US5830565A
Expired / Lapsed
US
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High planarity and low thermal coefficient of expansion base for semi-conductor reliability screening
Assignee: W.L. Gore and Associates Inc
•
Filing: 1996-11-08
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Granted: 1998-11-03
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Expires: 2016-11-08
Abstract
Abstract The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level burn-in (WLBI), diced die burn-in (DDBI), and packaged die burn-in (PDBI). The burn-in system includes a burn-in substrate with a planar base, a temporary Z-axis connecting member, and a Z-axis wafer level contact sheet electrically coupled to one another for screening wafers, diced die, and packaged electronic components, their assembly and use.
Inventors
- 👤 John J. Budnaitis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 02:13
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/69; H10W70/695; G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2855; G01R31/286; G01R31/2863; G01R31/2886; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12931; Y10T428/249921; Y10T428/249953; Y10T428/249987; Y10T442/00; Y10T442/30
Claims Analysis
Total Claims: 43
Claim 1
Independent Claim
18 words
A high planarity base, said base having a planarity of less than about 0.010 inches per linear foot.
Claim 2
Dependent Claim
18 words
A high planarity base, said base having a planarity of less than about 0.010 inches per linear foot.
Claim 3
Dependent Claim
30 words
The base according to claim 1, wherein said base has a coefficient of thermal expansion that matches the coefficient of thermal expansion of a semiconductor wafer +/-3 ppm ° C.
Claim 4
Dependent Claim
31 words
The base according to claim 1, wherein said base has a composite coefficient of thermal expansion that matches the coefficient of thermal expansion of a semiconductor wafer +/-3 ppm ° C.
Claim 5
Dependent Claim
55 words
The base according to claim 1, wherein said base includes a first and a second layer of a metal or metal alloy having a low coefficient of thermal expansion with each metal or metal alloy layer having machined surfaces to have a degree of planarity of between about 0.0001 and 0.01 inches per linear foot.
Claim 6
Dependent Claim
34 words
The base according to claim 4, wherein said metal or metal alloy layers are a nickel alloy and said base further includes a layer of copper between said first and second nickel alloy layers.
Claim 7
Dependent Claim
30 words
The base according to claim 5, wherein a first and a second adhesive dielectric layers are respectively disposed between said copper layer and said first and second nickel alloy layers.
Claim 8
Dependent Claim
16 words
The base according to claim 5, wherein said nickel alloy contains about 36 wt. % nickel.
Claim 9
Dependent Claim
27 words
The base according to claim 5, wherein said nickel alloy has a coefficient of thermal expansion of between about less than 1 to about 4 ppm/° C.
Claim 10
Dependent Claim
25 words
The base according to claim 6, wherein said first and second dielectric adhesive containing layers each have a T g of at least 200° C.
Claim 11
Dependent Claim
19 words
The base according to claim 6, wherein said dielectric layers include a porous polymer that support said adhesive material.
Claim 12
Dependent Claim
14 words
The base according to claim 10, wherein said porous polymer is a porous polyolefin.
Claim 13
Dependent Claim
16 words
The base according to claim 10, wherein said porous polymer is porous polypropylene or porous polyethylene.
Claim 14
Dependent Claim
16 words
The base according to claim 10, wherein said porous polymer is a woven or fibrous material.
Claim 15
Dependent Claim
13 words
The base according to claim 10, wherein said porous polymer is a fluoropolymer.
Claim 16
Dependent Claim
15 words
The base according to claim 14, wherein said porous fluoropolymer includes at least a polytetrafluoroethylene.
Claim 17
Dependent Claim
14 words
The base according to claim 14, wherein said porous fluoropolymer is an expanded polytetrafluoroethylene.
Claim 18
Dependent Claim
56 words
The base according to claim 4, wherein said metal or metal alloy layers have a combined thickness t 1 and a chemically distinct intermediate metal or metal alloy layer disposed therebetween which has a thickness t 2 , wherein a ratio t 1 to t 2 matches a coefficient of thermal expansion of a semiconductor wafer.
Claim 19
Dependent Claim
20 words
The base according to claim 4, wherein each of said metal or metal alloy layers is approximately 115 mils thick.
Claim 20
Dependent Claim
33 words
The base according to claim 17, wherein said ratio of said metal or metal alloy layers thickness to said intermediate layer thickness provides a coefficient of thermal expansion that matches a silicon wafer.
