Multilayer conductive wire for semiconductor device and manufacturing method thereof

Claim 2

A multilayer conductive wire subjected to a stress which has a predetermined magnitude distribution in a first direction and is applied in a second direction, comprising: stacked layers including at least a first conductive layer and a second conductive layer joined with each other at an interface, said stacked layers being oriented relative to said second direction in such a manner as to experience a tendency to slide apart along the interface in response to said stress; and a plurality of elongate grooves of prescribed shape formed in said first conductive layer to extend from the interface of said first conductive layer and said second conductive layer to a prescribed depth into said first conductive layer, and a corresponding plurality of elongate protrusions provided to said second conductive layer with each protrusion extending into and engaging with a respective one of said grooves, wherein said plurality of engaged grooves and corresponding protrusions are disposed with respective portions thereof oriented substantially perpendicular to said second direction to resist the stress and are distributed in a correspondence with said predetermined magnitude distribution of said stress such that more of the engaged grooves and corresponding protrusions are provided where the stress magnitude is relatively high than are provided where the stress magnitude is relatively low.

Claim 3

A multilayer conductive wire as recited in claim 1, wherein: a surface of said first conductive layer opposite to said interface is covered with an oxide film for insulation, and a via hole for electrically connecting said first conductive layer and other conductive wires is formed in said oxide film only in a region free of said grooves.

Claim 4

A multilayer conductive wire as recited in claim 1, wherein: a first portion of said stress is oriented in a third direction and a second portion of said stress is oriented in a fourth direction; and said plurality of grooves comprises first and second sets of cooperating grooves disposed substantially perpendicular to said third and fourth directions respectively so that their respective lengthwise directions are correspondingly oriented in two directions intersecting each other.

Claim 5

A multilayer conductive wire as recited in claim 1, wherein: said first conductive layer includes an aluminum alloy layer, and said second conductive layer includes a metal layer having a smaller light reflectance than the aluminum alloy.

Claim 6

A multilayer conductive wire as recited in claim 4, further comprising: a barrier metal layer formed on an insulating layer and joined to a surface of said first conductive layer opposite to the interface of said first conductive layer and said second conductive layer.

Claim 7

A multilayer conductive wire as recited in claim 4, wherein: said metal layer includes one of W, Mo, Ti and Nb.

Claim 8

A multilayer conductive wire as recited in claim 1, wherein: said first conductive layer includes a metal layer having a smaller light reflectance than aluminum alloy, and said second conductive layer includes an aluminum alloy layer.

Claim 9

A multilayer conductive wire as recited in claim 7, further comprising: a barrier metal layer formed on an insulating layer and joined to a surface of said second conductive layer opposite to the interface of said second conductive layer and said first conductive layer.

Claim 10

A multilayer conductive wire as recited in claim 7, wherein: said metal layer includes one of W, Mo, Ti and Nb.

Claim 11

A multilayer conductive wire as recited in claim 1, wherein: said first conductive layer includes a barrier metal layer formed on an insulating layer, said second conductive layer includes an aluminum alloy layer joined to the surface of said first conductive layer, and a metal layer having a smaller light reflectance than aluminum alloy is joined to the surface of said second conductive layer.

Claim 12

A multilayer conductive wire as recited in claim 10, wherein: said metal layer includes one of W, Mo, Ti and Nb.

Claim 13

A multilayer conductive wire subjected to a stress which has a predetermined magnitude distribution in a first direction and is applied in a second direction, having two or more stacked wires including at least a first conductive layer and a second conductive layer joined with each other, wherein: a plurality of grooves each of a prescribed shape is formed from a surface of said first conductive layer, opposite to an interface of said first conductive layer and said second conductive layer, to a prescribed depth into the first conductive layer; a surface of one of the conductive layers opposite to the interface is covered with an insulating film layer for securing insulation from other conductive wires; and a corresponding plurality of protrusions provided in said insulating film layer to each engage with a respective one of said grooves, said conductive layers being oriented relative to said second direction in such a manner as to experience a tendency to slide apart along the interface in response to said stress, wherein said plurality of engaged grooves and corresponding protrusions are disposed with respective portions thereof oriented substantially perpendicular to said second direction to resist the stress and are distributed in a correspondence with said predetermined magnitude distribution of said stress such that more of the engaged grooves and corresponding protrusions are provided where the stress magnitude is relatively high than are provided where the stress magnitude is relatively low.

