US5432127A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads
Assignee: Texas Instruments Inc
•
Filing: 1993-12-02
•
Granted: 1995-07-11
•
Expires: 2013-12-02
Abstract
Abstract A method for electrically connecting a lead frame (10) to an integrated circuit (40). Each lead conductor (16) and (18) of the lead frame (10) has the identical geometric area in order to provide identical capacitances. A metal shield may be provided on to provide noise shielding for the integrated circuit (40). In addition, a power bus (12) and (14) is provided having false leads (24) and (26) to maintain equal capacitance.
Inventors
- 👤 Michael A. Lamson
- 👤 Katherine G. Heinen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 05:02
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/20; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10S; Y10S438/00; Y10S438/926; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
85 words
A method of providing electrical contact with an encapsulated integrated circuit comprising: orienting conductive leads extending from the encapsulated integrated circuit to the exterior, such that electrical signals may be provided to and from the integrated circuit; configuring said conductive leads with substantially identical geometric configurations to provide equal capacitances for each of said conductive leads; providing a power bus for supplying power to said integrated circuit; and configuring said power bus to include false leads to maintain the equal capacitance of said conductive leads.
Claim 2
Independent Claim
85 words
A method of providing electrical contact with an encapsulated integrated circuit comprising: orienting conductive leads extending from the encapsulated integrated circuit to the exterior, such that electrical signals may be provided to and from the integrated circuit; configuring said conductive leads with substantially identical geometric configurations to provide equal capacitances for each of said conductive leads; providing a power bus for supplying power to said integrated circuit; and configuring said power bus to include false leads to maintain the equal capacitance of said conductive leads.
Claim 3
Dependent Claim
21 words
The method of claim 1 and further comprising: providing a conductive shielding layer between said conductive leads and the integrated circuit.
Claim 4
Independent Claim
92 words
A method of forming an integrated circuit package comprising: disposing a conductive lead frame adjacent active portions of an integrated circuit; insulating said conductive lead frame from said integrated circuit; selectively interconnecting portions of the integrated circuit with portions of said lead frame; configuring and orienting said lead frame such that individual conductive leads have substantially identical capacitances; orienting a power bus adjacent said integrated circuit to provide electrical power thereto; and orienting portions of said power bus adjacent ones of said conductive leads to ensure equal capacitance of said conductive leads.
Claim 5
Independent Claim
92 words
A method of forming an integrated circuit package comprising: disposing a conductive lead frame adjacent active portions of an integrated circuit; insulating said conductive lead frame from said integrated circuit; selectively interconnecting portions of the integrated circuit with portions of said lead frame; configuring and orienting said lead frame such that individual conductive leads have substantially identical capacitances; orienting a power bus adjacent said integrated circuit to provide electrical power thereto; and orienting portions of said power bus adjacent ones of said conductive leads to ensure equal capacitance of said conductive leads.
Claim 6
Dependent Claim
20 words
The method of claim 3 and further providing a conductive layer adjacent said integrated circuit to provide shielding from noise.
Claim 7
Dependent Claim
137 words
A process of making a lead frame comprising: A. forming a plurality of juxtaposed elongated conductive leads to have geometrical areas substantially identical such that the capacitance presented by each of said leads is substantially identical, the forming conductive leads including forming the leads to have first ends for connecting to an integrated circuit and second ends for connecting to external circuits; and B. forming plural conductive power buses between the plurality of juxtaposed elongated conductive leads to have central portions generally perpendicular to the conductive leads and to have end lead portions with first ends connected to the central portions and second ends for connecting to external circuits, the end lead portions being formed with geometric areas substantially identical to the geometric areas of the leads to present equal capacitance for all of the conductive leads.
Claim 8
Dependent Claim
137 words
A process of making a lead frame comprising: A. forming a plurality of juxtaposed elongated conductive leads to have geometrical areas substantially identical such that the capacitance presented by each of said leads is substantially identical, the forming conductive leads including forming the leads to have first ends for connecting to an integrated circuit and second ends for connecting to external circuits; and B. forming plural conductive power buses between the plurality of juxtaposed elongated conductive leads to have central portions generally perpendicular to the conductive leads and to have end lead portions with first ends connected to the central portions and second ends for connecting to external circuits, the end lead portions being formed with geometric areas substantially identical to the geometric areas of the leads to present equal capacitance for all of the conductive leads.
Claim 9
Dependent Claim
26 words
The process of claim 5 in which forming the leads and the buses includes forming the leads and end portions to have substantially equal trapezoidal configurations.
Claim 10
Dependent Claim
32 words
The process of claim 5 in which forming the leads and buses includes forming the leads and end lead portions to have substantially equal trapezoidal configurations between the first and second ends.
Claim 11
Dependent Claim
165 words
A process of making a lead frame comprising: A. forming a plurality of juxtaposed elongated conductive leads to have geometrical areas substantially identical such that the capacitance presented by each of said leads is substantially identical, the forming conductive leads including forming the leads to have first ends for connecting to an integrated circuit and second ends for connecting to external circuits, the forming conductive leads including spacing groups of the conductive leads from one another; and B. forming plural conductive power buses between the plurality of juxtaposed elongated conductive leads to have central portions generally perpendicular to the conductive leads, to have false leads arranged in the spaces between the leads and to have end lead portions with first ends connected to the central portions and second ends for connecting to external circuits, the false leads and end lead portions being formed with geometric areas substantially identical to the geometric areas of the leads to present equal capacitance for all of the conductive leads.
Claim 12
Dependent Claim
165 words
A process of making a lead frame comprising: A. forming a plurality of juxtaposed elongated conductive leads to have geometrical areas substantially identical such that the capacitance presented by each of said leads is substantially identical, the forming conductive leads including forming the leads to have first ends for connecting to an integrated circuit and second ends for connecting to external circuits, the forming conductive leads including spacing groups of the conductive leads from one another; and B. forming plural conductive power buses between the plurality of juxtaposed elongated conductive leads to have central portions generally perpendicular to the conductive leads, to have false leads arranged in the spaces between the leads and to have end lead portions with first ends connected to the central portions and second ends for connecting to external circuits, the false leads and end lead portions being formed with geometric areas substantially identical to the geometric areas of the leads to present equal capacitance for all of the conductive leads.
Claim 13
Dependent Claim
28 words
The process of claim 8 including forming the false leads to be shorter than the leads and end lead portions with no ends for connection to external circuits.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-07-10 | 1999-01-09 | 1999-07-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-07-10 | 2003-01-09 | 2003-07-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-07-10 | 2007-01-09 | 2007-07-11 | $7700.00 | Window Closed / Lapsed |