Electronic device pad relocation, precision placement, and packaging in arrays

Claim 2

An array of closely-spaced devices comprising: a plurality of electrical devices, each electrical device including top interconnection pads on a front major surface, an electrically insulating layer on the front major surface and a rear major surface, and a portion of at least one side surface, with openings in the insulating layer for access to the top interconnection pads, patterned metallization on the front and rear major surfaces and over the portion of at least one side surface forming bottom interconnection pads and alignment pads on the rear major surface, the bottom interconnection pads electrically connected to corresponding top interconnection pads by metallization extending over the electrically insulating layer on the portion of the at least one side surface; and a multi-chip module having a high density interconnect overcoat structure with at least two electrical connection pads positioned for mating with the alignment pads and a rigid alignment structure projecting from the multi-chip module for mechanical engagement with the electrical devices and providing accurate position alignment.

Claim 3

The array of claim 1, further including solder for attaching the alignment pads of the electrical devices to the at least two electrical connection pads of the multi-chip module.

Claim 4

The array of claim 1, wherein the rigid alignment structure comprises a set of pins or a grid-like structure.

Claim 5

An array of closely-spaced imaging or display devices comprising: a plurality of imaging or display devices, each device including top interconnection pads on a front major surface, an electrically insulating layer on the front major surface and a rear major surface, and a portion of at least one side surface, with openings in the insulating layer for access to the top interconnection pads, patterned metallization on the front and rear major surfaces and over the portion of at least one side surface forming bottom interconnection pads and alignment pads on the rear major surface, the bottom interconnection pads electrically connected to corresponding top interconnection pads by metallization extending over the electrically insulating layer on the portion of the at least one side surface; an optically transparent substrate, the devices being positioned front major surface down on the optically transparent substrate; and a multilayer interconnect structure overlying the rear major surfaces of the devices in electrical connection with the bottom interconnection pads.

Claim 6

An array of closely-spaced imaging or display devices comprising: a plurality of imaging or display devices, each device including top interconnection pads on a front major surface, an electrically insulating layer on the front major surface and a rear major surface, and a portion of at least one side surface, with openings in the insulating layer for access to the top interconnection pads, patterned metallization on the front and rear major surfaces and over the portion of at least one side surface forming bottom interconnection pads and alignment pads on the rear major surface, the bottom interconnection pads electrically connected to corresponding top interconnection pads by metallization extending over the electrically insulating layer on the portion of the at least one side surface; an optically transparent substrate, the devices being positioned front major surface down on the optically transparent substrate; and a multilayer interconnect structure overlying the rear major surfaces of the devices in electrical connection with the bottom interconnection pads.

Claim 7

The array of claim 4, wherein the optically transparent substrate is rigid.

Claim 8

The array of claim 4, wherein the optically transparent substrate comprises a stretched polymer film.

Claim 9

The array of claim 4, which further includes a molding material to fix the devices in place.

Claim 10

An array of closely-spaced devices comprising: a plurality of electrical devices, each electrical device including top interconnection pads on a front major surface, an electrically insulating layer on the front major surface and a rear major surface, and a portion of at least one side surface, with openings in the insulating layer for access to the top interconnection pads, patterned metallization on the front and rear major surfaces and over the portion of at least one side surface forming bottom interconnection pads and alignment pads on the rear major surface, the bottom interconnection pads electrically connected to corresponding top interconnection pads by metallization extending over the electrically insulating layer on the portion of the at least one side surface; a substrate comprising a stretched polymer film, the devices being positioned and attached front major surface down on the substrate; and a multilayer interconnect structure overlying the rear major surfaces of the devices in electrical connection with the bottom interconnection pads, the substrate and the multilayer interconnect structure being curved to establish an array curvature.

Claim 11

An array of closely-spaced devices comprising: a plurality of electrical devices, each electrical device including top interconnection pads on a front major surface, an electrically insulating layer on the front major surface and a rear major surface, and a portion of at least one side surface, with openings in the insulating layer for access to the top interconnection pads, patterned metallization on the front and rear major surfaces and over the portion of at least one side surface forming bottom interconnection pads and alignment pads on the rear major surface, the bottom interconnection pads electrically connected to corresponding top interconnection pads by metallization extending over the electrically insulating layer on the portion of the at least one side surface; a substrate comprising a stretched polymer film, the devices being positioned and attached front major surface down on the substrate; and a multilayer interconnect structure overlying the rear major surfaces of the devices in electrical connection with the bottom interconnection pads, the substrate and the multilayer interconnect structure being curved to establish an array curvature.

Claim 12

A array for a multi-device electronic package including a plurality of devices having major surfaces, with interconnection pads on one of the major surfaces, said array comprising: a substrate having a rigid alignment structure thereon projecting from the substrate for mechanical engagement with the devices, the devices being positioned and attached to the substrate with the interconnection pads facing up, whereby the rigid alignment structure provides accurate position alignment; and a multilayer interconnect structure overlying the devices and interconnecting selected ones of the interconnection pads.

Claim 13

A array for a multi-device electronic package including a plurality of devices having major surfaces, with interconnection pads on one of the major surfaces, said array comprising: a substrate having a rigid alignment structure thereon projecting from the substrate for mechanical engagement with the devices, the devices being positioned and attached to the substrate with the interconnection pads facing up, whereby the rigid alignment structure provides accurate position alignment; and a multilayer interconnect structure overlying the devices and interconnecting selected ones of the interconnection pads.

Claim 14

The array of claim 9, wherein the rigid alignment structure formed is a set of pins or a grid-like structure.