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EP0609081A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Improved electrical connections to dielectric materials

Assignee: Texas Instruments Inc
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Filing: 1994-01-27
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Granted: —
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Expires: 2014-01-27
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Abstract

Abstract A preferred embodiment of this invention comprises an oxidizable layer (e.g. tantalum 48 ), an oxygen gettering layer (e.g. platinum/tantalum mixture 34 ) overlaying the oxidizable layer, a noble metal layer (e.g. platinum 36 ) overlaying the oxygen gettering layer, and a high-dielectric-constant material layer (e.g. barium strontium titanate 38 ) overlaying the noble metal layer. The novel structures presented provide electrical connection to high-dielectric-constant materials without the disadvantages of current structures. The oxygen gettering layer controls oxygen diffusion, minimizing the formation of a resistive layer either in the lower electrode or at the lower electrode/substrate interface. The oxygen gettering layer acts as a gettering site for oxygen, where the oxygen oxidizes the reactive metal portion of the layer, leaving the noble metal portion of the layer intact. While the oxides/suboxides (e.g. tantalum pentoxide 40 ) that are formed are resistive, they are dispersed within the noble metal matrix, leaving a conductive path from the top of the layer to the bottom. This invention provides a stable and electrically conductive electrode for high-dielectric-constant materials while using standard integrated circuit materials to facilitate and economize the manufacturing process.

Inventors

  • 👤 Bruce E. Gnade
  • 👤 Scott R. Summerfelt

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-30 09:05
CPC Classifications
H; H10; H10D; H10D1/00; H10D1/60; H10D1/68; H10D1/692; H10D1/696; H10P; H10P14/00; H10P14/40; H10P14/412; H10D1/682; H10D1/684; Y; Y10; Y10S; Y10S505/00; Y10S505/80; Y10S505/815; Y10S505/818; Y10T; Y10T29/00; Y10T29/43; Y10T29/435; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49128

Claims Analysis

Total Claims: 17
Claim 1
Independent Claim 69 words
A method of forming a microelectronic structure, said method comprising: forming an oxidizable layer; forming an oxygen gettering layer on said oxidizable layer which oxygen gettering layer getters diffusing oxygen, thus minimizing the formation of a oxidized resistive layer either in or on said oxidizable layer; forming a noble metal layer on said oxygen gettering layer; and forming a layer of a high-dielectric-constant material on said noble metal layer.
Claim 2
Dependent Claim 25 words
The method according to claim 1 , further comprising forming said oxygen gettering layer to be part of a final structure and least partially oxidized.
Claim 3
Dependent Claim 25 words
The method according to claim 1 , further comprising forming said oxygen gettering layer to be part of an intermediate structure and not substantially oxidized.
Claim 4
Independent Claim 19 words
The method according to any preceding claims, further comprising forming a electrically conductive layer on said high-dielectric-constant material layer.
Claim 5
Dependent Claim 35 words
The method according to claim 4 , further comprising selecting said electrically conductive layer from the group consisting of: titanium nitride, ruthenium dioxide, YBa₂Cu₃O 7-x , platinum, palladium, rhodium, gold, iridium, silver, and combinations thereof.
Claim 6
Independent Claim 47 words
The method according to any preceding claim, further comprising forming said oxygen gettering layer comprising a mixture of at least one noble metal and at least one reactive component, wherein the ratio of said noble metal to said reactive component is between about 99:1 and about 1:3.
Claim 7
Dependent Claim 66 words
The method according to claim 6 , further comprising forming oxygen gettering layer comprising said graded mixture of at least one noble metal and at least one reactive component, wherein said reactive component constitutes greater than 99% of said oxygen gettering layer near said oxidizable layer, and said reactive component transitions to constitute less than 1% of said oxygen gettering layer near said noble metal layer.
Claim 8
Independent Claim 27 words
The method according to any preceding claim, further comprising forming said noble metal from the group consisting of: platinum, palladium, rhodium, gold, iridium, silver, and combinations thereof.
Claim 9
Independent Claim 55 words
The method according to any of claims 6 to 8 , further comprising selecting said reactive component and said oxidisable layer from the group consisting of: tantalum, tungsten, titanium, molybdenum, titanium nitride, zirconium nitride, titanium silicide, tantalum silicide, tungsten silicide, molybdenum silicide, tantalum carbide, titanium boride, boron carbide, silicon, germanium, carbon, GaAs, and combinations thereof.
Claim 10
Independent Claim 36 words
The method according to any preceding claim, further comprising selecting said high-dielectric-constant material from the group consisting of: barium strontium titanate, barium titanate, strontium titanate, lead zirconium titanate, lead zinc niobate, tantalum pentoxide, and combinations thereof.
Claim 11
Independent Claim 13 words
The method according to any preceding claim for forming a microelectronic capacitor layer.
Claim 12
Dependent Claim 60 words
A microelectronic structure comprising: an oxidizable layer; an oxygen gettering layer overlaying said oxidizable layer; a noble metal layer overlaying said oxygen gettering layer; and a layer of a high-dielectric-constant material overlaying said noble metal layer, whereby said oxygen gettering layer getters diffusing oxygen, thus minimizing the formation of a oxidized resistive layer either in or on said oxidizable layer.
Claim 13
Dependent Claim 23 words
The structure of claim 12 , wherein said oxygen gettering layer is part of a final structure and is at least partially oxidized.
Claim 14
Dependent Claim 22 words
The structure of claim 12 , wherein said oxygen gettering layer is part of an intermediate structure and is not substantially oxidized.
Claim 15
Dependent Claim 24 words
The structure of any of claims 12 to 14 , wherein said structure further comprises an electrically conductive layer overlaying said high-dielectric-constant material layer.
Claim 16
Dependent Claim 48 words
The structure of any of claims 12 to 14 , wherein said oxygen gettering layer comprises a mixture of at least one noble metal and at least one reactive component wherein the ratio of said noble metal to said reactive component is between about 99:1 and about 1:3.
Claim 17
Dependent Claim 43 words
The structure of claim 16 , wherein said reactive component constitutes greater than 99% of said oxygen gettering layer near said oxidizable layer, and said reactive component transitions to constitute less than 1% of said oxygen gettering layer near said noble metal layer.

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