Claim 14

A multilayer conductive wire subjected to a stress which has a predetermined magnitude distribution in a first direction and is applied in a second direction, having two or more stacked wires including at least a first conductive layer and a second conductive layer joined with each other, wherein: a plurality of grooves each of a prescribed shape is formed from a surface of said first conductive layer, opposite to an interface of said first conductive layer and said second conductive layer, to a prescribed depth into the first conductive layer; a surface of one of the conductive layers opposite to the interface is covered with an insulating film layer for securing insulation from other conductive wires; and a corresponding plurality of protrusions provided in said insulating film layer to each engage with a respective one of said grooves, said conductive layers being oriented relative to said second direction in such a manner as to experience a tendency to slide apart along the interface in response to said stress, wherein said plurality of engaged grooves and corresponding protrusions are disposed with respective portions thereof oriented substantially perpendicular to said second direction to resist the stress and are distributed in a correspondence with said predetermined magnitude distribution of said stress such that more of the engaged grooves and corresponding protrusions are provided where the stress magnitude is relatively high than are provided where the stress magnitude is relatively low.

Claim 15

A multilayer conductive wire as recited in claim 12, wherein: a via hole for electrically connecting said first conductive layer and other conductive wires is formed in said insulating film layer only in a region free of said grooves.

Claim 16

A multilayer conductive wire as recited in claim 12, wherein: said first conductive layer includes a metal layer having smaller light reflectance than aluminum alloy, and said second conductive layer includes an aluminum alloy layer.

Claim 17

A multilayer conductive wire as recited in claim 14, wherein: said metal layer includes one of W, Mo, Ti and Nb.

Claim 18

A multilayer conductive wire as recited in claim 12, wherein: a barrier metal layer formed on an insulating layer is joined to a surface of said first conductive layer opposite to the interface of said second conductive layer and said first conductive layer.

Claim 19

A multilayer conductive wire for a semiconductor device subjected to a stress which has a predetermined magnitude distribution in a first direction and is applied in a second direction, comprising: a first conductive layer on a substrate of said semiconductor device; and a second conductive layer above and in contact with said first conductive layer, wherein said first and second conductive layers are interlocked to each other by non-planar regions on the contacting surfaces thereof, wherein a plurality of elongate grooves of prescribed shape corresponding to said non-planar regions is formed in one of the first and second conductive layers and a correspondingly shaped plurality of protrusions respectively interlocked with said grooves is formed in the other of said first and second conductive layers, wherein said conductive layers are oriented relative to said second direction in such a manner as to experience a tendency to slide apart along the interface in response to said stress, and wherein said plurality of engaged grooves and corresponding protrusions are disposed with respective portions thereof oriented substantially perpendicular to said second direction of application of the stress to resist the stress and are distributed in a correspondence with said predetermined magnitude distribution of said stress such that more of the engaged grooves and corresponding protrusions are provided where the stress magnitude is relatively high than are provided where the stress magnitude is relatively low.

Claim 20

A multilayer conductive wire for a semiconductor device subjected to a stress which has a predetermined magnitude distribution in a first direction and is applied in a second direction, comprising: a first conductive layer on a substrate of said semiconductor device; and a second conductive layer above and in contact with said first conductive layer, wherein said first and second conductive layers are interlocked to each other by non-planar regions on the contacting surfaces thereof, wherein a plurality of elongate grooves of prescribed shape corresponding to said non-planar regions is formed in one of the first and second conductive layers and a correspondingly shaped plurality of protrusions respectively interlocked with said grooves is formed in the other of said first and second conductive layers, wherein said conductive layers are oriented relative to said second direction in such a manner as to experience a tendency to slide apart along the interface in response to said stress, and wherein said plurality of engaged grooves and corresponding protrusions are disposed with respective portions thereof oriented substantially perpendicular to said second direction of application of the stress to resist the stress and are distributed in a correspondence with said predetermined magnitude distribution of said stress such that more of the engaged grooves and corresponding protrusions are provided where the stress magnitude is relatively high than are provided where the stress magnitude is relatively low.

Claim 21

A semiconductor device subjected to a stress which has a predetermined magnitude distribution in a first direction and is applied in a second direction, comprising: a substrate; an insulating layer on said substrate; and a multilayer conductive layer on said insulating layer, wherein said multilayer conductive layer includes at least a first conductive layer and a second conductive layer on and in contact with said first conductive layer, and said first and second conductive layers are interlocked to each other by non-planar regions on the contacting surfaces thereof, said conductive layers being oriented relative to said second direction in such a manner as to experience a tendency to slide apart along the interface in response to said stress, wherein said plurality of engaged grooves and corresponding protrusions are disposed with respective portions thereof oriented substantially perpendicular to said second direction to resist the stress and are distributed in a correspondence with said predetermined magnitude distribution of said stress such that more of the engaged grooves and corresponding protrusions are provided where the stress magnitude is relatively high than are provided where the stress magnitude is relatively low.

