Patent US5789803A successfully refreshed from Google Patents.
US5789803A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package
Assignee: Round Rock Research LLC
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Filing: 1997-04-15
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Granted: 1998-08-04
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Expires: 2017-04-15
Abstract
Abstract A method for packaging a semiconductor die includes the steps of; attaching the die to a lead-on-chip (LOC) leadframe; electrically connecting bond pads on the die to lead fingers on the leadframe; forming a glob top on the bond pads and a portion of the lead fingers; and then trimming and forming the lead fingers into leads. The glob top protects the bond pads and leads and secures the leads to the die. In addition, the glob top leaves most of a face of the die exposed. The completed package has a small footprint which matches the peripheral shape of the die. During the packaging process a support structure such as a molded carrier ring can be formed on the leadframe to facilitate handling and testing of the singulated die.
Inventors
- 👤 Larry D. Kinsman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 07:29
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/048; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/075; H10W72/30; H10W72/321; H10W72/851; H10W72/853; H10W72/865; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
105 words
A semiconductor package comprising: a semiconductor die comprising a face having a peripheral outline and a bond pad on the face; a lead comprising a lead finger of a leadframe, said lead separated from the leadframe and attached to the face of the die; a wire bonded to the lead and to the bond pad; and an encapsulating material deposited on a portion of the face of the die to cover the bondpad, the wire, a portion of the lead, and an area on the face of the die less than the peripheral outline, while leaving a remainder of the die and the face exposed.
Claim 2
Dependent Claim
105 words
A semiconductor package comprising: a semiconductor die comprising a face having a peripheral outline and a bond pad on the face; a lead comprising a lead finger of a leadframe, said lead separated from the leadframe and attached to the face of the die; a wire bonded to the lead and to the bond pad; and an encapsulating material deposited on a portion of the face of the die to cover the bondpad, the wire, a portion of the lead, and an area on the face of the die less than the peripheral outline, while leaving a remainder of the die and the face exposed.
Claim 3
Dependent Claim
28 words
The package as claimed in claim 1 wherein the encapsulating material comprises a material selected from the group consisting of epoxy, silicone, room temperature vulcanizing materials and polyimide.
Claim 4
Dependent Claim
24 words
The package as claimed in claim 1 further comprising a support structure attached to the lead and configured to support the package for testing.
Claim 5
Dependent Claim
17 words
The package as claimed in claim 1 further comprising a molded carrier ring attached to the lead.
Claim 6
Dependent Claim
94 words
A semiconductor package comprising: a semiconductor die comprising a face and a bond pad; a lead comprising a separated lead finger of a lead-on-chip leadframe, said lead including a portion attached to the face of the die and a terminal portion electrically connected to the bond pad; a support structure attached to the lead, said support structure comprising a molded carrier ring; and an encapsulating material deposited on the face of the die to encapsulate the bond pad and the terminal portion of the lead, while leaving a remaining portion of the die exposed.
Claim 7
Dependent Claim
94 words
A semiconductor package comprising: a semiconductor die comprising a face and a bond pad; a lead comprising a separated lead finger of a lead-on-chip leadframe, said lead including a portion attached to the face of the die and a terminal portion electrically connected to the bond pad; a support structure attached to the lead, said support structure comprising a molded carrier ring; and an encapsulating material deposited on the face of the die to encapsulate the bond pad and the terminal portion of the lead, while leaving a remaining portion of the die exposed.
Claim 8
Dependent Claim
41 words
The package as claimed in claim 5 further comprising a wire bonded to the terminal portion of the lead and bonded to the bond pad to electrically connect the lead to the bond pad, said wire covered by the encapsulating material.
Claim 9
Dependent Claim
19 words
The package as claimed in claim 5 wherein said support structure is configured to support the package for testing.
Claim 10
Dependent Claim
19 words
The package as claimed in claim 5 wherein the support structure is configured for handling the package for testing.
Claim 11
Dependent Claim
14 words
The package as claimed in claim 5 wherein the support structure comprises epoxy novoloc.
Claim 12
Dependent Claim
96 words
A semiconductor package comprising: a semiconductor die comprising a face and a pattern of bond pads; a plurality of leads comprising separated lead fingers of a lead-on-chip leadframe, said leads including terminal portions and portions attached to the face of the die with an adhesive layer; a plurality of wires wire bonded to the bond pads and to the terminal portions of the leads; an encapsulating material deposited on the face of the die to encapsulate the bond pads, the wires and the terminal portions of the leads; and a support structure attached to the leads.
