat spreader so that a surface of said heat spreader is exposed.
Claim 7
Dependent Claim
16 words
The semiconductor device of claim 1 in which said plastic package completely encapsulates said heat spreader.
Claim 8
Dependent Claim
18 words
The semiconductor device of claim 1 in which said cupric oxide coating is formed completely over said core.
Claim 9
Dependent Claim
30 words
The semiconductor device of claim 1, further comprising at least one lead electrically connected to said semiconductor die, said plastic package encapsulating a portion of said at least one lead.
Claim 10
Dependent Claim
47 words
The semiconductor device of claim 8 in which said at least one lead has a copper core with a cupric oxide coating formed over a portion of said copper core, said cupric oxide coating for enhancing adhesion of said at least one lead to said plastic package.
Claim 11
Dependent Claim
27 words
The semiconductor device of claim 8, further comprising a wire encapsulated in said plastic package for electrically connecting said at least one lead to said semiconductor die.
Claim 12
Dependent Claim
37 words
The semiconductor device of claim 8 in which said at least one lead includes a plurality of leads electrically connected to said semiconductor die, said plastic package encapsulating a portion of each of said plurality of leads.
Claim 13
Dependent Claim
39 words
The semiconductor device of claim 1 in which said cupric oxide coating includes a plurality of densely packed cupric oxide needles having a first end attached to said copper core and a second end spaced from said copper core.
Claim 14
Dependent Claim
91 words
A semiconductor device, comprising: a semiconductor die; at least one lead electrically connected to said semiconductor die, said at least one lead having a copper core and a cupric oxide coating formed on a portion of said core; and a plastic package molded onto said semiconductor die and said at least one lead for supporting said semiconductor die and said at least one lead, said at least one lead extending from said plastic package, said cupric oxide coating for enhancing adhesion of said at least one lead to said plastic package.
Claim 15
Dependent Claim
91 words
A semiconductor device, comprising: a semiconductor die; at least one lead electrically connected to said semiconductor die, said at least one lead having a copper core and a cupric oxide coating formed on a portion of said core; and a plastic package molded onto said semiconductor die and said at least one lead for supporting said semiconductor die and said at least one lead, said at least one lead extending from said plastic package, said cupric oxide coating for enhancing adhesion of said at least one lead to said plastic package.
Claim 16
Dependent Claim
19 words
The semiconductor device of claim 13, further comprising a die pad, said semiconductor die attached to said die pad.
Claim 17
Dependent Claim
16 words
The semiconductor device of claim 14 further comprising a heat spreader bonded to said die pad.
Claim 18
Dependent Claim
28 words
The semiconductor device of claim 13, further comprising a conductive wire encapsulated in said plastic package for electrically connecting said at least one lead to said semiconductor die.
Claim 19
Dependent Claim
35 words
The semiconductor device of claim 13 in which said at least one lead includes a plurality of leads electrically connected to said semiconductor die, each of said plurality of leads extending from said plastic package.
Claim 20
Dependent Claim
39 words
The semiconductor device of claim 13 in which said cupric oxide coating includes a plurality of densely packed cupric oxide needles having a first end attached to said copper core and a second end spaced from said copper core.
References Cited (Backward Citations)
US3469017A
Cited
US3783347A
Cited
US3902148A
Cited
US3790870A
Cited
US3829598A
Cited
US4129243A
Cited
US4159221A
Cited
US4189331A
Cited
US4256792A
Cited
US4360702A
Cited
US4541005A
Cited
US4480262A
Cited
US4650922A
Cited
US5225710A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-03-27 | 1998-09-26 | 1999-03-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-03-27 | 2002-09-26 | 2003-03-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-03-27 | 2006-09-26 | 2007-03-28 | $7700.00 | Window Closed / Lapsed |