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US5087962A Expired / Lapsed US ⏱️ 0.0 years remaining

Insulated lead frame using plasma sprayed dielectric

Assignee: Motorola Solutions Inc
•
Filing: 1991-02-25
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Granted: 1992-02-11
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Expires: 2011-02-25
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Abstract

Abstract An electrically insulated lead frame having high thermal conductivity is achieved by utilizing a plasma spraying technique to apply a thin layer of a dielectric material on a surface of a lead frame. The lead frame is subsequently employed as a part of an insulated semiconductor device package.

Inventors

  • 👤 James W. G. deVos
  • 👤 Denise M. Ommen
  • 👤 Robert H. Palmer

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-07 10:24
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; H10W70/458; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 103 words
An insulated lead frame for a semiconductor package which comprises: a die attach area on a first surface of a semiconductor device lead frame; a plurality of leads projecting outward from the die attach area wherein the plurality of leads have proximal lead ends near the die attach area; and a layer of plasma spray ceramic material that is less than approximately 125 microns thick on a second surface of the lead frame wherein the layer of plasma sprayed ceramic material covers at least a portion of the plurality of proximal lead ends and an area that is opposite the die attach area.
Claim 2
Dependent Claim 103 words
An insulated lead frame for a semiconductor package which comprises: a die attach area on a first surface of a semiconductor device lead frame; a plurality of leads projecting outward from the die attach area wherein the plurality of leads have proximal lead ends near the die attach area; and a layer of plasma spray ceramic material that is less than approximately 125 microns thick on a second surface of the lead frame wherein the layer of plasma sprayed ceramic material covers at least a portion of the plurality of proximal lead ends and an area that is opposite the die attach area.
Claim 3
Dependent Claim 27 words
The insulated lead frame of claim 1 wherein the plasma sprayed ceramic material includes a plasma sprayed aluminum oxide (Al 2 O 3 ) filled ceramic material.
Claim 4
Dependent Claim 19 words
The insulated lead frame of claim 1 further including a thin metallic layer on the plasma sprayed ceramic material.
Claim 5
Dependent Claim 115 words
An electrically insulated semiconductor device package which comprises: a lead frame for a semiconductor device package wherein the lead frame has a die attach area on a first surface of the lead frame and a plurality of leads extending outward from the die attach area; a layer of a plasma sprayed aluminum oxide (Al 2 O 3 ) filled ceramic material that is less than approximately 125 microns thick between a second surface of the lead frame and a heatsink wherein the ceramic material insulates a portion of the lead frame; and a body of the package wherein the body covers at least the die attach area and a portion of the plurality of leads.
Claim 6
Dependent Claim 115 words
An electrically insulated semiconductor device package which comprises: a lead frame for a semiconductor device package wherein the lead frame has a die attach area on a first surface of the lead frame and a plurality of leads extending outward from the die attach area; a layer of a plasma sprayed aluminum oxide (Al 2 O 3 ) filled ceramic material that is less than approximately 125 microns thick between a second surface of the lead frame and a heatsink wherein the ceramic material insulates a portion of the lead frame; and a body of the package wherein the body covers at least the die attach area and a portion of the plurality of leads.

References Cited (Backward Citations)

US4604643A Cited
JPS5784157A Cited
US4549194A Cited
US4916518A Cited
JPS59198743A Cited
JPS61198658A Cited
JPS63120454A Cited
US4994411A Cited
JPH023148A Cited
JPH035546A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-02-10 1995-08-12 1996-02-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-02-10 1999-08-12 2000-02-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-02-10 2003-08-12 2004-02-11 $7700.00 Window Closed / Lapsed

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