Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Claim 2

An electronic device comprising: a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, the at least one flip-chip pad of the first plurality of flip-chip pads being connected to at least one wire-bondable pad of the second plurality of wire-bondable pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon at least one flip-chip bump of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one pad of the second plurality of wire-bondable pads on the surface of the base.

Claim 3

The electronic device of claim 1 wherein the first plurality of flip-chip pads and the second plurality of wire-bondable pads are interconnected in a single layer of the base.

Claim 4

The electronic device of claim 1 wherein the base includes multiple layers, wherein the first plurality of flip-chip pads and the second plurality of wire-bondable pads are interconnected in a plurality of the layers of the base.

Claim 5

The electronic device of claim 1 wherein the base comprises a printed circuit board.

Claim 6

The electronic device of claim 1 wherein the first integrated circuit die and the second integrated circuit die are the same type of die and the first plurality of flip-chip bumps on the first integrated circuit die are arranged in a pattern identical to that of the bond pads on the second integrated circuit die.

Claim 7

A memory device comprising at least two electronic devices, each memory device including: a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads, the at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire-bondable pad of the second plurality of wire-bondable pads; a first integrated circuit memory chip having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon connected to the at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit memory chip having opposing front-side and back-side surfaces, the back-side surface attached to the back-side surface of the first integrated circuit memory chip and the front-side surface having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit memory chip and at least one pad of the second plurality of wire-bondable pads on the surface of the base.

Claim 8

A memory device comprising at least two electronic devices, each memory device including: a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads, the at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire-bondable pad of the second plurality of wire-bondable pads; a first integrated circuit memory chip having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon connected to the at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit memory chip having opposing front-side and back-side surfaces, the back-side surface attached to the back-side surface of the first integrated circuit memory chip and the front-side surface having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit memory chip and at least one pad of the second plurality of wire-bondable pads on the surface of the base.

Claim 9

The memory device of claim 6 wherein each electronic device is selected from a group comprising a Multi-Chip Module (MCM), a Single In-line Memory Module (SIMM), and a Dual In-line Memory Module (DIMM).

Claim 10

An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input device, the output device, and the memory devices, one of the input device, the output device, the memory device, and processor device comprising: a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, the first plurality of flip-chip pads connected to the wire-bondable pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon, at least one flip-chip bumps of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface attached to the back-side surface of the first integrated circuit die and the front-side surface having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one pad of the second plurality of wire-bondable pads on the surface of the base.

Claim 11

An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input device, the output device, and the memory devices, one of the input device, the output device, the memory device, and processor device comprising: a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, the first plurality of flip-chip pads connected to the wire-bondable pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon, at least one flip-chip bumps of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface attached to the back-side surface of the first integrated circuit die and the front-side surface having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one pad of the second plurality of wire-bondable pads on the surface of the base.

Claim 12

An electronic device comprising: a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to the first plurality of wire-bondable pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon and at least one flip-chip bumps of the first plurality of flip-chip bumps connected to at least one flip-chip pad of the second plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; a third integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the third integrated circuit die attached to the front-side surface of the second die and the front-side surface of the third integrated circuit die having a plurality of bond pads thereon; a first wire connected to at least one bond pad of the plurality of bond pads on the first surface of the second integrated circuit die and at least one wire-bondable pad of the second wire-bondable pads of the base; and a second wire connected to at least one bond pad of the plurality of bond pads on the first surface of the third integrated circuit die and at least one wire-bondable pad of the second wire-bondable pads of the base.

Claim 13

An electronic device comprising: a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to the first plurality of wire-bondable pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon and at least one flip-chip bumps of the first plurality of flip-chip bumps connected to at least one flip-chip pad of the second plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; a third integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the third integrated circuit die attached to the front-side surface of the second die and the front-side surface of the third integrated circuit die having a plurality of bond pads thereon; a first wire connected to at least one bond pad of the plurality of bond pads on the first surface of the second integrated circuit die and at least one wire-bondable pad of the second wire-bondable pads of the base; and a second wire connected to at least one bond pad of the plurality of bond pads on the first surface of the third integrated circuit die and at least one wire-bondable pad of the second wire-bondable pads of the base.

Claim 14

The electronic device of claim 9 wherein the first plurality of flip-chip pads and the second plurality wire-bondable pads are interconnected in a single layer of the base.

Claim 15

The electronic device of claim 9 wherein the base includes multiple layers, wherein the first plurality of flip-chip pads and the second plurality of wire-bondable pads are interconnected in a plurality of layers of the base.

