Patent US5533256A successfully refreshed from Google Patents.
US5533256A
Expired / Lapsed
US
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Method for directly joining a chip to a heat sink
Assignee: GlobalFoundries Inc
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Filing: 1995-06-05
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Granted: 1996-07-09
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Expires: 2015-06-05
Abstract
Abstract The present invention relates generally to a new apparatus and method for directly joining a chip to a heat sink. More particularly, the invention encompasses an apparatus and a method that uses a double-sided, pressure-sensitive, thermally-conductive adhesive tape to directly join a chip or similar such device to a heat sink.
Inventors
- 👤 Anson J. Call
- 👤 Stephen H. Meisner
- 👤 Frank L. Pompeo
- 👤 Jeffrey A. Zitz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 07:10
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/70; H10W44/00; H10W44/601; H10W72/00; H10W72/30; H10W90/00; H10W90/701; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/351; H10W72/353; H10W72/354; H10W72/851; H10W72/874; H10W72/877; H10W74/00; H10W74/10; H10W74/15; H10W76/00; H10W76/60; H10W76/63; H10W90/721; H10W90/724; H10W90/731; H10W90/734; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
130 words
A method to provide a direct thermally conductive path between at least one chip and at least one heat sink, wherein said method comprises the steps of: (a) interposing a double-sided thermally-conductive adhesive tape having a first surface and a second surface between said at least one chip and said at least one heat sink, wherein said first surface and said second surface are opposite each other, (b) securing at least a portion of said at least first surface of said double-sided thermally-conductive adhesive tape to one surface of said chip, and (c) securing at least a portion of said second surface to at least a portion of said heat sink, and thereby providing said direct thermally conductive path between at least one chip and at least one heat sink.
Claim 2
Independent Claim
130 words
A method to provide a direct thermally conductive path between at least one chip and at least one heat sink, wherein said method comprises the steps of: (a) interposing a double-sided thermally-conductive adhesive tape having a first surface and a second surface between said at least one chip and said at least one heat sink, wherein said first surface and said second surface are opposite each other, (b) securing at least a portion of said at least first surface of said double-sided thermally-conductive adhesive tape to one surface of said chip, and (c) securing at least a portion of said second surface to at least a portion of said heat sink, and thereby providing said direct thermally conductive path between at least one chip and at least one heat sink.
Claim 3
Dependent Claim
12 words
The method of claim 1, wherein said double-sided adhesive tape is pressure-sensitive.
Claim 4
Dependent Claim
25 words
The method of claim 1, wherein at least a portion of said chip is secured to a substrate using at least one first electrical connection.
Claim 5
Dependent Claim
26 words
The method of claim 3, wherein at least a portion of said at least one first electrical connection is encapsulated with at least one encapsulant material.
Claim 6
Dependent Claim
31 words
The method of claim 3, wherein said at least one first electrical connection is selected from a group consisting of solder ball, solder column, low-melting point solder or high-melting point solder.
Claim 7
Dependent Claim
17 words
The method of claim 3, wherein said substrate has at least one additional electronic device secured thereto.
Claim 8
Dependent Claim
17 words
The method of claim 6, wherein said at least one additional electronic device is a decoupling capacitor.
Claim 9
Dependent Claim
42 words
The method of claim 1, wherein at least a portion of said chip is secured to a substrate using at least one first electrical connection and wherein said substrate is itself secured to a card using at least one second electrical connection.
Claim 10
Dependent Claim
30 words
The method of claim 8, wherein said second electrical connection is selected from a group consisting of solder ball, solder column, low-melting point solder, high-melting point solder, pad or clip.
Claim 11
Dependent Claim
32 words
The method of claim 1, wherein at least a portion of said chip is secured to a substrate and wherein said substrate has a dam to hold at least one encapsulant material.
Claim 12
Dependent Claim
30 words
The method of claim 3, wherein at least a portion said heat sink has an extension and wherein at least a portion of said extension is secured to said substrate.
Claim 13
Dependent Claim
33 words
The method of claim 3, wherein at least a portion of said heat sink has an extension and wherein said extension has a lip that extends beyond the peripheral edges of said substrate.
Claim 14
Dependent Claim
37 words
The method of claim 11, wherein said extension has a base and wherein at least a portion of said base is secured to at least a portion of the peripheral edges of said substrate with an adhesive.
Claim 15
Dependent Claim
23 words
The method of claim 13, wherein the material for said adhesive is selected from a group consisting of acrylic, epoxy or polymeric material.
References Cited (Backward Citations)
US4092697A
Cited
US4233645A
Cited
US4254431A
Cited
US4489487A
Cited
US4506443A
Cited
US4654966A
Cited
US4926242A
Cited
US4703339A
Cited
US4849856A
Cited
US4939570A
Cited
US4999699A
Cited
US5107330A
Cited
US5173839A
Cited
US5199164A
Cited
US5263245A
Cited
US5249101A
Cited
US5359768A
Cited
US5362680A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-09 | 2000-01-08 | 2000-07-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-09 | 2004-01-08 | 2004-07-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-09 | 2008-01-08 | 2008-07-09 | $7700.00 | Window Closed / Lapsed |