US4814040A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of connecting electronic element to base plate
Assignee: Sharp Corp
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Filing: 1988-03-29
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Granted: 1989-03-21
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Expires: 2008-03-29
Abstract
Abstract An electronic element is connected to a base plate provided with a metallic pattern and a conductive resist layer superposed thereon by a thermal compression process with an adhesive layer sandwiched between the element and the base plate. The adhesive layer contains many metallic particles which are larger than the layer thickness of the resist such that these metallic particles penetrate the resist layer and invade the metallic pattern by the thermal compression process.
Inventors
- 👤 Kazuhito Ozawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 16:15
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; H01; H01R; H01R4/00; H01R4/04; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/023; H05K2201/03; H05K2201/032; H05K2201/0323; H05K2201/0332; H05K2201/0335; H05K2201/035; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0522; H05K2203/0562; H05K2203/0571; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K2203/11; H05K2203/1189; H05K3/02; H05K3/06; H05K3/061; H05K3/36; H05K3/361; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
90 words
A method of connecting an electronic element to a base plate comprising the steps of forming a conductive pattern on said base plate and a conductive resist layer superposingly on said conductive pattern, placing a connecting means between said base plate and said electronic element, said connecting means comprising an adhesive layer having metallic particles dispersed therethrough, said metallic particles being larger than the layer thickness of said resist layer, and thermal compression of said base plate and said electronic element against each other with said connecting means sandwiched therebetween.
Claim 2
Independent Claim
90 words
A method of connecting an electronic element to a base plate comprising the steps of forming a conductive pattern on said base plate and a conductive resist layer superposingly on said conductive pattern, placing a connecting means between said base plate and said electronic element, said connecting means comprising an adhesive layer having metallic particles dispersed therethrough, said metallic particles being larger than the layer thickness of said resist layer, and thermal compression of said base plate and said electronic element against each other with said connecting means sandwiched therebetween.
Claim 3
Dependent Claim
27 words
The method of claim 1 wherein said step of thermal compression is carried out with pressure of 20-60 kg/cm 2 at temperature 130-180° C. for 5-10 seconds.
Claim 4
Dependent Claim
29 words
The method of claim 1 wherein said step of thermal compression is carried out such that said metallic particles penetrate said conductive resist layer and invade sai conductive pattern.
Claim 5
Dependent Claim
40 words
The method of claim 1 wherein said base plate comprises a polyester film, said conductive pattern is formed from an aluminum foil and is about 9 μm in thickness and said conductive resist layer is about 10-15 μm in thickness.
Claim 6
Dependent Claim
20 words
The method of claim 4 wherein said connecting means is shaped like a tape, having thickness of about 10-30 μm.
Claim 7
Dependent Claim
18 words
The method of claim 5 wherein said metallic particles comprise Ni and are about 30-40 μm in size.
Claim 8
Dependent Claim
14 words
The method of claim 4 wherein said conductive resist layer comprises thermosetting carbon ink.
Claim 9
Dependent Claim
21 words
The method of claim 1 wherein said conductive pattern is formed by etching an aluminum foil formed on said base plate.
Claim 10
Dependent Claim
24 words
The method of claim 1 wherein said conductive pattern comprises a low-resistance metallic paste material and is deposited on said base plate by printing.
Claim 11
Dependent Claim
22 words
The method of claim 8 wherein said conductive resist layer is formed by printing a conductive paste material on said conductive pattern.
References Cited (Backward Citations)
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1992-03-20 | 1992-09-19 | 1993-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-03-20 | 1996-09-19 | 1997-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-03-20 | 2000-09-19 | 2001-03-21 | $7700.00 | Window Closed / Lapsed |