US3887760A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Layer circuit with at least one solder platform for the soldering on of semiconductor modules
Assignee: Siemens AG
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Filing: 1974-02-04
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Granted: 1975-06-03
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Expires: 1994-02-04
Abstract
Abstract A layer circuit arranged to receive semiconductor modules by soldering, the circuit having at least one conductor path extending therealong with a solder platform at one end of the conductor path. A layer is positioned transversely across the conductor path beyond the solder platform but extends across the conductor path less than the width of the path. This layer is incapable of tinning so that it separates the solder platform at the end of the conductor path from the remainder of the path by a relatively narrow constriction.
Inventors
- 👤 Friedrich Krieger
- 👤 Christian Stein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 22:04
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K3/3452; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/017; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09727; H05K2201/09818; H05K2201/0989; H05K2201/099; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10719; H05K2203/00; H05K2203/04; H05K2203/044; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
59 words
A layer circuit having at least one conductor path extending therealong, a platform of solder on one end of said conductor path, and a layer extending across part of said conductor path beyond said solder platform, said layer being not wettable by solder, thereby separating said solder platform from the remainder of said conductor path by a narrow constriction.
Claim 2
Dependent Claim
59 words
A layer circuit having at least one conductor path extending therealong, a platform of solder on one end of said conductor path, and a layer extending across part of said conductor path beyond said solder platform, said layer being not wettable by solder, thereby separating said solder platform from the remainder of said conductor path by a narrow constriction.
Claim 3
Dependent Claim
59 words
A layer circuit having at least one conductor path extending therealong, a platform of solder on one end of said conductor path, and a layer extending across part of said conductor path beyond said solder platform, said layer being not wettable by solder, thereby separating said solder platform from the remainder of said conductor path by a narrow constriction.
Claim 4
Dependent Claim
59 words
A layer circuit having at least one conductor path extending therealong, a platform of solder on one end of said conductor path, and a layer extending across part of said conductor path beyond said solder platform, said layer being not wettable by solder, thereby separating said solder platform from the remainder of said conductor path by a narrow constriction.
Claim 5
Dependent Claim
27 words
A layer circuit according to claim 1 in which said layer defines a substantially square area on said conductor path on which said platform of solder rests.
References Cited (Backward Citations)
US3495133A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-06-02 | 1978-12-02 | 1979-06-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-06-02 | 1982-12-02 | 1983-06-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-06-02 | 1986-12-02 | 1987-06-03 | $7700.00 | Window Closed / Lapsed |