Multilayer printed circuit board

Abstract

Abstract PURPOSE:To mount a LCC type electronic component which can be mounted in high density but is difficult to absorb a stress at a soldered part with high reliability without solder isolation by pressuring, heating and laminating a prepreg and a surface layer copper foil through an elastic layer. CONSTITUTION:Prepregs 22 are laminated on both side faces of an inner layer circuit board 21 formed in a predetermined pattern of a copper foil 1, elastic layers 24 made of porous fluorine resin are interposed between the prepreg 22 and the surface layer copper foil 23, pressurized, heated and laminated. The elastic layer 24 is formed by coating the surface of porous fluorine resin 25 having 300mum of thickness with resin 26 made of heat curable epoxy resin of a stage B of the same material as that of the prepreg with 10mum of thickness. Since the porous fluorine resin has a small elastic modulus and is easy to absorb a stress so as to absorb the stress applied to a soldered part, the solder crack of the soldered position of the soldered part to the electrode of a LCC type electronic component is eliminated to be mounted in high reliability.

Inventors

• 👤 Shigeru Tomizawa
• 👤 富沢　茂
• 👤 Takao Kobayashi
• 👤 隆雄 小林
• 👤 Kazuhiro Shoji
• 👤 荘司　和宏
• 👤 Makoto Fujikawa
• 👤 誠 藤川

Bibliographic Details