Patent US4071656A successfully refreshed from Google Patents.
Patent US5730642A successfully refreshed from Google Patents.
US5730642A
Expired / Lapsed
US
⏱️ 0.0 years remaining
System for real-time control of semiconductor wafer polishing including optical montoring
Assignee: Round Rock Research LLC
•
Filing: 1997-01-30
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Granted: 1998-03-24
•
Expires: 2017-01-30
Abstract
Abstract A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, a slurry supply system delivering a slurry to the polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly; and an optical measurement system measuring film thickness at multiple different locations on the wafer face while the wafer is under a liquid, wherein drying of the wafer is avoided while the measurements are taken.
Inventors
- 👤 Gurtej S. Sandhu
- 👤 Trung Tri Doan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 15:05
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/04; B24B37/07; B24B37/10; B24B37/105; B24B37/107; B23; B23Q; B23Q15/00; B23Q15/007; B23Q15/013; B23Q15/12; B24B13/00; B24B13/015; B24B37/005; B24B37/013; B24B37/015; B24B37/11; B24B37/12; B24B37/20; B24B37/205; B24B49/00; B24B49/003; B24B49/02; B24B49/04; B24B49/10; B24B49/12; B24B57/00; B24B57/02; G; G05; G05B; G05B19/00; G05B19/02; G05B19/18; G05B19/404; G05B2219/00; G05B2219/30; G05B2219/34; G05B2219/34403; G05B2219/37; G05B2219/37398; G05B2219/37602; G05B2219/45; G05B2219/45026; G05B2219/45199; G05B2219/45232; G05B2219/49; G05B2219/49052; G05B2219/49057
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
148 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, a slurry supply system configured to deliver a slurry to the polishing area, and a polishing head selectively supporting a semiconductor wafer and configured to hold a face of the semiconductor wafer in contact with the platen subassembly; an optical measurement system including a liquid filled, wafer receiving area which selectively receives the wafer, the wafer receiving area being spaced apart from the platen in a direction perpendicular to the axis of rotation of the platen, the optical measurement system measuring film thickness at multiple different locations on the wafer face; and a robot selectively moving the wafer between the platen and the wafer receiving area.
Claim 2
Independent Claim
148 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, a slurry supply system configured to deliver a slurry to the polishing area, and a polishing head selectively supporting a semiconductor wafer and configured to hold a face of the semiconductor wafer in contact with the platen subassembly; an optical measurement system including a liquid filled, wafer receiving area which selectively receives the wafer, the wafer receiving area being spaced apart from the platen in a direction perpendicular to the axis of rotation of the platen, the optical measurement system measuring film thickness at multiple different locations on the wafer face; and a robot selectively moving the wafer between the platen and the wafer receiving area.
Claim 3
Dependent Claim
26 words
A system in accordance with claim 1 wherein the optical measurement system comprises movable optics which scan the wafer face while the wafer face remains stationary.
Claim 4
Dependent Claim
16 words
A system in accordance with claim 1 wherein the optical measurement system includes pattern recognition system.
Claim 5
Dependent Claim
42 words
A system in accordance with claim 2 wherein the optical measurement system comprises an optical window, wherein the wafer receiving area is located on one side of the window, and wherein the optics are located on the other side of the window.
Claim 6
Dependent Claim
55 words
A system in accordance with claim 3 and further comprising end point detection means for determining if polishing of the wafer is complete, the end point detection means comprising means for causing the pattern recognition system to compare the thickness of a film on the wafer at various locations of the wafer with desired thicknesses.
Claim 7
Dependent Claim
54 words
A system in accordance with claim 1 wherein the polishing head supports the semiconductor wafer and holds the face of the semiconductor wafer in contact with the platen subassembly under an adjustable polishing force to polish the wafer face, and further comprising a controller selectively adjusting the polishing force during polishing of the wafer.
Claim 8
Dependent Claim
40 words
A system in accordance with claim 1 wherein the platen subassembly is rotatable about an axis and rotates at a variable platen velocity, and further comprising a controller selectively adjusting the velocity of the platen during polishing of the wafer.
Claim 9
Dependent Claim
41 words
A system in accordance with claim 1 wherein the polishing head is rotatable about an axis and rotates at a variable wafer velocity, and further comprising a controller selectively adjusting the velocity of the polishing head during polishing of the wafer.
Claim 10
Dependent Claim
40 words
A system in accordance with claim 1 wherein the polishing head is movable across the platen subassembly along an adjustable polishing path, and further comprising a controller selectively adjusting the path of the polishing head during polishing of the wafer.
Claim 11
Dependent Claim
47 words
A system in accordance with claim 1 wherein the polishing head is movable across the platen subassembly at an adjustable wafer movement rate, and further comprising a controller selectively adjusting the rate of movement of the polishing head across the platen subassembly, during polishing of the wafer.
