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CMOS thin-film transistor having split gate structure

Assignee: Sharp Corp
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Filing: 1995-02-22
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Granted: 1996-06-18
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Expires: 2015-02-22
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Abstract

Abstract A thin-film semiconductor device having a CMOS inverter comprising a pair of n-type and p-type thin-film transistors, wherein the gate electrode of at least one of the paired thin-film transistors comprises a plurality of gate electrode sections spaced apart along the channel length. The channel region of the n-type thin-film transistor is doped with p-type impurities. This structure serves to reduce the leakage current and maintain high OFF resistance for a high source-drain voltage. Further, since a good symmetry of characteristics is maintained between the n-type and p-type thin-film transistors that constitute the CMOS inverter, no appreciable bias is caused in the output voltage of the CMOS inverter.

Inventors

  • 👤 Takayuki Shimada
  • 👤 Toshihiro Yamashita
  • 👤 Yasuhiro Matsushima
  • 👤 Yoji Yoshimura
  • 👤 Yutaka Takafuji

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 17:49
CPC Classifications
H; H10; H10D; H10D86/00; H10D30/00; H10D30/60; H10D30/67; H10D30/6704; H10D30/6713; H10D30/6729; H10D30/6757; H10D84/00; H10D84/80; H10D84/82; H10D84/83; H10D84/85