Claim 13
Dependent Claim
96 words
A semiconductor package comprising: a semiconductor die comprising a face and a pattern of bond pads; a plurality of leads comprising separated lead fingers of a lead-on-chip leadframe, said leads including terminal portions and portions attached to the face of the die with an adhesive layer; a plurality of wires wire bonded to the bond pads and to the terminal portions of the leads; an encapsulating material deposited on the face of the die to encapsulate the bond pads, the wires and the terminal portions of the leads; and a support structure attached to the leads.
Claim 14
Dependent Claim
16 words
The package as claimed in claim 10 wherein the support structure comprises a molded carrier ring.
Claim 15
Dependent Claim
18 words
The package as claimed in claim 10 wherein the support structure comprises adhesive tape applied to the leads.
Claim 16
Dependent Claim
29 words
The package as claimed in claim 10 wherein the encapsulating material comprises a first curable material formed as a dam and a second curable material deposited within the dam.
Claim 17
Dependent Claim
147 words
A semiconductor package comprising: a semiconductor die having a peripheral outline, said die comprising a face with a pattern of pads formed thereon; a plurality of leads attached to the die in electrical communication with the pads, each said lead comprising a separated lead finger from a lead-on-chip leadframe, each said lead comprising a first portion wire bonded to a pad on the die, a second portion attached to the face of the die with an adhesive, and a third portion formed in a desired configuration; a plurality of bond wires wired bonded to the pads on the die and to the terminal portions of the leads; and a curable material deposited on the face of the die to cover the bondwires, the pads on the die, the terminal portions of the leads, and an area on the face of the die less than the peripheral outline.
Claim 18
Dependent Claim
147 words
A semiconductor package comprising: a semiconductor die having a peripheral outline, said die comprising a face with a pattern of pads formed thereon; a plurality of leads attached to the die in electrical communication with the pads, each said lead comprising a separated lead finger from a lead-on-chip leadframe, each said lead comprising a first portion wire bonded to a pad on the die, a second portion attached to the face of the die with an adhesive, and a third portion formed in a desired configuration; a plurality of bond wires wired bonded to the pads on the die and to the terminal portions of the leads; and a curable material deposited on the face of the die to cover the bondwires, the pads on the die, the terminal portions of the leads, and an area on the face of the die less than the peripheral outline.
Claim 19
Dependent Claim
35 words
The package as claimed in claim 14 wherein the desired configuration of the third portions of the leads comprises a package configuration selected from the group consisting of gull wing, J-bend, butt joint and flat.
Claim 20
Dependent Claim
17 words
The package as claimed in claim 14 further comprising a molded carrier ring attached to the leads.
Claim 21
Dependent Claim
15 words
The package as claimed in claim 14 further comprising adhesive tape attached to the leads.
Claim 22
Dependent Claim
29 words
The package as claimed in claim 14 wherein the curable material comprises a first curable material formed as a dam and a second curable material deposited within the dam.
Claim 23
Dependent Claim
25 words
The package as claimed in claim 14 further comprising a substrate attached to the die, said substrate including connection points wire bonded to the leads.
Claim 24
Dependent Claim
132 words
An electrical assembly comprising: a supporting substrate including a plurality of connection points; a semiconductor package mounted to the supporting substrate in a chip on board configuration; said package including a semiconductor die comprising a face and a bond pad; said package further including a lead comprising a separated lead finger of a lead-on-chip leadframe, said lead including a portion attached to the face of the die and a terminal portion electrically connected to the bond pad; said package further including an encapsulating material deposited on the face of the die to encapsulate the bond pad and the terminal portion of the lead, while leaving a remaining portion of the die exposed; and a plurality of bond wires bonded to the connection points on the substrate and the leads on the package.
Claim 25
Dependent Claim
132 words
An electrical assembly comprising: a supporting substrate including a plurality of connection points; a semiconductor package mounted to the supporting substrate in a chip on board configuration; said package including a semiconductor die comprising a face and a bond pad; said package further including a lead comprising a separated lead finger of a lead-on-chip leadframe, said lead including a portion attached to the face of the die and a terminal portion electrically connected to the bond pad; said package further including an encapsulating material deposited on the face of the die to encapsulate the bond pad and the terminal portion of the lead, while leaving a remaining portion of the die exposed; and a plurality of bond wires bonded to the connection points on the substrate and the leads on the package.
Claim 26
Dependent Claim
16 words
The assembly as claimed in claim 20 wherein the supporting substrate comprises a printed circuit board.
Claim 27
Dependent Claim
24 words
The assembly as claimed in claim 20 wherein a plurality of packages are mounted to the supporting substrate to form a multi chip module.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-03 | 2002-02-02 | 2002-08-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-03 | 2006-02-02 | 2006-08-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-03 | 2010-02-02 | 2010-08-04 | $7700.00 | Window Closed / Lapsed |