US5677045A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Laminate and multilayer printed circuit board
Assignee: Hitachi Ltd
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Filing: 1995-04-28
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Granted: 1997-10-14
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Expires: 2015-04-28
Abstract
Abstract A laminate capable of mounting semiconductor elements thereon; comprising an insulating layer which is constituted by a resin portion of sea-island structure and a woven reinforcement. The resin portion of sea-island structure is, for example, such that a resin as islands are dispersed in a resin as a matrix. Thus, the insulating layer exhibits a coefficient of thermal expansion of 3.0 DIFFERENCE 10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150 DIFFERENCE 300 ( DEG C.). Owing to these physical properties, thermal stresses which the laminate undergoes in packaging the semiconductor elements thereon can be reduced, so that the connections of the laminate with the semiconductor elements can be made highly reliable.
Inventors
- 👤 Akira Nagai
- 👤 Masatsugu Ogata
- 👤 Shuji Eguchi
- 👤 Masahiko Ogino
- 👤 Toshiaki Ishii
- 👤 Masanori Segawa
- 👤 Hiroyoshi Kokaku
- 👤 Ryo Moteki
- 👤 Ichiro Anjoh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:48
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/12; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/015; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0212; H05K2201/0275; H05K2201/029; H05K2201/06; H05K2201/068; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/23907; Y10T428/23986; Y10T428/24; Y10T428/24132; Y10T428/25; Y10T428/254; Y10T442/00; Y10T442/20; Y10T442/2041; Y10T442/2049; Y10T442/209; Y10T442/2123; Y10T442/30; Y10T442/3854; Y10T442/3919
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
91 words
A printed circuit board for mounting one or more semiconductor elements thereon, comprising at least one insulating layer exhibiting a coefficient of thermal expansion of 3.0-10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150°-300° C., said insulating layer comprising a resin portion of a sea-island structure and a woven reinforcement, said resin portion comprising a first resin and an organic compound filler dispersed in said resin, said organic compound filler being immiscible with said first resin and forming with said first resin a phase separation structure.
Claim 2
Dependent Claim
91 words
A printed circuit board for mounting one or more semiconductor elements thereon, comprising at least one insulating layer exhibiting a coefficient of thermal expansion of 3.0-10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150°-300° C., said insulating layer comprising a resin portion of a sea-island structure and a woven reinforcement, said resin portion comprising a first resin and an organic compound filler dispersed in said resin, said organic compound filler being immiscible with said first resin and forming with said first resin a phase separation structure.
Claim 3
Dependent Claim
50 words
The printed circuit board of claim 1 wherein said first resin comprises a thermosetting resin, and said organic compound filler comprises an organic compound selected from the group consisting essentially of a siloxane-containing compound, a polymer of a siloxane-containing compound, a fluorine-containing compound, and a polymer of a fluorine-containing compound.
Claim 4
Dependent Claim
18 words
The printed circuit board of claim 1 wherein said resin portion further comprises an inorganic filler dispersed therein.
Claim 5
Dependent Claim
49 words
The printed circuit board of claim 3 wherein said resin comprises a thermosetting resin, and said organic compound filler comprises an organic compound selected from the group consisting essentially of a siloxane-containing compound, a polymer of a siloxane-containing compound, a fluorine-containing compound, and a polymer of a fluorine-containing compound.
Claim 6
Dependent Claim
48 words
The printed circuit board of claim 1 wherein said first resin comprises a resin selected from the group consisting of epoxy resin, unsaturated polyester resin, epoxy-isocyanate resin, maleimide resin, maleimide-epoxy resin, cyanate-ester resin, cyanate-ester-epoxy resin, cyanate-ester-maleimide resin, phenolic resin, diallyl-phthalate resin, urethane resin, cyanamide resin, and maleimide-cyanamide resin.
Claim 7
Dependent Claim
51 words
The printed circuit board of claim 1 wherein said organic compound filler comprises a second resin selected from the group consisting essentially of a polymer of perfluoro-ether, poly-tetrafluoro-ethylene, copolymers of poly-tetrafluoroethylene and perfluoro-alkylvinyl-ether, a copolymer of tetrafluoroethylene and hexafluoro-propane, polychlorotrifluoro-ethylene, a copolymer of ethylene and tetrafluoro-ethylene, polyvinylidene fluoride, and polyvinyl fluoride.
Claim 8
Dependent Claim
25 words
The printed circuit board of claim 6 wherein said first resin comprises an epoxy resin, and said organic compound filler comprises a polymer of perfluoro-ether.
Claim 9
Dependent Claim
94 words
A printed circuit board for mounting one or more semiconductor elements thereon, comprising at least one insulating layer exhibiting a coefficient of thermal expansion of 3.0-10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150°-300° C., said insulating layer comprising a resin portion of a sea-island structure and a woven reinforcement, said resin portion comprising a first resin and a second resin of an organic compound dispersed in said first resin, said second resin being immiscible with said first resin and forming with said first resin a phase separation structure.
Claim 10
Dependent Claim
94 words
A printed circuit board for mounting one or more semiconductor elements thereon, comprising at least one insulating layer exhibiting a coefficient of thermal expansion of 3.0-10 (ppm/K) in a planar direction thereof and a glass transition temperature of 150°-300° C., said insulating layer comprising a resin portion of a sea-island structure and a woven reinforcement, said resin portion comprising a first resin and a second resin of an organic compound dispersed in said first resin, said second resin being immiscible with said first resin and forming with said first resin a phase separation structure.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-10-13 | 2001-04-14 | 2001-10-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-10-13 | 2005-04-14 | 2005-10-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-10-13 | 2009-04-14 | 2009-10-14 | $7700.00 | Window Closed / Lapsed |