US5651179A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for mounting a semiconductor device on a circuit board
Assignee: Panasonic Holdings Corp
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Filing: 1996-10-15
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Granted: 1997-07-29
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Expires: 2016-10-15
Abstract
Abstract A method for mounting a semiconductor device on a circuit board which includes the steps of: joining a terminal electrode of the semiconductor device to a connecting electrode of the circuit board by means of a thermoplastic conductive adhesive; allowing a thermosetting resin to fill a gap between the semiconductor device and the circuit board; and curing the thermosetting resin at a temperature equal to or higher than the plasticizing temperature of the thermoplastic conductive adhesive is disclosed.
Inventors
- 👤 Yoshihiro Bessho
- 👤 Yoshihiro Tomura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 18:51
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/071; H10W72/072; H10W72/073; H10W72/251; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49155
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
75 words
A method for mounting a semiconductor device on a circuit board, comprising the steps of: joining a terminal electrode of the semiconductor device to a connecting electrode of the circuit board by means of a thermoplastic conductive adhesive; allowing a thermosetting resin to fill a gap between the semiconductor device and the circuit board; and curing the thermosetting resin at a temperature equal to or higher than a plasticizing temperature of the thermoplastic conductive adhesive.
Claim 2
Independent Claim
75 words
A method for mounting a semiconductor device on a circuit board, comprising the steps of: joining a terminal electrode of the semiconductor device to a connecting electrode of the circuit board by means of a thermoplastic conductive adhesive; allowing a thermosetting resin to fill a gap between the semiconductor device and the circuit board; and curing the thermosetting resin at a temperature equal to or higher than a plasticizing temperature of the thermoplastic conductive adhesive.
Claim 3
Dependent Claim
32 words
A method according to claim 1, further comprising the step of forming a bump electrode on the terminal electrode of the semiconductor device, the step being performed prior to the joining step.
Claim 4
Dependent Claim
19 words
A method according to claim 1, wherein the thermoplastic conductive adhesive contains a thermoplastic resin and a conductive filler.
Claim 5
Dependent Claim
28 words
A method according to claim 1, wherein the thermosetting resin has a glass transition point equal to or higher than the maximum operating temperature for the semiconductor device.
Claim 6
Dependent Claim
28 words
A method according to claim 1, wherein the plasticizing temperature of the thermoplastic conductive-adhesive is equal to or higher than the maximum operating temperature for the semiconductor device.
Claim 7
Dependent Claim
30 words
A method according to claim 1, wherein the temperature at which the thermosetting resin is cured is equal to or higher than the maximum operating temperature for the semiconductor device.
Claim 8
Dependent Claim
22 words
A method according to claim 1, wherein the thermoplastic conductive adhesive has a plasticizing temperature equal to or higher than 125° C.
Claim 9
Dependent Claim
16 words
A method according to claim 1, wherein the thermosetting resin is cured at about 150° C.
Claim 10
Dependent Claim
21 words
A method according to claim 8, wherein the plasticizing temperature of the thermoplastic conductive adhesive is less than about 150° C.
Claim 11
Dependent Claim
24 words
A method according to claim 8, wherein the plasticizing temperature of the thermoplastic conductive adhesive is equal to or less than about 130° C.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-07-28 | 2001-01-27 | 2001-07-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-07-28 | 2005-01-27 | 2005-07-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-07-28 | 2009-01-27 | 2009-07-29 | $7700.00 | Window Closed / Lapsed |