Patent US5789271A successfully refreshed from Google Patents.
US5789271A
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Method for fabricating microbump interconnect for bare semiconductor dice
Assignee: Micron Technology Inc
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Filing: 1996-03-18
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Granted: 1998-08-04
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Expires: 2016-03-18
Abstract
Abstract A method for forming an interconnect for making a temporary or permanent electrical connection to a semiconductor dice is provided. The interconnect includes a rigid substrate on which an insulating layer and a pattern of conductors are formed. A compliant layer is formed on the insulating layer of a material such as polyimide. Vias are formed in the compliant layer with metal contacts in electrical communication with the conductors. Microbumps are formed on the compliant layer in electrical communication with the contacts and are adapted to flex with the compliant layer. The interconnect can be used to provide a temporary electrical connection for testing bare semiconductor dice. Alternately the interconnect can be used for flip chip mounting dice for fabricating multi chip modules and other electronic devices.
Inventors
- 👤 Salman Akram
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 14:41
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K3/00; H05K3/40; H05K3/4007; H10; H10W; H10W70/00; H10W70/099; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W90/00; H10W90/701; H05K1/0271; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/0137; H05K2201/0154; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0364; H05K2201/0367; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/095; H05K2201/09509; H05K2203/00; H05K2203/04; H05K2203/043; H05K3/10; H05K3/14; H05K3/143; H05K3/22; H05K3/28; H05K3/30; H05K3/32; H05K3/325; H05K3/34; H05K3/3465; H05K3/46; H05K3/4602; H05K3/4605; H05K3/4644; H05K3/4673; H05K3/4676; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
124 words
A method for fabricating an interconnect for testing semiconductor dice comprising: providing a substrate comprising silicon; forming a first layer on the substrate, the first layer comprising an electrically insulating material; forming a plurality of conductors on the first layer; forming a second layer on the conductors and on the first layer, the second layer comprising a polymeric material; forming a plurality of vias through the second layer to the conductors, the vias having a pattern matching pads on a semiconductor die; and forming metal microbumps in the vias in electrical communication with the conductors, the microbumps configured to electrically engage the pads on the die and to flex with the second layer to accommodate dimensional variations in the Dads or in the microbumps.
Claim 2
Independent Claim
124 words
A method for fabricating an interconnect for testing semiconductor dice comprising: providing a substrate comprising silicon; forming a first layer on the substrate, the first layer comprising an electrically insulating material; forming a plurality of conductors on the first layer; forming a second layer on the conductors and on the first layer, the second layer comprising a polymeric material; forming a plurality of vias through the second layer to the conductors, the vias having a pattern matching pads on a semiconductor die; and forming metal microbumps in the vias in electrical communication with the conductors, the microbumps configured to electrically engage the pads on the die and to flex with the second layer to accommodate dimensional variations in the Dads or in the microbumps.
Claim 3
Dependent Claim
39 words
The method of claim 1 further comprising placing the interconnect in a test apparatus configured to contain the die for testing, such that the second layer and the microbumps can flex in a Z-direction upon contact with the pads.
Claim 4
Dependent Claim
21 words
The method of claim 1 further comprising forming a protective layer on the microbump, the protective layer comprising an inert material.
Claim 5
Dependent Claim
24 words
The method of claim 1 wherein forming the metal microbumps comprises a process selected from the group consisting of electroless plating, and screen printing.
Claim 6
Independent Claim
119 words
A method for fabricating an interconnect for testing semiconductor dice comprising: providing a substrate comprising silicon; forming an electrically insulating first layer on the substrate; forming a plurality of conductors on the first layer; forming a second layer on the conductors and on the first layer, the second layer comprising a polymeric material; forming a plurality of vias through the second layer to the conductors, the vias having a pattern matching that of pads on a semiconductor die; electrolessly depositing metal microbumps in the vias in electrical communication with the conductors, the microbumps configured to electrically engage the pads on the die and to flex with the second layer to accommodate dimensional variations in the pads or the microbumps.
Claim 7
Independent Claim
119 words
A method for fabricating an interconnect for testing semiconductor dice comprising: providing a substrate comprising silicon; forming an electrically insulating first layer on the substrate; forming a plurality of conductors on the first layer; forming a second layer on the conductors and on the first layer, the second layer comprising a polymeric material; forming a plurality of vias through the second layer to the conductors, the vias having a pattern matching that of pads on a semiconductor die; electrolessly depositing metal microbumps in the vias in electrical communication with the conductors, the microbumps configured to electrically engage the pads on the die and to flex with the second layer to accommodate dimensional variations in the pads or the microbumps.