Claims Analysis

Total Claims: 19
Claim 1
Independent Claim 364 words
A thin film semiconductor device for use as an inverter having an input terminal and an output terminal such that when a zero or relatively low voltage signal is input at said input terminal, a relatively high voltage signal is generated at the output terminal of said inverter, comprising: a substrate; a first semiconductor layer and a second semiconductor layer formed on said substrate; an N-type thin film transistor including a first channel region formed in said first semiconductor layer, a first source region formed in said first semiconductor layer, a first drain region formed in said first semiconductor layer, a first gate insulating film formed on said first channel region, and a first gate electrode formed on said first gate insulating film; a P-type thin film transistor including a second channel region formed in said second semiconductor layer, a second source region formed in said second semiconductor layer, a second drain region formed in said second semiconductor layer, a second gate insulating film formed on said second channel region, and a second gate electrode formed on said second gate insulating film, wherein said input terminal is connected to said first and second gate electrodes and said output terminal is connected to said first and second drain regions, said first gate electrode having a plurality of first gate electrode sections spaced apart along a channel length direction extending between the first source and drain regions, wherein when a substantially zero voltage is applied to said input terminal, leakage current between said first drain region and said first source region is minimized; wherein a length of the first channel region is dimensioned to balance resistance characteristics of the thin film semiconductor device; and wherein N-type regions are formed in portions of the first channel region not covered by the gate electrode sections so as to form a plurality of channel subregions spaced apart along said channel length direction, each of the channel subregions being adjacent to the respective first gate electrode sections, whereby p-n junctions are formed across the first channel region when a relatively high voltage is applied between the first source region and the first drain region of the N-type thin film transistor.
Claim 2
Dependent Claim 364 words
A thin film semiconductor device for use as an inverter having an input terminal and an output terminal such that when a zero or relatively low voltage signal is input at said input terminal, a relatively high voltage signal is generated at the output terminal of said inverter, comprising: a substrate; a first semiconductor layer and a second semiconductor layer formed on said substrate; an N-type thin film transistor including a first channel region formed in said first semiconductor layer, a first source region formed in said first semiconductor layer, a first drain region formed in said first semiconductor layer, a first gate insulating film formed on said first channel region, and a first gate electrode formed on said first gate insulating film; a P-type thin film transistor including a second channel region formed in said second semiconductor layer, a second source region formed in said second semiconductor layer, a second drain region formed in said second semiconductor layer, a second gate insulating film formed on said second channel region, and a second gate electrode formed on said second gate insulating film, wherein said input terminal is connected to said first and second gate electrodes and said output terminal is connected to said first and second drain regions, said first gate electrode having a plurality of first gate electrode sections spaced apart along a channel length direction extending between the first source and drain regions, wherein when a substantially zero voltage is applied to said input terminal, leakage current between said first drain region and said first source region is minimized; wherein a length of the first channel region is dimensioned to balance resistance characteristics of the thin film semiconductor device; and wherein N-type regions are formed in portions of the first channel region not covered by the gate electrode sections so as to form a plurality of channel subregions spaced apart along said channel length direction, each of the channel subregions being adjacent to the respective first gate electrode sections, whereby p-n junctions are formed across the first channel region when a relatively high voltage is applied between the first source region and the first drain region of the N-type thin film transistor.
Claim 3
Dependent Claim 27 words
A thin film semiconductor device according to claim 1 wherein said plurality of gate electrode sections are connected at one end outside of the first channel region.
Claim 4
Dependent Claim 19 words
The thin film semiconductor device according to claim 1 wherein said first channel region is doped with P-type impurities.
Claim 5
Dependent Claim 39 words
The thin film semiconductor device according to claim 1 wherein a width of either of the first and second channel regions is dimensioned to balance resistance characteristics of the N-type thin film transistor and the P-type thin film transistor.
Claim 6
Dependent Claim 38 words
The thin film semiconductor device according to claim 1 wherein lengths of either of the first and second channel regions is dimensioned to balance resistance characteristics of the N-type thin film transistor and the P-type thin film transistor.
Claim 7
Dependent Claim 24 words
The thin film semiconductor device according to claim 1 wherein said first source region and said first drain region are doped with N-type impurities.
Claim 8
Dependent Claim 33 words
The thin film semiconductor device according to claim 6 wherein the plurality of gate electrode sections function as a mask for doping N-type impurities in said first source region and first drain region.
Claim 9
Dependent Claim 28 words
The thin film semiconductor device according to claim 1 wherein said plurality of gate electrode sections are connected to each other at ends on the input terminal side.
Claim 10
Dependent Claim 37 words
The thin film semiconductor device according to claim 1 wherein said plurality of gate electrode sections are completely separate from each other and an electrical interconnection for electrically connecting said plurality of gate electrode sections is provided.
Claim 11
Dependent Claim 29 words
The thin film semiconductor device according to claim 1 wherein said second gate electrode has a plurality of second gate electrode sections spaced apart along a channel length direction.
Claim 12
Dependent Claim 21 words
A thin film semiconductor device according to claim 1, wherein a total length of the first channel region is 8 μm.
Claim 13
Dependent Claim 21 words
A thin film semiconductor device according to claim 1, wherein a length of each of the channel subregions is 4 μm.
Claim 14
Dependent Claim 264 words
A thin film semiconductor device, comprising: a substrate; a first semiconductor layer and a second semiconductor layer formed on said substrate; an N-type thin film transistor including a first channel region formed in said first semiconductor layer, a first source region formed in said first semiconductor layer, a first drain region formed in said first semiconductor layer, a first gate insulating film formed on said first channel region, and a first gate electrode formed on said first gate insulating film; a P-type thin film transistor including a second channel region formed in said second semiconductor layer, a second source region formed in said second semiconductor layer, a second drain region formed in said second semiconductor layer, a second gate insulating film formed on said second channel region, and a second gate electrode formed on said second gate insulating film; wherein said first gate electrode has a plurality of first gate electrode sections spaced apart along a channel length direction extending between the first source and drain regions, and said first channel region has a plurality of channel subregions spaced apart along the channel length direction to form a plurality of p-n junctions when a relatively high voltage is applied between the first source region and the first drain region of the N-type thin film transistor, each of the channel subregions being adjacent to the respective first gate electrode sections, thereby sharing a voltage applied between the first source region and the first drain region with the plurality of p-n junctions and increasing dielectric strength between the first source region and the first drain region.
Claim 15
Dependent Claim 264 words
A thin film semiconductor device, comprising: a substrate; a first semiconductor layer and a second semiconductor layer formed on said substrate; an N-type thin film transistor including a first channel region formed in said first semiconductor layer, a first source region formed in said first semiconductor layer, a first drain region formed in said first semiconductor layer, a first gate insulating film formed on said first channel region, and a first gate electrode formed on said first gate insulating film; a P-type thin film transistor including a second channel region formed in said second semiconductor layer, a second source region formed in said second semiconductor layer, a second drain region formed in said second semiconductor layer, a second gate insulating film formed on said second channel region, and a second gate electrode formed on said second gate insulating film; wherein said first gate electrode has a plurality of first gate electrode sections spaced apart along a channel length direction extending between the first source and drain regions, and said first channel region has a plurality of channel subregions spaced apart along the channel length direction to form a plurality of p-n junctions when a relatively high voltage is applied between the first source region and the first drain region of the N-type thin film transistor, each of the channel subregions being adjacent to the respective first gate electrode sections, thereby sharing a voltage applied between the first source region and the first drain region with the plurality of p-n junctions and increasing dielectric strength between the first source region and the first drain region.
Claim 16
Dependent Claim 30 words
A thin film semiconductor device according to claim 13, wherein a total length of the first channel region is dimensioned to balance resistance characteristics of the thin film semiconductor device.
Claim 17
Dependent Claim 21 words
A thin film semiconductor device according to claim 14, wherein a total length of the first channel region is 8 μm.
Claim 18
Dependent Claim 21 words
A thin film semiconductor device according to claim 14, wherein a length of each of the channel subregions is 4 μm.
Claim 19
Dependent Claim 37 words
A thin film semiconductor device according to claim 13, wherein the second gate electrode has a plurality of second gate electrode sections spaced apart along a channel length direction extending between the second source and drain regions.

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Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-06-18 1999-12-18 2000-06-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-06-18 2003-12-18 2004-06-18 $3760.00 Window Closed / Lapsed
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