Claim 21
Dependent Claim
32 words
The base according to claim 17, wherein said thickness ratio provides a coefficient of thermal expansion that matches a wafer formed from germanium, silicon germanium, silicon carbide, gallium arsenide, selenium or tellurium.
Claim 22
Dependent Claim
24 words
The base according to claim 2, wherein said base has a planarity of less than or equal to about 0.001 inches per linear foot.
Claim 23
Dependent Claim
44 words
The base according to claim 6, wherein each of said dielectric layers has a thickness, when combined with said metal or metal alloy layers, has a coefficient of thermal expansion that matches the coefficient of thermal expansion of the wafer +/-3 ppm ° C.
Claim 24
Dependent Claim
17 words
The base according to claim 6, wherein each of said dielectric layers is approximately 0.021 inches thick.
Claim 25
Dependent Claim
25 words
The base according to claim 5, wherein said nickel alloy layers have a dimension of between about 6 inches×6 inches and about 20 inches×20 inches.
Claim 26
Dependent Claim
20 words
The base according to claim 10, wherein said porous polymer has a void volume of between about 30% and 90%.
Claim 27
Dependent Claim
14 words
The base according to claim 10, wherein said adhesive also contains a filler mixture.
Claim 28
Dependent Claim
24 words
The base according to claim 26, wherein said filler comprises at least 25 wt. % percent of the total weight of said dielectric layers.
Claim 29
Dependent Claim
27 words
The base according to claim 26, wherein said filler comprises between about 30 wt. % to 90 wt. % of the total weight of said dielectric layers.
Claim 30
Dependent Claim
27 words
The base according to claim 26, wherein said filler comprises between about 30 wt. % and 70 wt. % of the total weight of said dielectric layers.
Claim 31
Dependent Claim
12 words
The base according to claim 26, where said filler includes non-conductive carbon.
Claim 32
Dependent Claim
13 words
The base according to claim 30, wherein said non-conductive carbon is furnace black.
Claim 33
Dependent Claim
20 words
The base according to claim 26, wherein said filler includes SiO 2 prepared from the vapor combustion of molten silicon.
Claim 34
Dependent Claim
13 words
The base according to claim 32, wherein said filler also includes non-conductive carbon.
Claim 35
Dependent Claim
13 words
The base according to claim 33, wherein said non-conductive carbon is furnace black.
Claim 36
Dependent Claim
28 words
The base according to claim 26, wherein said filler includes TiO 2 or Al 2 O 3 respectively prepared from the vapor combustion of molten titanium and aluminum.
Claim 37
Dependent Claim
13 words
The base according to claim 6, wherein said adhesive is an epoxy resin.
Claim 38
Dependent Claim
13 words
The base according to claim 6, wherein said adhesive is an acrylic resin.
Claim 39
Dependent Claim
13 words
The base according to claim 6, wherein said adhesive is a urethane resin.
Claim 40
Dependent Claim
13 words
The base according to claim 6, wherein said adhesive is a silicone resin.
Claim 41
Dependent Claim
13 words
The base according to claim 6, wherein said adhesive is a polyimide resin.
Claim 42
Dependent Claim
14 words
The base according to claim 6, wherein said adhesive is a cyanate ester resin.
Claim 43
Dependent Claim
45 words
The base according to claim 6, wherein said adhesive includes a mixture of at least two adhesive components, where the adhesive component is selected from an epoxy resin, an acrylic resin, a urethane resin, a silicone resin, a polyimide resin or a cyanate ester resin.
References Cited (Backward Citations)
USRE26837E
Cited
US3609547A
Cited
US3953566A
Cited
US3736471A
Cited
US4133592A
Cited
US4540229A
Cited
US4482516A
Cited
US5315481A
Cited
US4530779A
Cited
US4705762A
Cited
US4683550A
Cited
US4733461A
Cited
US4654248A
Cited
US4840570A
Cited
EP0365275A2
Cited
US4985296A
Cited
US5034801A
Cited
US4963225A
Cited
US4968931A
Cited
US5007163A
Cited
US5440240A
Cited
US5252857A
Cited
US5541524A
Cited
US5461328A
Cited
US5380210A
Cited
US5437556A
Cited
US5428190A
Cited
US5532610A
Cited
WO1995012643A1
Cited
US5498467A
Cited
EP0704893A2
Cited
US5602491A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-02 | 2002-05-04 | 2002-11-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-02 | 2006-05-04 | 2006-11-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-02 | 2010-05-04 | 2010-11-03 | $7700.00 | Window Closed / Lapsed |