Abstract A bipolar transistor and a process for manufacturing thereof is disclosed. The bipolar transistor has a self-aligned base electrode in which first and second pillars are formed within first and second trenches which act as an activated region and a collector region, respectively; a conductive impurities layer of high density formed at a bottom side of the first and second trenches and at a lower portion of an isolation wall between the first and second trenches; and a sequentially formed base and emitter layer. After connection to the base layer, a base contact electrode is formed within the first trench, and a collector contact electrode is formed by implanting second conductive impurities in the second pillar.
A bipolar transistor, comprising: a conductive semiconductor substrate having first and second pillars formed in first and second trenches each having a predetermined depth for defining an activated region and a collector region; a conductive impurities diffusing layer formed in the semiconductor substrate at a lower portion of the first and second trenches and at an isolation wall between the first and second trenches; a conductive base layer formed from the first pillar; a self-aligned base contact electrode insulated from the conductive impurities diffusing layer, connected to the conductive base layer through a base connecting portion and formed within the first trench wherein the connecting base portion is formed between the self-aligned based contact electrode and the conductive base layer is positioned at a sidewall of the first pillar, and is positioned to contact only a part of a sidewall of the self-aligned base contact electrode within the first trench; a conductive emitter layer formed on the base layer; and a collector contact electrode having a conductive type the same as the conductive impurities diffusing layer and formed by the second pillar of the second trench.
Claim 2
Dependent Claim
186 words
A bipolar transistor, comprising: a conductive semiconductor substrate having first and second pillars formed in first and second trenches each having a predetermined depth for defining an activated region and a collector region; a conductive impurities diffusing layer formed in the semiconductor substrate at a lower portion of the first and second trenches and at an isolation wall between the first and second trenches; a conductive base layer formed from the first pillar; a self-aligned base contact electrode insulated from the conductive impurities diffusing layer, connected to the conductive base layer through a base connecting portion and formed within the first trench wherein the connecting base portion is formed between the self-aligned based contact electrode and the conductive base layer is positioned at a sidewall of the first pillar, and is positioned to contact only a part of a sidewall of the self-aligned base contact electrode within the first trench; a conductive emitter layer formed on the base layer; and a collector contact electrode having a conductive type the same as the conductive impurities diffusing layer and formed by the second pillar of the second trench.
Claim 3
Dependent Claim
17 words
The bipolar transistor of claim 1, wherein said conductive impurities diffusing layer functions as a collector layer.
Claim 4
Dependent Claim
15 words
The bipolar transistor of claim 1, wherein said base contact electrode is formed of polysilicon.
Claim 5
Dependent Claim
14 words
The bipolar transistor of claim 1, wherein said emitter layer is formed of polysilicon.
Claim 6
Dependent Claim
16 words
The bipolar transistor of claim 1, wherein said first trench is wider than said second trench.
Claim 7
Dependent Claim
16 words
The bipolar transistor of claim 1, wherein said first pillar is wider than said second pillar.