Claim 8
Dependent Claim
39 words
The method of claim 5 further comprising placing the interconnect in a test apparatus configured to contain the die for testing, such that the second layer and the microbumps can flex in a Z-direction upon contact with the pads.
Claim 9
Dependent Claim
21 words
The method of claim 5 further comprising forming a protective layer on each microbump, the protective layer comprising an inert metal.
Claim 10
Independent Claim
117 words
A method for fabricating an interconnect for testing semiconductor dice comprising: providing a substrate comprising silicon; forming an electrically insulating first layer on the substrate; forming a plurality of conductors on the first layer; forming a second layer on the conductors and on the first layer, the second layer comprising a polymeric material; forming a plurality of vias through the compliant layer to the conductors in a pattern matching that of pads on a semiconductor die; screen printing metal microbumps in the vias in electrical communication with the conductors, the microbumps configured to electrically engage the pads on the die and to flex with the second layer to accommodate dimensional variations in the pads or the microbumps.
Claim 11
Independent Claim
117 words
A method for fabricating an interconnect for testing semiconductor dice comprising: providing a substrate comprising silicon; forming an electrically insulating first layer on the substrate; forming a plurality of conductors on the first layer; forming a second layer on the conductors and on the first layer, the second layer comprising a polymeric material; forming a plurality of vias through the compliant layer to the conductors in a pattern matching that of pads on a semiconductor die; screen printing metal microbumps in the vias in electrical communication with the conductors, the microbumps configured to electrically engage the pads on the die and to flex with the second layer to accommodate dimensional variations in the pads or the microbumps.
Claim 12
Dependent Claim
39 words
The method of claim 8 further comprising placing the interconnect in a test apparatus configured to contain the die for testing, such that the second layer and the microbumps can flex in a Z-direction upon contact with the pads.
Claim 13
Dependent Claim
16 words
The method of claim 8 further comprising forming an inert metal protective layer on each microbump.
Claim 14
Dependent Claim
35 words
The method of claim 8 further comprising placing the interconnect in a test apparatus configured to contain the die for testing, and testing the die by transmitting test signals through the microbumps to the pads.
Claim 15
Independent Claim
141 words
A method for fabricating an interconnect for testing semiconductor dice comprising: providing a substrate comprising silicon, the substrate configured for placement in a test apparatus adapted to contain a semiconductor die for testing; forming an electrically insulating first layer on the substrate; forming a plurality of conductors on the first layer; forming a second layer on the conductors and on the first layer, the second layer comprising a polymeric material; forming a first pattern of vias through the second layer to the conductors, the first pattern matching a second pattern of pads on the die; forming a plurality of metal microbumps in the vias; and placing the interconnect in the test apparatus such that the second layer and the microbumps can flex upon contact with the pads in a Z-direction to accommodate dimensional variations in the pads or in the microbumps.
Claim 16
Independent Claim
141 words
A method for fabricating an interconnect for testing semiconductor dice comprising: providing a substrate comprising silicon, the substrate configured for placement in a test apparatus adapted to contain a semiconductor die for testing; forming an electrically insulating first layer on the substrate; forming a plurality of conductors on the first layer; forming a second layer on the conductors and on the first layer, the second layer comprising a polymeric material; forming a first pattern of vias through the second layer to the conductors, the first pattern matching a second pattern of pads on the die; forming a plurality of metal microbumps in the vias; and placing the interconnect in the test apparatus such that the second layer and the microbumps can flex upon contact with the pads in a Z-direction to accommodate dimensional variations in the pads or in the microbumps.
Claim 17
Dependent Claim
23 words
The method of claim 12 wherein forming the microbumps comprises a process selected from the group consisting of electroless deposition and stencil printing.
Claim 18
Dependent Claim
16 words
The method of claim 12 wherein the second layer comprises polyimide tape attached to the substrate.
Claim 19
Dependent Claim
23 words
The method of claim 12 wherein the microbumps comprise a material selected from the group consisting of copper, gold, nickel, palladium and solder.
Claim 20
Dependent Claim
24 words
The method as claimed in claim 12 and further comprising forming the contacts of a solder wettable material and forming the microbumps of solder.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-03 | 2002-02-02 | 2002-08-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-03 | 2006-02-02 | 2006-08-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-03 | 2010-02-02 | 2010-08-04 | $7700.00 | Window Closed / Lapsed |