US5362680A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Technique for enhancing adhesion capability of heat spreaders in molded packages
Assignee: Texas Instruments Inc
•
Filing: 1992-08-18
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Granted: 1994-11-08
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Expires: 2012-08-18
Abstract
Abstract Adhesion between a heat spreader (15) and a substance (19) to be adhered to the heat spreader can be enhanced by using thermal spray deposition to apply a coating (23) to the heat spreader. The substance to be adhered is applied to the coated heat spreader.
Inventors
- 👤 Katherine G. Heinen
- 👤 Brenda C. Gogue
- 👤 Henry F. Breit
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 14:20
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/02; H10W40/00; H10W40/20; H10W40/25; H10W40/259; H10W40/70; H10W40/77; H10W40/778; H10W76/00; H10W76/10; H10W76/12; H10W76/60; H10W72/00; H10W72/30; H10W72/381; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
75 words
A method of manufacturing a semiconductor packaged device, comprising the steps of: providing a metal heat spreader for carrying heat out of said semiconductor packaged device; providing a molding compound to be adhered to the heat spreader; enhancing the adhesion capability of the heat spreader by using flame plasma deposition to apply a coating to a surface of the heat spreader; and thereafter, applying to the coated surface of the heat spreader the molding compound.
Claim 2
Independent Claim
75 words
A method of manufacturing a semiconductor packaged device, comprising the steps of: providing a metal heat spreader for carrying heat out of said semiconductor packaged device; providing a molding compound to be adhered to the heat spreader; enhancing the adhesion capability of the heat spreader by using flame plasma deposition to apply a coating to a surface of the heat spreader; and thereafter, applying to the coated surface of the heat spreader the molding compound.
Claim 3
Dependent Claim
19 words
The method according to claim 1, including the step of mechanically abrading said surface before applying said coating thereto.
Claim 4
Dependent Claim
37 words
The method according to claim 1, wherein the semiconductor packaged device comprises: a semiconductor chip support pad, the molding compound is molded onto the chip support pad; a semiconductor circuit chip mounted on the chip support pad.
Claim 5
Dependent Claim
14 words
The method according to claim 1, wherein the molding compound is a plastic material.
Claim 6
Dependent Claim
13 words
The method according to claim 4, wherein the plastic material is epoxy Novolac.
Claim 7
Dependent Claim
12 words
The method according to claim 1, wherein the coating is electrically conductive.
Claim 8
Dependent Claim
12 words
The method according to claim 6, wherein the coating is nickel aluminide.
Claim 9
Dependent Claim
11 words
The method according to claim 1, wherein the coating is insulative.
Claim 10
Dependent Claim
11 words
The method according to claim 8, wherein the coating is alumina.
Claim 11
Dependent Claim
21 words
The method according to claim 1, wherein the coating has a thickness in a range of approximately 0.001 to 0.005 inches.
Claim 12
Dependent Claim
17 words
The method according to claim 1, wherein the coating has an adhesion strength of approximately 1000 psi.
Claim 13
Dependent Claim
27 words
The method according to claim 1, wherein the coating includes a precoat layer of nickel aluminide and an overcoat layer of alumina applied over said precoat layer.
Claim 14
Dependent Claim
76 words
The method according to claim 1 further comprising: providing a plurality of leads connected to the semiconductor packaged device; attaching the leads to the heat spreader, the coating on the surface of the heat spreader being electrically insulative such that the leads are electrically isolated from one another; and forming the molding compound onto the leads such that the leads project exterior to the molding compound to provide external electrical access to the semiconductor packaged device.
Claim 15
Dependent Claim
30 words
The method according to claim 13 further comprising enhancing the adhesion capability of the leads by using flame plasma deposition to apply a coating to a surface of the leads.
Claim 16
Independent Claim
67 words
A method for manufacturing an electrical circuit assembly, comprising: forming a molded casing on an electrical circuit; using flame plasma deposition to apply a coating on a surface of a metal heat spreader; adhering the molded casing to the coated surface of the metal heat spreader, whereby the coating on the surface of the heat spreader enhances the adhesion between the heat spreader and the molded casing.
Claim 17
Independent Claim
67 words
A method for manufacturing an electrical circuit assembly, comprising: forming a molded casing on an electrical circuit; using flame plasma deposition to apply a coating on a surface of a metal heat spreader; adhering the molded casing to the coated surface of the metal heat spreader, whereby the coating on the surface of the heat spreader enhances the adhesion between the heat spreader and the molded casing.
Claim 18
Dependent Claim
18 words
The method of claim 15 wherein the coating on the surface of the metal heat spreader is conductive.
Claim 19
Dependent Claim
18 words
The method of claim 15 wherein the coating on the surface of the metal heat spreader is insulative.
Claim 20
Dependent Claim
13 words
The method of claim 15 wherein the molded casing is a plastic material.
Claim 21
Dependent Claim
37 words
The method of claim 15 wherein first portions of the coating on the surface of the metal heat spreader are conductive and second portions of the coating on the surface of the metal heat spreader are insulative.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-11-07 | 1998-05-09 | 1998-11-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-11-07 | 2002-05-09 | 2002-11-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-11-07 | 2006-05-09 | 2006-11-08 | $7700.00 | Window Closed / Lapsed |