US5550083A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process of wirebond pad repair and reuse
Assignee: Fujitsu Ltd
•
Filing: 1995-03-16
•
Granted: 1996-08-27
•
Expires: 2015-03-16
Abstract
Abstract A wire bonding method comprising the steps of (a) disconnecting a first wire which is bonded on a first pad which is provided on a substrate, (b) forming a second pad on the first pad, and (c) bonding a second wire on the second pad, so that the second wire is electrically connected to the first pad. The step (a) may completely remove the first wire from the first pad, and the step (b) may form the second pad at least on a top surface of the first pad including a part which is damaged by the removal of the first wire. On the other hand, the step (a) may cut the first wire so that a tip end of the first wire remains bonded on the first pad, and the step (b) may form the second pad at least on a top surface of the first pad so as to completely cover the remaining tip end of the first wire.
Inventors
- 👤 Masateru Koide
- 👤 Yasuo Kawamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 11:08
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/225; H10; H10W; H10W72/00; H10W72/071; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09736; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K2203/00; H05K2203/04; H05K2203/049; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/40; H05K3/4007; H05K3/4015; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07531; H10W72/07535; H10W72/50; H10W72/521; H10W72/522; H10W72/531; H10W72/5363; H10W72/541; H10W72/5434; H10W72/547; H10W72/5473; H10W72/551; H10W72/552; H10W72/5522; H10W72/5525; H10W72/555; H10W72/59; H10W72/90; H10W72/921; H10W72/923; H10W72/931; H10W72/934; H10W72/951; H10W72/952; Y; Y10; Y10S; Y10S228/00; Y10S228/904
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
101 words
A wire bonding method comprising the steps of: (a) disconnecting a first wire which is bonded on a first pad which is provided on a substrate; (b) forming a second pad on the first pad; and (c) bonding a second wire on the second pad, so that the second wire is electrically connected to the first pad; wherein said step (a) completely removes the first wire from the first pad, and said step (b) forms the second pad at least on a top surface of the first pad including a part which is damaged by the removal of the first wire.
Claim 2
Dependent Claim
101 words
A wire bonding method comprising the steps of: (a) disconnecting a first wire which is bonded on a first pad which is provided on a substrate; (b) forming a second pad on the first pad; and (c) bonding a second wire on the second pad, so that the second wire is electrically connected to the first pad; wherein said step (a) completely removes the first wire from the first pad, and said step (b) forms the second pad at least on a top surface of the first pad including a part which is damaged by the removal of the first wire.
Claim 3
Dependent Claim
54 words
The wire bonding method as claimed in claim 1, wherein said step (b) forms the second pad by providing a bump on the first pad and spreading the bump by a pressing process so that the spread bump is flattened and forms the second pad which covers the top surface of the first pad.
Claim 4
Dependent Claim
26 words
The wire bonding method as claimed in claim 2, wherein said step (b) spreads the bump by a heating process in addition to the pressing process.
Claim 5
Dependent Claim
34 words
The wire bonding method as claimed in claim 2, wherein the first pad is made up of a conductive material which is metal plated at least at the top surface of the first pad.
Claim 6
Dependent Claim
57 words
The wire bonding method as claimed in claim 1, wherein said step (b) forms the second pad by providing a solder on the first pad, placing a conductor material plate on the solder, pressing the conductor material against the solder in a direction so that the conductor material plate maintains a horizontal position, and hardening the solder.
Claim 7
Dependent Claim
111 words
A wire bonding method comprising the steps of: (a) disconnecting a first wire which is bonded on a first pad which is provided on a substrate; (b) forming a second pad on the first pad; and (c) bonding a second wire on the second pad, so that the second wire is electrically connected to the first pad; wherein said step (a) cuts the first wire so that a tip end of the first wire remains bonded on the first pad, and said step (b) forms the second pad at least on a top surface of the first pad so as to completely cover the remaining tip end of the first wire.
Claim 8
Dependent Claim
111 words
A wire bonding method comprising the steps of: (a) disconnecting a first wire which is bonded on a first pad which is provided on a substrate; (b) forming a second pad on the first pad; and (c) bonding a second wire on the second pad, so that the second wire is electrically connected to the first pad; wherein said step (a) cuts the first wire so that a tip end of the first wire remains bonded on the first pad, and said step (b) forms the second pad at least on a top surface of the first pad so as to completely cover the remaining tip end of the first wire.
Claim 9
Dependent Claim
72 words
The wire bonding method as claimed in claim 6, wherein said step (b) forms the second pad by providing a bump on the remaining tip end of the first wire and the first pad and spreading the bump by a pressing process so that the spread bump is flattened and forms the second pad which covers the remaining tip end of the first wire and the top surface of the first pad.
Claim 10
Dependent Claim
26 words
The wire bonding method as claimed in claim 7, wherein said step (b) spreads the bump by a heating process in addition to the pressing process.
Claim 11
Dependent Claim
34 words
The wire bonding method as claimed in claim 7, wherein the first pad is made up of a conductive material which is metal plated at least at the top surface of the first pad.
Claim 12
Dependent Claim
66 words
The wire bonding method as claimed in claim 6, wherein said step (b) forms the second pad by providing a solder on the remaining tip end of the first wire and the first pad, placing a conductor material plate on the solder, pressing the conductor material against the solder in a direction so that the conductor material plate maintains a horizontal position, and hardening the solder.
References Cited (Backward Citations)
US3629669A
Cited
US4067104A
Cited
US4259367A
Cited
US4415606A
Cited
US4747889A
Cited
US4683652A
Cited
US4875618A
Cited
JPH01209736A
Cited
US4923521A
Cited
US5288607A
Cited
US5164814A
Cited
US5181317A
Cited
US5397997A
Cited
US5391516A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-08-27 | 2000-02-26 | 2000-08-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-08-27 | 2004-02-26 | 2004-08-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-08-27 | 2008-02-26 | 2008-08-27 | $7700.00 | Window Closed / Lapsed |