US5270902A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip
Assignee: International Business Machines Corp
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Filing: 1992-12-16
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Granted: 1993-12-14
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Expires: 2012-12-16
Abstract
Abstract A heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip. The inventive device includes a first membrane of flexible, thermally conductive material having a first surface in contact with the integrated circuit chip. A flexible, thermally conductive radial finger contact spring is disposed in contact with a second surface of the first membrane. A second membrane of flexible, thermally conductive material is included. The second membrane has a first surface in contact with the spring and a second surface in contact with the heat sink.
Inventors
- 👤 Robert J. Bellar
- 👤 Sung J. Kim
- 👤 Alan L. Murphy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 19:48
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/20; H10W40/22; H10W40/226
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
88 words
A heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip, said device comprising: a first membrane of flexible, thermally conductive material having a first surface in contact with said integrated circuit chip; a flexible, thermally conductive radial finger contact spring disposed in contact with a second surface of said first membrane; and a second membrane of flexible, thermally conductive material having a first surface in contact with said spring and a second surface in contact with said heat sink.
Claim 2
Dependent Claim
88 words
A heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip, said device comprising: a first membrane of flexible, thermally conductive material having a first surface in contact with said integrated circuit chip; a flexible, thermally conductive radial finger contact spring disposed in contact with a second surface of said first membrane; and a second membrane of flexible, thermally conductive material having a first surface in contact with said spring and a second surface in contact with said heat sink.
Claim 3
Dependent Claim
20 words
The invention of claim 1 wherein said spring includes a ring and a plurality of flexible elements extending radially therefrom.
Claim 4
Dependent Claim
12 words
The invention of claim 2 wherein said spring is constructed of beryllium-copper.
Claim 5
Dependent Claim
16 words
The invention of claim 2 wherein said first and second membranes are constructed of expanded graphite.
Claim 6
Dependent Claim
15 words
The invention of claim 4 wherein said first and second membranes are constructed of Graphoil.
Claim 7
Dependent Claim
102 words
A heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip, said device comprising: a first membrane of flexible, thermally conductive material having a first surface in contact with said integrated circuit chip; a flexible, thermally conductive radial finger contact spring including a ring and a plurality of flexible elements extending radially therefrom, said ring being bonded to said a second surface of said first membrane; and a second membrane of flexible, thermally conductive material having a first surface in contact with said spring and a second surface in contact with said heat sink.
Claim 8
Dependent Claim
102 words
A heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip, said device comprising: a first membrane of flexible, thermally conductive material having a first surface in contact with said integrated circuit chip; a flexible, thermally conductive radial finger contact spring including a ring and a plurality of flexible elements extending radially therefrom, said ring being bonded to said a second surface of said first membrane; and a second membrane of flexible, thermally conductive material having a first surface in contact with said spring and a second surface in contact with said heat sink.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-12-13 | 1997-06-14 | 1997-12-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-12-13 | 2001-06-14 | 2001-12-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-12-13 | 2005-06-14 | 2005-12-14 | $7700.00 | Window Closed / Lapsed |