US5929475A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Capacitor for integrated circuit and its fabrication method
Assignee: Panasonic Holdings Corp
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Filing: 1995-12-15
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Granted: 1999-07-27
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Expires: 2015-12-15
Abstract
Abstract A method for fabricating a capacitor for an integrated circuit, comprising the steps of forming a titanium film for an adhesion layer over a substrate, forming a titanium dioxide film for a diffusion barrier layer by annealing the titanium film after ion-implantation of oxygen ion into a surface region of the titanium film so as to change titanium in the surface region to titanium dioxide, and forming a high dielectric constant capacitor on the titanium dioxide film.
Inventors
- 👤 Yasuhiro Uemoto
- 👤 Eigi Fujii
- 👤 Koji Arita
- 👤 Yoshihisa Nagano
- 👤 Yasuhiro Shimada
- 👤 Masamichi Azuma
- 👤 Atsuo Inoue
- 👤 Yasufumi Izutsu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:10
CPC Classifications
H; H10; H10B; H10B53/00; H10D; H10D1/00; H10D1/60; H10D1/68; H10D1/692; H10D1/696; H10D1/682; H10D1/684; H10D1/694; H10P; H10P14/00; H10P14/60; H10P14/63; H10P14/6302; H10P14/6304; H10P14/6314; H10P14/6326; H10P14/6328; H10P14/6329; H10P14/69; H10P14/692; H10P14/6938
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
97 words
A capacitor for an integrated circuit comprising: a substrate; an adhesion layer, selected from a group consisting of titanium and tantalum, formed over said substrate; a diffusion barrier layer of an oxide of said adhesion layer formed on said adhesion layer, said diffusion barrier layer being non-conductive, said diffusion barrier layer having a thickness of at least 50 nm; a bottom electrode of a noble metal formed on said diffusion barrier layer; a dielectric layer of a metal oxide formed on said bottom electrode; and a top electrode of a conductive metal formed on said dielectric layer.
Claim 2
Dependent Claim
97 words
A capacitor for an integrated circuit comprising: a substrate; an adhesion layer, selected from a group consisting of titanium and tantalum, formed over said substrate; a diffusion barrier layer of an oxide of said adhesion layer formed on said adhesion layer, said diffusion barrier layer being non-conductive, said diffusion barrier layer having a thickness of at least 50 nm; a bottom electrode of a noble metal formed on said diffusion barrier layer; a dielectric layer of a metal oxide formed on said bottom electrode; and a top electrode of a conductive metal formed on said dielectric layer.
Claim 3
Dependent Claim
20 words
The capacitor of claim 1, wherein said adhesion layer and said diffusion barrier layer comprise titanium and titanium dioxide, respectively.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-07-26 | 2003-01-25 | 2003-07-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-07-26 | 2007-01-25 | 2007-07-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-07-26 | 2011-01-25 | 2011-07-27 | $7700.00 | Window Closed / Lapsed |