US5225710A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Highly integrated electronic component with heat-conducting plate
Assignee: LSI Logic Products GmbH
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Filing: 1991-07-09
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Granted: 1993-07-06
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Expires: 2011-07-09
Abstract
Abstract A highly integrated electronic component comprised of a semiconductor body cast into a plastics enclosure. A multiplicity of metallic terminals protrude from the plastic enclosure, and a heat-conducting plate is cast into the plastic enclosure and is in surface contact with an underside of the semiconductor body. Good heat removal and an increase in the mechanical stability for the terminals are achieved by the heat-conducting plate being substantially planar and bearing both against the underside of the semiconductor body and against the underside of the terminals and by the upper side of the heat-conducting plate having a thin, electrically insulating layer.
Inventors
- 👤 Hugo Westerkamp
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:10
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
146 words
An electronic component comprising a semiconductor body cast into a plastic enclosure, multiple metallic terminals which for a substantial part of their lengths extend within the plastic enclosure and protrude with distal ends from the plastic enclosure and a heat-conducting plate which is cast into the plastic enclosure and is in surface contact with an underside of the semiconductor body, wherein the heat-conducting plate is substantially planar and bears against the underside of the semiconductor body and against the underside of the terminals essentially along the complete extension of the terminals within the enclosure so as to establish a planar support of the terminals, and wherein an upper side of the heat-conducting plate contains an electrically insulating layer, and wherein the heat-conducting plate contains through-openings arranged around the semiconductor body, and wherein the through-openings are of an elongate design and radially extended from the semiconductor body.
Claim 2
Dependent Claim
146 words
An electronic component comprising a semiconductor body cast into a plastic enclosure, multiple metallic terminals which for a substantial part of their lengths extend within the plastic enclosure and protrude with distal ends from the plastic enclosure and a heat-conducting plate which is cast into the plastic enclosure and is in surface contact with an underside of the semiconductor body, wherein the heat-conducting plate is substantially planar and bears against the underside of the semiconductor body and against the underside of the terminals essentially along the complete extension of the terminals within the enclosure so as to establish a planar support of the terminals, and wherein an upper side of the heat-conducting plate contains an electrically insulating layer, and wherein the heat-conducting plate contains through-openings arranged around the semiconductor body, and wherein the through-openings are of an elongate design and radially extended from the semiconductor body.
Claim 3
Dependent Claim
19 words
The electronic component as claimed in claim 1, wherein said insulating layer is formed by anodizing the heat-conducting plate.
Claim 4
Dependent Claim
24 words
The electronic component as claimed in claim 2, wherein said insulating layer formed by said anodizing has a minimum thickness of about 30 μ.
Claim 5
Dependent Claim
21 words
The electronic component as claimed in claim 1, wherein the through-openings are arranged in approximately even distribution around the semiconductor body.
Claim 6
Dependent Claim
25 words
The electronic component as claimed in claim 1, wherein said heat-conducting plate is not adhesively bonded to either of said semiconductor body and said terminals.
Claim 7
Dependent Claim
137 words
An electronic component comprising a semiconductor body cast into a plastic enclosure, multiple metallic terminals which for a substantial part of their lengths extend within the plastic enclosure and protrude with distal ends from the plastic enclosure and a heat-conducting plate which is cast into the plastic enclosure and is in surface contact with an underside of the semiconductor body, wherein the heat-conducting plate is substantially planar and bears against the underside of the semiconductor body and against the underside of the terminals essentially along the complete extension of the terminals within the enclosure so as to establish a planar support of the terminals, and wherein an upper side of the heat-conducting plate contains an electrically insulating layer, and wherein the heat-conducting plate is provided with embossed feet which extend to the underside of the plastic enclosure.
Claim 8
Dependent Claim
137 words
An electronic component comprising a semiconductor body cast into a plastic enclosure, multiple metallic terminals which for a substantial part of their lengths extend within the plastic enclosure and protrude with distal ends from the plastic enclosure and a heat-conducting plate which is cast into the plastic enclosure and is in surface contact with an underside of the semiconductor body, wherein the heat-conducting plate is substantially planar and bears against the underside of the semiconductor body and against the underside of the terminals essentially along the complete extension of the terminals within the enclosure so as to establish a planar support of the terminals, and wherein an upper side of the heat-conducting plate contains an electrically insulating layer, and wherein the heat-conducting plate is provided with embossed feet which extend to the underside of the plastic enclosure.
Claim 9
Dependent Claim
25 words
The electronic component as claimed in claim 6, wherein said heat-conducting plate is not adhesively bonded to either of said semiconductor body and said terminals.
Claim 10
Dependent Claim
19 words
The electronic component as claimed in claim 6, wherein said insulating layer is formed by anodizing the heat-conducting plate.
Claim 11
Dependent Claim
24 words
The electronic component as claimed in claim 8, wherein said insulating layer formed by said anodizing has a minimum thickness of about 30 μ.
Claim 12
Dependent Claim
150 words
An electronic component comprising a semiconductor body cast into a plastic enclosure, multiple metallic terminals which for a substantial part of their lengths extend within the plastic enclosure and protrude with distal ends from the plastic enclosure and a heat-conducting plate which is cast into the plastic enclosure and is in surface contact with an underside of the semiconductor body, wherein the heat-conducting plate is substantially planar and bears against the underside of the semiconductor body and against the underside of the terminals essentially along the complete extension of the terminals within the enclosure so as to establish a planar support of the terminals, and wherein an upper side of the heat-conducting plate contains an electrically insulating layer, and wherein the heat-conducting plate has a rectangular outer contour substantially coinciding with a rectangular shape of the plastic enclosure, wherein said plate is provided in each corner with diagonally running incisions.
Claim 13
Dependent Claim
150 words
An electronic component comprising a semiconductor body cast into a plastic enclosure, multiple metallic terminals which for a substantial part of their lengths extend within the plastic enclosure and protrude with distal ends from the plastic enclosure and a heat-conducting plate which is cast into the plastic enclosure and is in surface contact with an underside of the semiconductor body, wherein the heat-conducting plate is substantially planar and bears against the underside of the semiconductor body and against the underside of the terminals essentially along the complete extension of the terminals within the enclosure so as to establish a planar support of the terminals, and wherein an upper side of the heat-conducting plate contains an electrically insulating layer, and wherein the heat-conducting plate has a rectangular outer contour substantially coinciding with a rectangular shape of the plastic enclosure, wherein said plate is provided in each corner with diagonally running incisions.
Claim 14
Dependent Claim
32 words
The electronic component as claimed in claim 10, wherein the heat-conducting plate is extended up to side edges of the plastic enclosure by two webs bounding at least one of said incisions.
Claim 15
Dependent Claim
28 words
The electronic component as claimed in claim 11, wherein the webs are present at two diagonally opposite corners, wherein at the two other corners the webs are missing.
Claim 16
Dependent Claim
19 words
The electronic component as claimed in claim 10, wherein said insulating layer is formed by anodizing the heat-conducting plate.
Claim 17
Dependent Claim
24 words
The electronic component as claimed in claim 13, wherein said insulating layer formed by said anodizing has a minimum thickness of about 30 μ.
Claim 18
Dependent Claim
25 words
The electronic component as claimed in claim 10, wherein said heat-conducting plate is not adhesively bonded to either of said semiconductor body and said terminals.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-07-05 | 1997-01-04 | 1997-07-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-07-05 | 2001-01-04 | 2001-07-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-07-05 | 2005-01-04 | 2005-07-06 | $7700.00 | Window Closed / Lapsed |