US4836435A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Component self alignment
Assignee: International Business Machines Corp
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Filing: 1988-06-06
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Granted: 1989-06-06
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Expires: 2008-06-06
Abstract
Abstract Alignment of leaded surface mount components to solder pads is enhanced by providing at least two soldered areas per lead, separated by a space of non-wettable material so that during component placement on the soldered areas there is a tendency for the components to self center as the leads fall between the raised soldered areas where they are retained during a reflow operation.
Inventors
- 👤 Duane T. Napp
- 👤 Kevin J. Roche
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 23:57
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K1/0266; H05K1/0268; H05K1/112; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09381; H05K2201/09654; H05K2201/09663; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2203/00; H05K2203/04; H05K2203/044; H05K2203/0455; H05K2203/048; H05K3/3465; H05K3/3468; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
82 words
An improved method of attaching leaded components to surface solder pads defining generally rectangular areas on an insulating substrate for printed circuitry comprising: dividing each solder pad surface area on the substrate surface into three sections; metalizing non-adjacent ones of said sections so as to provide two metalized sections per lead; depositing solder only on the metalized solder pad sections; placing components so that each of their leads is between and touching metalized sections on a solder pad; and reflowing the solder.
Claim 2
Dependent Claim
82 words
An improved method of attaching leaded components to surface solder pads defining generally rectangular areas on an insulating substrate for printed circuitry comprising: dividing each solder pad surface area on the substrate surface into three sections; metalizing non-adjacent ones of said sections so as to provide two metalized sections per lead; depositing solder only on the metalized solder pad sections; placing components so that each of their leads is between and touching metalized sections on a solder pad; and reflowing the solder.
Claim 3
Dependent Claim
13 words
The method of claim 1 wherein the metalizing step includes plating with copper.
Claim 4
Independent Claim
118 words
A method of improving leaded surface mountable component self alignment to solder pads, located at areas having a generally rectangular shape on an external insulating surface of a printed circuit substrate comprising: metalizing only non adjacent sections of the solder pad areas for providing two metalized sections per solder pad per component lead; separating the two metalized sections by a planar non metalized section narrower than a surface mountable component lead, of the insulating surface of the printed circuit substrate; depositing solder on the metalized sections by passing the printed circuit substrate over a solder wave; and locating components over the solder pad areas so that each lead rests touchingly between two metalized sections of a solder pad.
Claim 5
Independent Claim
118 words
A method of improving leaded surface mountable component self alignment to solder pads, located at areas having a generally rectangular shape on an external insulating surface of a printed circuit substrate comprising: metalizing only non adjacent sections of the solder pad areas for providing two metalized sections per solder pad per component lead; separating the two metalized sections by a planar non metalized section narrower than a surface mountable component lead, of the insulating surface of the printed circuit substrate; depositing solder on the metalized sections by passing the printed circuit substrate over a solder wave; and locating components over the solder pad areas so that each lead rests touchingly between two metalized sections of a solder pad.
Claim 6
Dependent Claim
18 words
The method of claim 1 wherein the depositing step includes passing the solder pads over a solder wave.
References Cited (Backward Citations)
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US3887760A
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US4494688A
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US4515304A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-06-05 | 1992-12-05 | 1993-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-06-05 | 1996-12-05 | 1997-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-06-05 | 2000-12-05 | 2001-06-06 | $7700.00 | Window Closed / Lapsed |