Compliant thermal connectors and assemblies incorporating the same

Claim 2

A thermal connector for a microelectronic assembly comprising: (a) a device-side element and a sink-side element spaced apart from one another in a vertical direction; and (b) a plurality of conductive paths each including one or more elongated conductors, each said path having a proximal end fixed to said device-side element and a distal end fixed to said sink-side element, said conductors in said paths sloping in first and second lengthwise horizontal directions opposite to one another, said conductors being arranged in one of more arrays extending in said lengthwise horizontal directions and also extending in widthwise horizontal directions transverse to said lengthwise horizontal directions, each said array including a substantially equal numbers of conductors sloping in said first and second lengthwise directions, said conductors being flexible so as to permit movement of said device-side element relative to said sink-side element.

Claim 3

A thermal connector for a microelectronic assembly comprising: (a) a device-side element and a sink-side element spaced apart from one another in a vertical direction; and (b) a plurality of conductive paths each including one or more elongated conductors, each said path having a proximal end connected to said device-side element and a distal end connected to said sink-side element, said conductors in said paths sloping in first and second lengthwise horizontal directions opposite to one another, said conductors being arranged in one or more arrays extending in said lengthwise horizontal directions and also extending in widthwise horizontal directions transverse to said lengthwise horizontal directions, each said array including a substantially equal numbers of conductors sloping in said first and second lengthwise directions, each said path including a plurality of said conductors connected substantially end to end so that the conductors in each said path slope alternately in said first and second lengthwise directions, said paths including a plurality of paths of a first type in which a conductor at the proximal end of the path slopes in said first lengthwise direction and a plurality of paths of a second type in which the conductor at the proximal end of the path slopes in said second direction, the number of paths of said second type being substantially equal to the number of paths of said first type.

Claim 4

A thermal connector for a microelectronic assembly comprising: (a) a device-side element and a sink-side element spaced apart from one another in a vertical direction; and (b) a plurality of conductive paths each including one or more elongated conductors, each said path having a proximal end connected to said device-side element and a distal end connected to said sink-side element, said conductors in said paths sloping in first and second lengthwise horizontal directions opposite to one another, said conductors being arranged in one or more arrays extending in said lengthwise horizontal directions and also extending in widthwise horizontal directions transverse to said lengthwise horizontal directions, each said array including a substantially equal numbers of conductors sloping in said first and second lengthwise directions, each said path including a plurality of said conductors connected substantially end to end so that the conductors in each said path slope alternately in said first and second lengthwise directions, said paths including a plurality of paths of a first type in which a conductor at the proximal end of the path slopes in said first lengthwise direction and a plurality of paths of a second type in which the conductor at the proximal end of the path slopes in said second direction, the number of paths of said second type being substantially equal to the number of paths of said first type.

Claim 5

A thermal connector as claimed in claim 1 wherein said device-side element includes a plurality of device-side pads, each said pad being connected to at least one said path and being movable independently of the other said pads.

Claim 6

A thermal connector as claimed in claim 3 wherein said device-side pads are arranged in a grid extending in lengthwise and widthwise horizontal directions.

Claim 7

A thermal connector as claimed in claim 4 further comprising a flexible sheet connecting said device-side pads to one another.

Claim 8

A thermal connector as claimed in claim 3 wherein each said pad is connected to an even number of said conductors, with equal numbers of said conductors sloping in opposite lengthwise directions.

Claim 9

A thermal connector as claimed in claim 1 wherein each said conductor is substantially S-shaped.

Claim 10

A thermal connector for a microelectronic assembly comprising: (a) a device-side element and a sink-side element spaced above the device-side element; and (b) a lower array of conductors each including an elongated thermally conductive strip having opposite major faces directed generally in vertical directions towards said device-side and sink-side elements, each said conductor curving in said vertical directions, and defining a lower crest at which the strip extends substantially horizontally, the lower crest of each said conductor being attached to said device-side element, said conductors of said lower array also being connected to said sink-side element for transmission of heat thereto; and (c) an upper array of conductors, each said conductor of said upper array including an elongated thermally conductive strip having opposite major faces directed generally in said vertical directions, each said upper array conductor curving in said vertical directions, and defining an upper crest at which the strip extends substantially horizontally, the upper crest of each said conductor being attached to said device-side element, said conductors of said lower array being thermally connected to said sink-side element through said conductors of said upper array.

Claim 11

A thermal connector for a microelectronic assembly comprising: (a) a device-side element and a sink-side element spaced above the device-side element; and (b) a lower array of conductors each including an elongated thermally conductive strip having opposite major faces directed generally in vertical directions towards said device-side and sink-side elements, each said conductor curving in said vertical directions, and defining a lower crest at which the strip extends substantially horizontally, the lower crest of each said conductor being attached to said device-side element, said conductors of said lower array also being connected to said sink-side element for transmission of heat thereto; and (c) an upper array of conductors, each said conductor of said upper array including an elongated thermally conductive strip having opposite major faces directed generally in said vertical directions, each said upper array conductor curving in said vertical directions, and defining an upper crest at which the strip extends substantially horizontally, the upper crest of each said conductor being attached to said device-side element, said conductors of said lower array being thermally connected to said sink-side element through said conductors of said upper array.

Claim 12

A connector as claimed in claim 8 wherein each said conductor of said upper array is directly attached to at least one said conductor of said lower array, so that said attached conductors define substantially continuous paths extending between said device-side and sink-side elements.

