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Method of making compound semiconductor light emitting device having evaporation preventing layer Alx Ga.sub.(1-x) N

Assignee: Sharp Corp
•
Filing: 1997-10-14
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Granted: 1999-02-02
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Expires: 2017-10-14
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Abstract

Abstract After the active layer including indium is formed, the evaporation preventing layer is formed at a temperature which does not cause liberation of indium. The p-type Al X Ga 1-X N (0≦X≦1) or the like is used for the evaporation preventing layer. Increasing the substrate temperature to as high as 1020° C. for forming the upper cladding layer does not cause liberation of indium from the active layer because the evaporation preventing layer is provided. As a result, the composition ratio of indium can be easily controlled and the high-quality active layer and the high-quality interface between the active layer and the upper cladding layer can be provided.

Inventors

  • 👤 Toshio Hata

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 16:39
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/81; H10H20/822; H10H20/824; H10H20/825; H10H20/01; H10H20/011; H10H20/013; H10H20/0133; H10H20/01335; H01; H01S; H01S5/00; H01S5/20; H01S5/22; H01S5/223; H01S5/2231; H01S5/30; H01S5/32; H01S5/323; H01S5/32308; H01S5/32341; Y; Y10; Y10S; Y10S148/00; Y10S148/095

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 84 words
A method of manufacturing a compound semiconductor light emitting device, comprising: a first step of forming a lower cladding layer; a second step of forming an active layer of Al X Ga Y In Z N (X+Y+Z=1, 0≦X·Y≦1 and 0<Z≦1) on said lower cladding layer at a first temperature; and a third step of forming an evaporation preventing layer of Al X Ga 1-X N (0≦X≦1) on said active layer at a second temperature which is equal to or lower than said first temperature.
Claim 2
Independent Claim 84 words
A method of manufacturing a compound semiconductor light emitting device, comprising: a first step of forming a lower cladding layer; a second step of forming an active layer of Al X Ga Y In Z N (X+Y+Z=1, 0≦X·Y≦1 and 0<Z≦1) on said lower cladding layer at a first temperature; and a third step of forming an evaporation preventing layer of Al X Ga 1-X N (0≦X≦1) on said active layer at a second temperature which is equal to or lower than said first temperature.
Claim 3
Independent Claim 111 words
A method of manufacturing a compound semiconductor light emitting device, comprising: a first step of forming a lower cladding layer; a second step of forming an active layer of Al XGa Y In Z N (X+Y+Z=1, 0≦X·Y≦1 and 0<Z≦1) on said lower cladding layer at a first temperature; a third step of forming an evaporation preventing layer of Al X Ga 1-X N (0≦X≦1) on said active layer at a second temperature which is equal to or higher than said first temperature; and a fourth step of forming an upper cladding layer on said evaporation preventing layer at a third temperature which is equal to or higher than said second temperature.
Claim 4
Independent Claim 111 words
A method of manufacturing a compound semiconductor light emitting device, comprising: a first step of forming a lower cladding layer; a second step of forming an active layer of Al XGa Y In Z N (X+Y+Z=1, 0≦X·Y≦1 and 0<Z≦1) on said lower cladding layer at a first temperature; a third step of forming an evaporation preventing layer of Al X Ga 1-X N (0≦X≦1) on said active layer at a second temperature which is equal to or higher than said first temperature; and a fourth step of forming an upper cladding layer on said evaporation preventing layer at a third temperature which is equal to or higher than said second temperature.
Claim 5
Independent Claim 79 words
A method of manufacturing a compound semiconductor light emitting device, comprising: a first step of forming a lower cladding layer; a second step of forming an active layer of Al X Ga Y In Z N (X+Y+Z=1, 0≦X·Y≦1 and 0<Z≦1) on said lower cladding layer at a first temperature; and a third step of forming an evaporation preventing layer of Al X Ga 1-X N (0≦X≦1) on said active layer at a temperature substantially equal to said first temperature.
Claim 6
Independent Claim 79 words
A method of manufacturing a compound semiconductor light emitting device, comprising: a first step of forming a lower cladding layer; a second step of forming an active layer of Al X Ga Y In Z N (X+Y+Z=1, 0≦X·Y≦1 and 0<Z≦1) on said lower cladding layer at a first temperature; and a third step of forming an evaporation preventing layer of Al X Ga 1-X N (0≦X≦1) on said active layer at a temperature substantially equal to said first temperature.

References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-02-01 2002-08-03 2003-02-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-02-01 2006-08-03 2007-02-02 $3760.00 Window Closed / Lapsed
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