Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
152 words
An apparatus comprising: an integrated circuit (IC) chip having a chip area; a difference circuit; a plurality of dual cells each including a local sensor and a background sensor, the dual cells disposed in at least a portion of the chip area; at least one of the local sensors coupled to the difference circuit and providing a first input to the difference circuit, wherein the first input corresponds to a local temperature of the IC chip; selected ones of the background sensors collectively coupled to the difference circuit and providing a second input to the difference circuit, wherein the second input corresponds to a background temperature of the IC chip; and the difference circuit outputting a signal based on a difference between the first input and the second input, the difference corresponding to a temperature difference between the local temperature of the IC chip and the background temperature of the IC chip.
Claim 2
Independent Claim
152 words
An apparatus comprising: an integrated circuit (IC) chip having a chip area; a difference circuit; a plurality of dual cells each including a local sensor and a background sensor, the dual cells disposed in at least a portion of the chip area; at least one of the local sensors coupled to the difference circuit and providing a first input to the difference circuit, wherein the first input corresponds to a local temperature of the IC chip; selected ones of the background sensors collectively coupled to the difference circuit and providing a second input to the difference circuit, wherein the second input corresponds to a background temperature of the IC chip; and the difference circuit outputting a signal based on a difference between the first input and the second input, the difference corresponding to a temperature difference between the local temperature of the IC chip and the background temperature of the IC chip.
Claim 3
Dependent Claim
33 words
The apparatus of claim 1, wherein the difference circuit includes an adjustable threshold system, and wherein the signal output by the difference circuit is dependent on a setting of the adjustable threshold system.
Claim 4
Dependent Claim
45 words
The apparatus of claim 1, wherein the first input to the difference circuit is a current proportional to the local temperature of the IC chip, and the second input to the difference circuit is a current proportional to the background temperature of the IC chip.
Claim 5
Dependent Claim
44 words
The apparatus of claim 1, further including a circuit for selectively coupling a single one of the local sensors to the difference circuit, wherein the first input to the difference circuit corresponds to the local temperature at said single one of the local sensors.
Claim 6
Dependent Claim
21 words
The apparatus of claim 1, wherein said plurality of dual cells are distributed in an X/Y array across the IC chip.
Claim 7
Dependent Claim
45 words
The apparatus of claim 5, further including a circuit for selectively coupling one of the local sensors in said X/Y array to the difference circuit, wherein the first input to the difference circuit corresponds to the local temperature at said one of said local sensors.
Claim 8
Dependent Claim
30 words
The apparatus of claim 1, further including a circuit for summing an output of said selected ones of the background sensors to provide the second input to the difference circuit.
Claim 9
Dependent Claim
134 words
In combination, an integrated circuit chip and an apparatus for sensing the temperature of the integrated circuit chip comprising: a plurality of thermal sensors distributed on, and formed as a portion of, a surface of the integrated circuit chip, the plurality of thermal sensors including a plurality of local sensors each providing an output corresponding to a local temperature of the integrated circuit chip, and at least one background sensor for providing an output corresponding to a background temperature of the integrated circuit chip; and a circuit for comparing the output of a selected one of said plurality of local sensors to the output of the at least one background sensor to determine a temperature difference between the local temperature of the integrated circuit chip and the background temperature of the integrated circuit chip.
Claim 10
Dependent Claim
134 words
In combination, an integrated circuit chip and an apparatus for sensing the temperature of the integrated circuit chip comprising: a plurality of thermal sensors distributed on, and formed as a portion of, a surface of the integrated circuit chip, the plurality of thermal sensors including a plurality of local sensors each providing an output corresponding to a local temperature of the integrated circuit chip, and at least one background sensor for providing an output corresponding to a background temperature of the integrated circuit chip; and a circuit for comparing the output of a selected one of said plurality of local sensors to the output of the at least one background sensor to determine a temperature difference between the local temperature of the integrated circuit chip and the background temperature of the integrated circuit chip.
