Method and apparatus for transforming a substrate coordinate system into a wafer analysis tool coordinate system

Claim 3

The method of claim 1 wherein the substrate is a semiconductor wafer.

Claim 4

The method of claim 1 wherein the substrate is a cleaved portion of a semiconductor wafer.

Claim 5

The method of claim 3 further comprising the steps of: positioning a semiconductor wafer in a wafer marking tool; identifying a plurality of scribe line locations; scratching the surface of the semiconductor wafer at each scribe line location using a marking tip of said wafer marking tool; and breaking the wafer along said scribe lines to form said cleaved portion of said semiconductor wafer.

Claim 6

The method of claim 4 wherein a pair of orthogonal scribe lines respectively define an x axis and y axis of the cleaved portion.

Claim 7

The method of claim 1 wherein the transforming step further comprises the step of: performing a coordinate transformation in accordance with: ##EQU3## where: ##EQU4## where x 0 ,y 0 ,z 0 define coordinates of the substrate coordinate system and x l ,y l ,z l define the coordinates in the wafer analysis tool coordinate system.

Claim 8

The method of claim 1 wherein the first coordinate system is a two-dimensional coordinate system and the second coordinate system is a three-dimensional coordinate system.

Claim 11

The method of claim 8 wherein a pair of orthogonal scribe lines respectively define an x axis and y axis of the cleaved portion within the first coordinate system.

Claim 12

The method of claim 8 wherein the transforming step further comprises the step of: performing a coordinate transformation in accordance with: ##EQU5## where: ##EQU6## where x 0 ,y 0 ,z 0 define coordinates of the first coordinate system and x l ,y l ,z l define the coordinates in the second coordinate system.

Claim 13

Apparatus for transforming a first coordinate system associated with a substrate into a second coordinate system associated with a wafer analysis tool comprising: a computer that executes an instruction set that determines an angle at which the substrate is mounted within the wafer analysis tool, transforms the first coordinate system into a second coordinate system, and uses the transformed coordinate system to align the analysis tool with a particular location upon the substrate.

Claim 14

Apparatus for transforming a first coordinate system associated with a substrate into a second coordinate system associated with a wafer analysis tool comprising: a computer that executes an instruction set that determines an angle at which the substrate is mounted within the wafer analysis tool, transforms the first coordinate system into a second coordinate system, and uses the transformed coordinate system to align the analysis tool with a particular location upon the substrate.

Claim 15

The apparatus of claim 11 wherein the substrate is a semiconductor wafer.

Claim 16

The apparatus of claim 11 wherein the substrate is a cleaved portion of a semiconductor wafer.

Claim 17

The apparatus of claim 13 further comprising: a wafer marking tool having a marking tip, where said marking tool fiducializes the semiconductor wafer to define a first coordinate system, identifies a plurality of scribe line locations within the first coordinate system, scratches the surface of the semiconductor wafer at each scribe line location using said marking tip.

Claim 18

The method of claim 14 wherein a pair of orthogonal scribe lines respectively define an x axis and y axis of the cleaved portion.

Claim 19

The method of claim 11 wherein the computer performs a coordinate transformation in accordance with: ##EQU7## where: ##EQU8## where x 0 ,y 0 ,z 0 define coordinates of the first coordinate system and x l ,y l ,z l define the coordinates in the second coordinate system.

Claim 20

The method of claim 11 wherein the first coordinate system is a two-dimensional coordinate system and the second coordinate system is a three-dimensional coordinate system.

Claim 21

Apparatus for cleaving and analyzing a semiconductor wafer comprising: a wafer marking tool containing a marking tip, where said marking tool fiducializes the semiconductor wafer to define a first coordinate system, identifies a plurality of scribe line locations within the first coordinate system, scratches the surface of the semiconductor wafer at each scribe line location using said marking tip; means for breaking the semiconductor wafer along said scribe lines to form a cleaved portion of said semiconductor wafer; means for moving said cleaved portion to a wafer analysis tool; means for transferring the first coordinate system from said wafer marking tool to said wafer analysis tool; said wafer analysis tool containing a computer that executes an instruction set that determines an angle at which the substrate is mounted within the wafer analysis tool, transforms the first coordinate system into a second coordinate system, and uses the transformed coordinate system to align the analysis tool with a particular location upon the substrate.

Claim 22

Apparatus for cleaving and analyzing a semiconductor wafer comprising: a wafer marking tool containing a marking tip, where said marking tool fiducializes the semiconductor wafer to define a first coordinate system, identifies a plurality of scribe line locations within the first coordinate system, scratches the surface of the semiconductor wafer at each scribe line location using said marking tip; means for breaking the semiconductor wafer along said scribe lines to form a cleaved portion of said semiconductor wafer; means for moving said cleaved portion to a wafer analysis tool; means for transferring the first coordinate system from said wafer marking tool to said wafer analysis tool; said wafer analysis tool containing a computer that executes an instruction set that determines an angle at which the substrate is mounted within the wafer analysis tool, transforms the first coordinate system into a second coordinate system, and uses the transformed coordinate system to align the analysis tool with a particular location upon the substrate.