Patent US5046482A successfully refreshed from Google Patents.
Patent US5847571A successfully refreshed from Google Patents.
US5847571A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Membrane probing of circuits
Assignee: Nidec SV Probe Pte Ltd
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Filing: 1996-07-03
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Granted: 1998-12-08
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Expires: 2016-07-03
Abstract
Abstract First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester. A probe frame is bonded to the substrate between connector frames bonded at opposite ends of the substrate. Alternatively, a pair of bumps exposed on the same surface of a flexible substrate are electrically connected at different positions along a conductive run. One of the bumps is oriented for contact with a pad of a die under test, and the other is in contact with a pad on a surface of a printed circuit board directed away from the die. The pad of the printed circuit board is provided for electrical connection to a tester.
Inventors
- 👤 Ken Kuang-Fu Liu
- 👤 Byoung-Youl Min
- 👤 Kunio Sano
- 👤 Takashi Sato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:20
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/0735
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
192 words
Apparatus for providing a conductive path from a pad of a die under test to a pad of a tester structure, said apparatus comprising: a generally rectangular flexible substrate having surfaces and bearing a conductive run; a first electrically conductive bump exposed on one of said surfaces and electrically connected at a first position along said conductive run, said first bump oriented for contact with said pad of said die under test; a second electrically conductive bump exposed on one of said surfaces and electrically connected at a second position along said conductive run, said second bump oriented for contact with said pad of said tester structure; said first bump and said second bump being exposed on the same one of said surfaces; a pair of connector frames bonded at opposite ends of said substrate, at least one of said connector frames enclosing an open region spanned by only a portion of said substrate including said second bump; and a probe frame bonded to said substrate at a position between said connector frames, said probe frame enclosing an open region spanned by only a portion of said substrate including said first bump.
Claim 2
Dependent Claim
192 words
Apparatus for providing a conductive path from a pad of a die under test to a pad of a tester structure, said apparatus comprising: a generally rectangular flexible substrate having surfaces and bearing a conductive run; a first electrically conductive bump exposed on one of said surfaces and electrically connected at a first position along said conductive run, said first bump oriented for contact with said pad of said die under test; a second electrically conductive bump exposed on one of said surfaces and electrically connected at a second position along said conductive run, said second bump oriented for contact with said pad of said tester structure; said first bump and said second bump being exposed on the same one of said surfaces; a pair of connector frames bonded at opposite ends of said substrate, at least one of said connector frames enclosing an open region spanned by only a portion of said substrate including said second bump; and a probe frame bonded to said substrate at a position between said connector frames, said probe frame enclosing an open region spanned by only a portion of said substrate including said first bump.
Claim 3
Dependent Claim
18 words
The apparatus of claim 1 wherein said probe frame is bonded to a center region of said substrate.
Claim 4
Dependent Claim
80 words
The apparatus of claim 1 further comprising: multiple conductive runs borne by said flexible substrate; multiple first bumps oriented for contact with multiple pads of said die under test, each of said first bumps being electrically connected at a first position along one of said conductive runs; and multiple said second bumps oriented for contact with multiple pads of said tester structure, each of said second bumps being electrically connected at a second position along one of said conductive runs.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-12-07 | 2002-06-08 | 2002-12-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-12-07 | 2006-06-08 | 2006-12-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-12-07 | 2010-06-08 | 2010-12-08 | $7700.00 | Window Closed / Lapsed |