Claim 11
Dependent Claim
33 words
An apparatus according to claim 8, wherein the comparing circuit includes an adjustable threshold, and wherein the temperature difference output by the comparing circuit is dependent on a setting of the adjustable threshold.
Claim 12
Dependent Claim
62 words
The apparatus according to claim 8, wherein the output of each of said plurality of local sensors is a current proportional to the local temperature of the integrated circuit chip, and wherein said at least one background sensor comprises a plurality of background sensors, the collective output of which is a current proportional to the background temperature of the integrated circuit chip.
Claim 13
Dependent Claim
56 words
The apparatus of claim 8, further including a circuit for selectively coupling a single one of the plurality of local sensors to the comparing circuit, wherein the comparing circuit determines the temperature difference between the local temperature at said single one of the plurality of local sensors and the background temperature of the integrated circuit chip.
Claim 14
Dependent Claim
22 words
The apparatus of claim 8, wherein said plurality of thermal sensors are distributed in an X/Y array across the integrated circuit chip.
Claim 15
Dependent Claim
60 words
The apparatus of claim 12, further including a circuit for selectively coupling a single one of the plurality of local sensors in said X/Y array to said comparing circuit, wherein the comparing circuit determines the temperature difference between the local temperature at said single one of the plurality of local sensors and the background temperature of the integrated circuit chip.
Claim 16
Independent Claim
87 words
A method for sensing temperature variations on an integrated circuit chip including the steps of: determining a local temperature of the integrated circuit chip at a first plurality of locations; determining a background temperature of the integrated circuit chip by collectively measuring a temperature of the integrated circuit chip at a second plurality of locations; and, comparing the local temperature at said first plurality of locations with the background temperature, wherein the results of the comparing step correspond to the temperature variations on the integrated circuit chip.
Claim 17
Independent Claim
87 words
A method for sensing temperature variations on an integrated circuit chip including the steps of: determining a local temperature of the integrated circuit chip at a first plurality of locations; determining a background temperature of the integrated circuit chip by collectively measuring a temperature of the integrated circuit chip at a second plurality of locations; and, comparing the local temperature at said first plurality of locations with the background temperature, wherein the results of the comparing step correspond to the temperature variations on the integrated circuit chip.
Claim 18
Dependent Claim
38 words
The method according to claim 14, further including the step of: sequentially comparing the local temperature at each of said first plurality of locations with the background temperature to provide a temperature contour of said integrated circuit chip.
Claim 19
Dependent Claim
20 words
The method according to claim 15, further including the step of: displaying the temperature contour of said integrated circuit chip.
Claim 20
Dependent Claim
23 words
The method according to claim 16, wherein said displaying step displays regions of different temperatures on the integrated circuit chip in different colors.
Claim 21
Dependent Claim
55 words
The method according to claim 14, further including the steps of: determining whether the local temperature on an area of said integrated circuit chip exceeds the background temperature by a predetermined amount; and regulating an operating parameter of said integrated circuit chip to lower the local temperature in said area of said integrated circuit chip.
Claim 22
Dependent Claim
51 words
The method according to claim 14, wherein said step of determining a local temperature includes the step of: providing a local thermal sensor at each of said first plurality of locations, each local thermal sensor providing a signal corresponding to the local temperature at one of said first plurality of locations.
Claim 23
Dependent Claim
76 words
The method according to claim 14, wherein said step of determining a background temperature includes the steps of: providing a background thermal sensor at each of said second plurality of locations, each background thermal sensor providing a temperature signal corresponding to a temperature at one of said second plurality of locations; and combining the temperature signals provided by said background thermal sensors to provide a signal corresponding to the background temperature of said integrated circuit chip.
Claim 24
Dependent Claim
25 words
The method according to claim 14, further including the step of: performing said comparing step while operating the integrated circuit chip under actual operating conditions.