US4899180A
Expired / Lapsed
US
⏱️ 0.0 years remaining
On chip heater element and temperature sensor
Assignee: Xerox Corp
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Filing: 1988-04-29
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Granted: 1990-02-06
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Expires: 2008-04-29
Abstract
Abstract This bubblejet device has integrated into it a number of heater resistors and a temperature sensor which operate in conjunction with a temperature regulating circuit to heat the chip to its optimum operating temperature within seconds of turn-on, and thereafter maintain that temperature regardless of local temperature variations. The precise temperature regulation of the array improves print quality.
Inventors
- 👤 Abdul M. ElHatem
- 👤 Steven A. Buhler
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 03:49
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/005; B41J2/01; B41J2/015; B41J2/04; B41J2/045; B41J2/04501; B41J2/04541; B41J2/04563; B41J2/0458; B41J2/135; B41J2/14; B41J2002/14379
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
126 words
A thermal ink jet array device formed on a silicon substrate comprising: an array of ink jet channels, an ink inlet, connecting means for allowing ink to flow from said inlet to said ink jet channels, a sensor means for sensing the temperature of said device and for outputting a signal which is a function of the device temperature, said sensor means comprising a temperature sensing element, and a differential amplifier for outputting said signal which is a function of the temperature sensed by said sensing element, and means for heating coupled to said signal for heating said device, said channels, inlet and connecting means being cavities etched into said silicon substrate, and said sensor means and means for heating being integrated on said silicon substrate.
Claim 2
Dependent Claim
126 words
A thermal ink jet array device formed on a silicon substrate comprising: an array of ink jet channels, an ink inlet, connecting means for allowing ink to flow from said inlet to said ink jet channels, a sensor means for sensing the temperature of said device and for outputting a signal which is a function of the device temperature, said sensor means comprising a temperature sensing element, and a differential amplifier for outputting said signal which is a function of the temperature sensed by said sensing element, and means for heating coupled to said signal for heating said device, said channels, inlet and connecting means being cavities etched into said silicon substrate, and said sensor means and means for heating being integrated on said silicon substrate.
Claim 3
Dependent Claim
106 words
A thermal ink jet array device formed on a silicon substrate comprising: an array of ink jet channels, an ink inlet, connecting means for allowing ink to flow from said inlet to said ink jet channels, a sensor for sensing the temperature of said substrate and for outputting a signal which is a function of the device temperature, active electronic components integrated on said silicon device, and means for heating coupled to said signal for heating said device, said channels, inlet and connecting means being cavities etched into said silicon substrate, and said sensor, active components and means for heating being integrated on said silicon substrate.
Claim 4
Dependent Claim
106 words
A thermal ink jet array device formed on a silicon substrate comprising: an array of ink jet channels, an ink inlet, connecting means for allowing ink to flow from said inlet to said ink jet channels, a sensor for sensing the temperature of said substrate and for outputting a signal which is a function of the device temperature, active electronic components integrated on said silicon device, and means for heating coupled to said signal for heating said device, said channels, inlet and connecting means being cavities etched into said silicon substrate, and said sensor, active components and means for heating being integrated on said silicon substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-02-05 | 1993-08-07 | 1994-02-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-02-05 | 1997-08-07 | 1998-02-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-02-05 | 2001-08-07 | 2002-02-06 | $7700.00 | Window Closed / Lapsed |