Claim 12
Independent Claim
241 words
A system for polishing a semiconductor wafer comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen, a polishing head which supports the semiconductor wafer, and a polishing head displacement mechanism which moves the polishing head and wafer across the platen along an adjustable polishing path, the wafer polishing assembly having a plurality of controllable operational parameters that upon variation change the polishing rate and polishing uniformity; a controller operably coupled to the wafer polishing assembly for monitoring and managing in situ at least one of the operational parameters of the wafer polishing assembly; a processor operably coupled to the controller for determining a set of desired operational parameters based on the monitored operational parameters and outputting control information indicative of the desired operational parameters to the controller, the controller adjusting in situ at least one of the operational parameters of the wafer polishing assembly, including the polishing path, in response to the control information from the processor to effectuate a new polishing rate and a new polishing uniformity as the wafer polishing assembly continues to polish the face of the semiconductor wafer; and an optical measurement system selectively measuring film thickness at multiple different locations on the wafer face, the optical measurement system including a liquid filled wafer receiving area keeping the wafer face wet while the film thickness measurements are taken.
Claim 13
Independent Claim
241 words
A system for polishing a semiconductor wafer comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen, a polishing head which supports the semiconductor wafer, and a polishing head displacement mechanism which moves the polishing head and wafer across the platen along an adjustable polishing path, the wafer polishing assembly having a plurality of controllable operational parameters that upon variation change the polishing rate and polishing uniformity; a controller operably coupled to the wafer polishing assembly for monitoring and managing in situ at least one of the operational parameters of the wafer polishing assembly; a processor operably coupled to the controller for determining a set of desired operational parameters based on the monitored operational parameters and outputting control information indicative of the desired operational parameters to the controller, the controller adjusting in situ at least one of the operational parameters of the wafer polishing assembly, including the polishing path, in response to the control information from the processor to effectuate a new polishing rate and a new polishing uniformity as the wafer polishing assembly continues to polish the face of the semiconductor wafer; and an optical measurement system selectively measuring film thickness at multiple different locations on the wafer face, the optical measurement system including a liquid filled wafer receiving area keeping the wafer face wet while the film thickness measurements are taken.
Claim 14
Dependent Claim
26 words
A system in accordance with claim 11 wherein the optical measurement system comprises movable optics which scan the wafer face while the wafer face remains stationary.
Claim 15
Dependent Claim
17 words
A system in accordance with claim 11 wherein the optical measurement system includes a pattern recognition system.
Claim 16
Dependent Claim
42 words
A system in accordance with claim 12 wherein the optical measurement system comprises an optical window, wherein the wafer receiving area is located on one side of the window, and wherein the optics are located on the other side of the window.
Claim 17
Dependent Claim
34 words
A system in accordance with claim 14 wherein the optical window is spaced apart from the platen, and further comprising a robot selectively moving the wafer between the platen and the wafer receiving area.
Claim 18
Dependent Claim
54 words
A system in accordance with claim 13 and further comprising an end point detector which determines if polishing of the wafer is complete, the end point detector comprising means for causing the pattern recognition system to compare the thickness of a film on the wafer at various locations of the wafer with desired thicknesses.
Claim 19
Dependent Claim
53 words
A system in accordance with claim 11 wherein the polishing head supports the semiconductor wafer and holds the face of the semiconductor wafer in contact with the platen subassembly under an adjustable polishing force to polish the wafer face, and wherein the controller selectively adjusts the polishing force during polishing of the wafer.
Claim 20
Dependent Claim
39 words
A system in accordance with claim 11 wherein the platen subassembly is rotatable about an axis and rotates at a variable platen velocity, and wherein the controller selectively adjusts the velocity of the platen during polishing of the wafer.
Claim 21
Dependent Claim
40 words
A system in accordance with claim 11 wherein the polishing head is rotatable about an axis and rotates at a variable wafer velocity, and wherein the controller selectively adjusts the velocity of the polishing head during polishing of the wafer.
Claim 22
Dependent Claim
39 words
A system in accordance with claim 11 wherein the polishing head is movable across the platen subassembly along an adjustable polishing path, and wherein the controller selectively adjusts the path of the polishing head during polishing of the wafer.
Claim 23
Dependent Claim
42 words
A system in accordance with claim 11 wherein the polishing head is movable across the platen subassembly at an adjustable wafer movement rate, and wherein the controller selectively adjusts the rate of movement of the polishing head during polishing of the wafer.