Claim 16

The electronic device of claim 9 wherein the base comprises a printed circuit board.

Claim 17

An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input device, output device, and memory device, one of the input device, output device, memory device, and processor device comprising: a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire-bondable pad of the second plurality of wire-bondable pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon, at least one flip-chip bumps of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon a third integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the third integrated circuit die attached to the front-side surface of the second integrated circuit die and the front-side surface of the third integrated circuit die having a plurality of bond pads thereon; a first wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one wire-bondable pad of the second plurality of wire-bondable pads on the surface of the base; and a second wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the third integrated circuit die and at least one bond pad of the plurality of bond pads on the surface of the base.

Claim 18

An electronic system comprising an input device, an output device, a memory device, and a processor device coupled to the input device, output device, and memory device, one of the input device, output device, memory device, and processor device comprising: a base having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire-bondable pad of the second plurality of wire-bondable pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon, at least one flip-chip bumps of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon a third integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the third integrated circuit die attached to the front-side surface of the second integrated circuit die and the front-side surface of the third integrated circuit die having a plurality of bond pads thereon; a first wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one wire-bondable pad of the second plurality of wire-bondable pads on the surface of the base; and a second wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the third integrated circuit die and at least one bond pad of the plurality of bond pads on the surface of the base.

Claim 19

A base having a surface for carrying a first integrated circuit die having a plurality of flip-chip bumps on a front-side surface and having a back-side surface and a second integrated circuit die having a plurality of bond pads on a front-side surface and having a back-side surface, the base comprising: a first plurality of flip-chip pads arranged in a first pattern on the surface of the base, the first plurality of flip-chip pads connecting at least one flip-chip bump of the plurality of flip-chip bumps on the front-side surface of the first integrated circuit die carried on the surface of the base; and a second plurality of wire-bondable pads connected to the flip-chip pads and arranged in a pattern on the surface of the base, the wire-bondable pads and connected by a wire bonded to at least one bond pad of the second plurality of bond pads on the front-side surface of the second integrated circuit die carried on the back-side surface of the first integrated circuit die.

Claim 20

A base having a surface for carrying a first integrated circuit die having a plurality of flip-chip bumps on a front-side surface and having a back-side surface and a second integrated circuit die having a plurality of bond pads on a front-side surface and having a back-side surface, the base comprising: a first plurality of flip-chip pads arranged in a first pattern on the surface of the base, the first plurality of flip-chip pads connecting at least one flip-chip bump of the plurality of flip-chip bumps on the front-side surface of the first integrated circuit die carried on the surface of the base; and a second plurality of wire-bondable pads connected to the flip-chip pads and arranged in a pattern on the surface of the base, the wire-bondable pads and connected by a wire bonded to at least one bond pad of the second plurality of bond pads on the front-side surface of the second integrated circuit die carried on the back-side surface of the first integrated circuit die.

Claim 21

The base of claim 14 wherein the first plurality of flip-chip pads and the second plurality of wire-bondable pads are interconected in a singly layer of the base.

Claim 22

The base of claim 14 wherein the first plurality of flip-chip pads and the second plurality of wire-bondable pads are interconnected in multiple layers of the base.

Claim 23

An electronic device comprising: a printed circuit board having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire bondable pad of the second plurality of wire-bondable pads on the surface of the printed circuit board; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon and at least one flip-chip bump of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one wire-bondable pad of the second plurality of wire-bondable pads on the surface of the base.

Claim 24

An electronic device comprising: a printed circuit board having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire bondable pad of the second plurality of wire-bondable pads on the surface of the printed circuit board; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon and at least one flip-chip bump of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least one wire-bondable pad of the second plurality of wire-bondable pads on the surface of the base.

Claim 25

An electronic device comprising: a printed circuit board having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire-bondable pad of the second plurality of wire-bondable pads in multiple layers of the printed circuit board such that the second plurality of flip-chip pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon and at least one flip-chip bump of the plurality of flip-chip bumps connected to the at least one flip chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die in and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least wire-bondable pad on the surface of the base.

Claim 26

An electronic device comprising: a printed circuit board having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire-bondable pad of the second plurality of wire-bondable pads in multiple layers of the printed circuit board such that the second plurality of flip-chip pads; a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon and at least one flip-chip bump of the plurality of flip-chip bumps connected to the at least one flip chip pad of the first plurality of flip-chip pads on the surface of the base; a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die in and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon; and at least one wire connected to at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and at least wire-bondable pad on the surface of the base.