Patent US6038133A successfully refreshed from Google Patents.
US6038133A
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Circuit component built-in module and method for producing the same
Assignee: Panasonic Holdings Corp
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Filing: 1998-11-20
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Granted: 2000-03-14
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Expires: 2018-11-20
Abstract
Abstract A circuit component built-in module of the present invention includes an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin, a plurality of wiring patterns formed on at least a principal plane of the insulating substrate, a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns, and an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns. Thus, a highly reliable circuit component built-in module having high-density circuit components can be obtained.
Inventors
- 👤 Seiichi Nakatani
- 👤 Kouichi Hirano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:41
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/182; H05K1/185; H05K1/186; H05K1/187; G; G06; G06F; G06F16/00; G06F16/90; G06F16/95; G06F16/958; H04; H04L; H04L69/00; H04L69/30; H04L69/32; H04L69/322; H04L69/329; H05K1/188; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/4617; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H10W74/00; H10W74/01; H10W74/10; H10W74/111; H10W74/114; H10W90/00; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K3/10; H05K3/20; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/4644; H05K3/4652; H05K3/4658; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W90/701; H10W90/721; H10W90/722; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089; Y10T156/109; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24893; Y10T428/24917
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
81 words
A circuit component built-in module comprising: an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed on at least a principal plane of the insulating substrate; a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns; and an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns.
Claim 2
Dependent Claim
81 words
A circuit component built-in module comprising: an insulating substrate formed of a mixture comprising 70 wt % to 95 wt % of an inorganic filler and a thermosetting resin; a plurality of wiring patterns formed on at least a principal plane of the insulating substrate; a circuit component arranged in an internal portion of the insulating substrate and electrically connected to the wiring patterns; and an inner via formed in the insulating substrate for electrically connecting the plurality of wiring patterns.
Claim 3
Dependent Claim
28 words
A circuit component built-in module according to claim 1, wherein the circuit component includes an active component, and the inner via is formed of a conductive resin composition.
Claim 4
Dependent Claim
24 words
A circuit component built-in module according to claim 1, wherein the wiring patterns are further formed in an internal portion of the insulating substrate.
Claim 5
Dependent Claim
22 words
A circuit component built-in module according to claim 1, wherein the circuit component is shielded from external air by the insulating substrate.
Claim 6
Dependent Claim
35 words
A circuit component built-in module according to claim 1, wherein the thermosetting resin comprises at least one thermosetting resin selected from the group consisting of an epoxy resin, a phenol resin and a cyanate resin.
Claim 7
Dependent Claim
37 words
A circuit component built-in module according to claim 1, wherein the inorganic filler comprises at least one inorganic filler selected from the group consisting of Al 2 O 3 , MgO, BN, AlN and SiO 2 .
Claim 8
Dependent Claim
24 words
A circuit component built-in module according to claim 1, wherein an average particle diameter of the inorganic filler is 0.1 μm to 100 μm.
Claim 9
Dependent Claim
31 words
A circuit component built-in module according to claim 1, wherein the wiring patterns comprise at least one conductive substance selected from the group consisting of copper and a conductive resin composition.
Claim 10
Dependent Claim
21 words
A circuit component built-in module according to claim 1, wherein the wiring patterns comprise lead frames formed by etching or stamping.
Claim 11
Dependent Claim
34 words
A circuit component built-in module according to claim 1, wherein the circuit component comprises at least one component selected from the group consisting of a chip resistor, a chip capacitor and a chip inductor.
Claim 12
Dependent Claim
36 words
A circuit component built-in module according to claim 1, wherein the mixture further comprises at least one additive selected from the group consisting of a dispersant, a coloring agent, a coupling agent and a releasing agent.
Claim 13
Dependent Claim
39 words
A circuit component built-in module according to claim 1, wherein the insulating substrate has a coefficient of linear expansion of 8×10 -6 /° C. to 20×10 -6 /° C. and a heat conductivity of 1 w/mK to 10 w/mK.
Claim 14
Dependent Claim
30 words
A circuit component built-in module according to claim 2, wherein the active component comprises a semiconductor bare chip, and the semiconductor bare chip is flip-chip bonded onto the wiring pattern.
Claim 15
Dependent Claim
45 words
A circuit component built-in module according to claim 2, wherein the conductive resin composition comprises metal particles of at least one metal selected from the group consisting of gold, silver, copper and nickel as a conductive component, and an epoxy resin as a resin component.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-03-14 | 2003-09-13 | 2004-03-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-03-14 | 2007-09-13 | 2008-03-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-03-14 | 2011-09-13 | 2012-03-14 | $7700.00 | Window Closed / Lapsed |