Claim 24
Independent Claim
298 words
A system for polishing a semiconductor wafer comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen, a polishing head which supports the semiconductor wafer, and a polishing head displacement mechanism which moves the polishing head and wafer across the platen, the wafer polishing assembly having a plurality of controllable operational parameters that upon variation change the polishing rate and polishing uniformity; a controller operably coupled to the wafer polishing assembly for monitoring and managing in situ at least one of the operational parameters of the wafer polishing assembly; a processor operably coupled to the controller for determining a set of desired operational parameters based on the monitored operational parameters and outputting control information indicative of the desired operational parameters to the controller, the controller adjusting in situ at least one of the operational parameters of the wafer polishing assembly in response to the control information from the processor to effectuate a new polishing rate and a new polishing uniformity as the wafer polishing assembly continues to polish the face of the semiconductor wafer; a detector operating on the wafer and communicating with the processor to determine whether polishing of the wafer is complete, the detector including an optical measurement system measuring film thickness at multiple different locations on the wafer face while the wafer is under a liquid, the optical measurement system including an optical window spaced apart from the platen, a liquid containing wafer receiving area above the window movable optics below the window which scan the wafer face while the wafer face remains stationary, and a pattern recognition system; and a robot selectively moving the wafer between the platen and the wafer receiving area above the window.
Claim 25
Independent Claim
298 words
A system for polishing a semiconductor wafer comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen, a polishing head which supports the semiconductor wafer, and a polishing head displacement mechanism which moves the polishing head and wafer across the platen, the wafer polishing assembly having a plurality of controllable operational parameters that upon variation change the polishing rate and polishing uniformity; a controller operably coupled to the wafer polishing assembly for monitoring and managing in situ at least one of the operational parameters of the wafer polishing assembly; a processor operably coupled to the controller for determining a set of desired operational parameters based on the monitored operational parameters and outputting control information indicative of the desired operational parameters to the controller, the controller adjusting in situ at least one of the operational parameters of the wafer polishing assembly in response to the control information from the processor to effectuate a new polishing rate and a new polishing uniformity as the wafer polishing assembly continues to polish the face of the semiconductor wafer; a detector operating on the wafer and communicating with the processor to determine whether polishing of the wafer is complete, the detector including an optical measurement system measuring film thickness at multiple different locations on the wafer face while the wafer is under a liquid, the optical measurement system including an optical window spaced apart from the platen, a liquid containing wafer receiving area above the window movable optics below the window which scan the wafer face while the wafer face remains stationary, and a pattern recognition system; and a robot selectively moving the wafer between the platen and the wafer receiving area above the window.
Claim 26
Independent Claim
137 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer, the wafer polishing assembly including a platen, and a polishing head selectively supporting a semiconductor wafer and configured to hold a face of the semiconductor wafer in contact with the platen; a detector operating on the wafer to determine whether polishing of the wafer is complete, the detector including an optical measurement system including a wafer receiving area which selectively receives the wafer, the wafer receiving area being spaced apart from the platen in a direction perpendicular to the axis of rotation of the platen, the optical measurement system measuring film thickness at multiple different locations on the wafer face; and a robot selectively moving the wafer between the platen and the wafer receiving area.
Claim 27
Independent Claim
137 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer, the wafer polishing assembly including a platen, and a polishing head selectively supporting a semiconductor wafer and configured to hold a face of the semiconductor wafer in contact with the platen; a detector operating on the wafer to determine whether polishing of the wafer is complete, the detector including an optical measurement system including a wafer receiving area which selectively receives the wafer, the wafer receiving area being spaced apart from the platen in a direction perpendicular to the axis of rotation of the platen, the optical measurement system measuring film thickness at multiple different locations on the wafer face; and a robot selectively moving the wafer between the platen and the wafer receiving area.
Claim 28
Independent Claim
139 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer, the wafer polishing assembly including a platen, and a wafer receiving polishing head facing the platen and configured to support a semiconductor wafer and hold a face of the semiconductor wafer in contact with the platen; a detector operating on the wafer to determine whether polishing of the wafer is complete, the detector including an optical measurement system which selectively receives the wafer, the wafer receiving area being spaced apart from the platen in a direction perpendicular to the axis of rotation of the platen, the optical measurement system measuring film thickness at multiple different locations on the wafer face; and a robot configured to periodically move the wafer between the platen and the wafer receiving area.
Claim 29
Independent Claim
139 words
A system for polishing a semiconductor wafer, the system comprising: a wafer polishing assembly for polishing a face of a semiconductor wafer, the wafer polishing assembly including a platen, and a wafer receiving polishing head facing the platen and configured to support a semiconductor wafer and hold a face of the semiconductor wafer in contact with the platen; a detector operating on the wafer to determine whether polishing of the wafer is complete, the detector including an optical measurement system which selectively receives the wafer, the wafer receiving area being spaced apart from the platen in a direction perpendicular to the axis of rotation of the platen, the optical measurement system measuring film thickness at multiple different locations on the wafer face; and a robot configured to periodically move the wafer between the platen and the wafer receiving area.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-23 | 2001-09-22 | 2002-03-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-23 | 2005-09-22 | 2006-03-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-23 | 2009-09-22 | 2010-03-24 | $7700.00 | Window Closed / Lapsed |