Claim 13

A connector as claimed in claim 9 wherein said conductors of both said arrays define medial crests remote from said device-side and sink-side elements, said strips extending substantially horizontally at said medial crests, said conductors of said upper and lower arrays being attached to one another at said medial crests, the strips constituting the attached conductors overlying one another in substantially face-to-face arrangement.

Claim 14

A connector as claimed in claim 10 wherein said overlying strips are metallurgically bonded to one another at said medial crests.

Claim 15

A connector as claimed in claim 9 wherein each said conductor is substantially S-shaped and defines the crests of such conductor adjacent opposite ends such S-shape, each such S-shaped conductor having a sloping section between the crests of the conductor, each said conductor of said upper array being connected to one said conductor of the lower array to form one said path, each said path including one conductor sloping in a first horizontal direction and another conductor sloping in a second, opposite horizontal direction.

Claim 16

A connector as claimed in claim 12 wherein some of said paths are first-type paths having said lower conductor sloping in said first horizontal direction and said upper conductor sloping in said second horizontal direction and offers of said paths are second-type paths having said lower conductor sloping in said second horizontal direction and said upper conductor sloping in said first horizontal direction.

Claim 17

A connector as claimed in claim 13 wherein said device-side element includes a plurality of pads independently movable with respect to one another, each said pad being connected to equal numbers of paths of the first and second types.

Claim 18

A thermal connector for a microelectronic device comprising: (a) a plurality of thermally conductive device side pads disposed in an array extending in horizontal directions; (b) a flexible device-side sheet connecting said device-side pads so that said pads are movable relative to one another but said sheet forms a substantially fluid-tight barrier between adjacent pads; and (c) a plurality of elongated flexible thermal conductors connected to said pads and extending therefrom whereby said device-side pads can be thermally connected to a heat sink through said thermal conductors.

Claim 19

A thermal connector for a microelectronic device comprising: (a) a plurality of thermally conductive device side pads disposed in an array extending in horizontal directions; (b) a flexible device-side sheet connecting said device-side pads so that said pads are movable relative to one another but said sheet forms a substantially fluid-tight barrier between adjacent pads; and (c) a plurality of elongated flexible thermal conductors connected to said pads and extending therefrom whereby said device-side pads can be thermally connected to a heat sink through said thermal conductors.

Claim 20

A connector as claimed in claim 15 wherein each said device side pad has a proximal side and a distal side, said device side sheet extending on said distal sides of said device side pads, said device side sheet having a proximal side facing toward said device side pads and a distal side facing away from said device side pads, said device side sheet also having apertures extending through the device side sheet, said conductors being disposed on the distal side of the device side sheet and being connected to said device side pads through said apertures in said device side sheet.

Claim 21

A connector as claimed in claim 16 wherein each said conductor includes a strip having a major surface confronting the distal side of the device side sheet at one said aperture, the strip curving upwardly away from the device side sheet.

Claim 22

A connector as claimed in claim 17 wherein each said strip is substantially S-shaped.

Claim 23

A connector as claimed in claim 17 further comprising thermally conductive fillers extending through said apertures between said strips and said pads, each said filler being bonded to the associated pad and strip.

Claim 24

A connector as claimed in claim 15 further comprising a plurality of sink side pads disposed in a horizontally-extending array spaced vertically from said device-side pads, said conductors extending between said device-side pads and said sink-side pads.

Claim 25

A thermal connector for a microelectronic device comprising a device-side element and a sink-side element spaced apart from one another in a vertical direction and a plurality of generally v-shaped conductors connected between said elements, each said v-shaped conductor having one end attached to the device-side element and the other end attached to the sink-side element, so that the point of the v lies between the elements, the point of each v-shaped conductor being offset from the ends of such conductor in a horizontal longitudinal direction, some of said conductors being first conductors, the point of each first conductor being offset in a first longitudinal direction, others of said conductors being second conductors, the point of each second conductor being offset in a second longitudinal direction opposite to said first longitudinal direction.

Claim 26

A thermal connector for a microelectronic device comprising a device-side element and a sink-side element spaced apart from one another in a vertical direction and a plurality of generally v-shaped conductors connected between said elements, each said v-shaped conductor having one end attached to the device-side element and the other end attached to the sink-side element, so that the point of the v lies between the elements, the point of each v-shaped conductor being offset from the ends of such conductor in a horizontal longitudinal direction, some of said conductors being first conductors, the point of each first conductor being offset in a first longitudinal direction, others of said conductors being second conductors, the point of each second conductor being offset in a second longitudinal direction opposite to said first longitudinal direction.

Claim 27

A connector as claimed in claim 21 wherein said device-side element includes a plurality of device-side pads, each said device-side pad having equal numbers of said first and second conductors connected thereto.

Claim 28

A thermal connector for a microelectronic device comprising a device-side element, a sink-side element and a plurality of conductive paths extending between said elements, each said path including a plurality of substantially S-shaped flexible thermal conductors connected in series so that heat passing between said device-side element and said sink-side element through each said path will flow through one said thermal conductor and then through another said thermal conductor.

Claim 29

A thermal connector for a microelectronic device comprising a device-side element, a sink-side element and a plurality of conductive paths extending between said elements, each said path including a plurality of substantially S-shaped flexible thermal conductors connected in series so that heat passing between said device-side element and said sink-side element through each said path will flow through one said thermal conductor and then through another said thermal conductor.

Claim 30

A thermal connector as claimed in claim 23 wherein said device side and sink side elements are spaced apart from one another in a vertical direction, each said S-shaped conductor including a crest at each end of the conductor and a section sloping horizontally and vertically between the crests, the conductors of each said path being joined crest-to-crest, sloping sections of different conductors in each said path sloping in different horizontal directions.