Patent US5977640A successfully refreshed from Google Patents.
US5977640A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Highly integrated chip-on-chip packaging
Assignee: International Business Machines Corp
•
Filing: 1998-06-26
•
Granted: 1999-11-02
•
Expires: 2018-06-26
Abstract
Abstract The advantages of the invention are realized by a chip-on-chip module having at least two fully functional chips, electrically connected together, and a chip-on-chip component connection/interconnection for electrically connecting the fully functional chips to external circuitry.
Inventors
- 👤 Claude Louis Bertin
- 👤 Thomas George Ference
- 👤 Wayne John Howell
- 👤 Edmund Juris Sprogis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 15:52
CPC Classifications
H; H10; H10W; H10W90/00; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/01; H10W72/0198; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/853; H10W72/859; H10W72/874; H10W72/884; H10W90/20; H10W90/22; H10W90/291; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
150 words
An apparatus comprising: a chip-on-chip module having at least two independent chips with active regions electrically connected together, wherein said active regions of said two chips are facing each other; and an interconnection substrate for electrically connecting said chips to external circuitry, the interconnection substrate including a first set of connection elements connected to the active regions of the chips, a second set of connection elements for connection to the external circuitry, and a substrate having conductive lines, the conductive lines connecting the first set of connection elements to the second set of connection elements; wherein the second set of connection elements includes a first set of connectors, planar with a first backside of one of the at least two chins, and a second set of connectors, planar with a second backside of another of the at least two chips, for connecting the chip-on-chip module to a second chip-on-chip module.
Claim 2
Independent Claim
150 words
An apparatus comprising: a chip-on-chip module having at least two independent chips with active regions electrically connected together, wherein said active regions of said two chips are facing each other; and an interconnection substrate for electrically connecting said chips to external circuitry, the interconnection substrate including a first set of connection elements connected to the active regions of the chips, a second set of connection elements for connection to the external circuitry, and a substrate having conductive lines, the conductive lines connecting the first set of connection elements to the second set of connection elements; wherein the second set of connection elements includes a first set of connectors, planar with a first backside of one of the at least two chins, and a second set of connectors, planar with a second backside of another of the at least two chips, for connecting the chip-on-chip module to a second chip-on-chip module.
Claim 3
Dependent Claim
15 words
The apparatus of claim 1, wherein the at least two chips are of different technologies.
Claim 4
Dependent Claim
12 words
The apparatus of claim 1, wherein said external circuitry is a leadframe.
Claim 5
Dependent Claim
27 words
The apparatus of claim 1, wherein the interconnection substrate is at least a same height as one of said at least two chips of said chip-on-chip module.
Claim 6
Dependent Claim
17 words
The apparatus of claim 1, wherein a plurality of the chip-on-chip modules are stackable upon one another.
Claim 7
Dependent Claim
14 words
The apparatus of claim 1, wherein the first set of connectors includes solder balls.
Claim 8
Dependent Claim
14 words
The apparatus of claim 1, wherein the second set of connectors includes metallurgical pads.
Claim 9
Dependent Claim
155 words
A chip-on-chip package comprising: an external component; a chip-on-chip module having at least two independent chips with active regions electrically connected together, wherein said active regions of said two chips are facing each other; and an interconnection substrate for electrically connecting said chips and said external component, the interconnection substrate including a first set of connection elements connected to the active regions of the chips, a second set of connection elements for connection to the external component, and a substrate having conductive lines, the conductive lines connecting the first set of connection elements to the second set of connection elements; wherein the second set of connection elements includes a first set of connectors, planar with a first backside of one of the at least two chips, and a second set of connectors, planar with a second backside of another of the at least two chips, for connecting the chip-on-chip module to a second chip-on-chip module.
Claim 10
Dependent Claim
155 words
A chip-on-chip package comprising: an external component; a chip-on-chip module having at least two independent chips with active regions electrically connected together, wherein said active regions of said two chips are facing each other; and an interconnection substrate for electrically connecting said chips and said external component, the interconnection substrate including a first set of connection elements connected to the active regions of the chips, a second set of connection elements for connection to the external component, and a substrate having conductive lines, the conductive lines connecting the first set of connection elements to the second set of connection elements; wherein the second set of connection elements includes a first set of connectors, planar with a first backside of one of the at least two chips, and a second set of connectors, planar with a second backside of another of the at least two chips, for connecting the chip-on-chip module to a second chip-on-chip module.
Claim 11
Dependent Claim
16 words
The chip-on-chip package of claim 8, wherein the at least two chips are of different technologies.
Claim 12
Dependent Claim
14 words
The chip-on-chip package of claim 8, wherein said external component has a pluggable connection.
Claim 13
Dependent Claim
18 words
The chip-on-chip package of claim 8, wherein a plurality of the chip-on-chip modules are stackable upon one another.
Claim 14
Dependent Claim
15 words
The chip-on-chip package of claim 8, wherein the first set of connectors includes solder balls.
Claim 15
Dependent Claim
15 words
The chip-on-chip package of claim 8, wherein the second set of connectors includes metallurgical pads.
References Cited (Backward Citations)
US4703483A
Cited
US5109320A
Cited
US5434453A
Cited
US5563773A
Cited
US5399898A
Cited
US5323060A
Cited
US5446247A
Cited
US5600541A
Cited
US5576519A
Cited
US5401672A
Cited
US5541449A
Cited
US5495394A
Cited
US5760478A
Cited
US5790384A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-01 | 2003-05-03 | 2003-11-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-01 | 2007-05-03 | 2007-11-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-01 | 2011-05-03 | 2011-11-02 | $7700.00 | Window Closed / Lapsed |