Claim 22

A semiconductor device subjected to a stress which has a predetermined magnitude distribution in a first direction and is applied in a second direction, comprising: a substrate; an insulating layer on said substrate; and a multilayer conductive layer on said insulating layer, wherein said multilayer conductive layer includes at least a first conductive layer and a second conductive layer on and in contact with said first conductive layer, and said first and second conductive layers are interlocked to each other by non-planar regions on the contacting surfaces thereof, said conductive layers being oriented relative to said second direction in such a manner as to experience a tendency to slide apart along the interface in response to said stress, wherein said plurality of engaged grooves and corresponding protrusions are disposed with respective portions thereof oriented substantially perpendicular to said second direction to resist the stress and are distributed in a correspondence with said predetermined magnitude distribution of said stress such that more of the engaged grooves and corresponding protrusions are provided where the stress magnitude is relatively high than are provided where the stress magnitude is relatively low.

Claim 23

The semiconductor device as recited in claim 18, wherein: said substrate is formed of silicon.

Claim 24

The semiconductor device as recited in claim 18, wherein: said multilayer conductive layer is arranged on a peripheral region of said substrate.

Claim 25

The semiconductor device as recited in claim 20, wherein: said first and second conductive layers are interlocked at corners thereof on said substrate.

Claim 26

The semiconductor device as recited in claim 20, wherein: said first and second conductive layers are interlocked principally at corners thereof on said substrate.

Claim 27

The semiconductor device as recited in claim 20, wherein: said first and second conductive layers are interlocked only at corners thereof on said substrate.

Claim 28

In an integrated circuit device including at least an insulating layer, a multilayer conductive wiring layer having a length along a first axis, a width along a second axis, and a thickness along a third axis, said length being substantially larger than each of said width and said thickness, said multilayer conductive wiring layer comprising: a first conductive sub-layer formed on at least a portion of the insulating layer, said first conductive sub-layer having an upper surface and a lower surface, said lower surface being in contact with said at least a portion of the insulating layer, said first conductive sub-layer further having a plurality of slots formed therethrough from said upper surface to said lower surface, said plurality of slots being oriented along said first axis of said multilayer conductive wiring layer; and a second conductive sub-layer formed on the top surface of said first conductive sub-layer, said second conductive sub-layer having a plurality of protrusions extending through said plurality of slots in said first conductive sub-layer to contact said insulating layer, wherein said first conductive sub-layer and said second conductive sub-layer are mechanically linked through said plurality of slots in said first conductive sub-layer and corresponding protrusions of said second conductive sub-layer extending therethrough.

Claim 29

In an integrated circuit device including at least an insulating layer, a multilayer conductive wiring layer having a length along a first axis, a width along a second axis, and a thickness along a third axis, said length being substantially larger than each of said width and said thickness, said multilayer conductive wiring layer comprising: a first conductive sub-layer formed on at least a portion of the insulating layer, said first conductive sub-layer having an upper surface and a lower surface, said lower surface being in contact with said at least a portion of the insulating layer, said first conductive sub-layer further having a plurality of slots formed therethrough from said upper surface to said lower surface, said plurality of slots being oriented along said first axis of said multilayer conductive wiring layer; and a second conductive sub-layer formed on the top surface of said first conductive sub-layer, said second conductive sub-layer having a plurality of protrusions extending through said plurality of slots in said first conductive sub-layer to contact said insulating layer, wherein said first conductive sub-layer and said second conductive sub-layer are mechanically linked through said plurality of slots in said first conductive sub-layer and corresponding protrusions of said second conductive sub-layer extending therethrough.

Claim 30

The multilayer conductive wiring layer of claim 24, wherein: said plurality of slots in said first conductive sub-layer and corresponding protrusions of said second conductive sub-layer are oriented substantially perpendicular to a predetermined direction of application of a main stress so as to resist the main stress.

Claim 31

The multilayer conductive wiring layer of claim 25, wherein: said plurality of slots in said first conductive sub-layer and corresponding protrusions of said second conductive sub-layer are distributed in correspondence with a predetermined magnitude distribution of said applied main stress such that more slots are provided where a magnitude of said main stress is relatively high than are provided where a magnitude of said main stress is relatively low.

Claim 32

The multilayer conductive wiring layer of claim 22 wherein: a first portion of said main stress is oriented in a first direction and a second portion of said stress is oriented in a second direction; and said second conductive sub-layer further comprises a plurality of second sets of slots disposed substantially perpendicular to said second direction.

Claim 33

In an integrated circuit device including at least an insulating layer and a multilayer conductive wiring layer having a length substantially larger than each of a width and a thickness, said multilayer conductive wiring layer comprising: a first conductive sub-layer formed on at least a portion of the insulating layer, said first conductive sub-layer having an upper surface and a lower surface, said lower surface being in contact with said at least a portion of the insulating layer, said first conductive sub-layer further having a first plurality of slots formed therethrough from said upper surface to said lower surface; a second conductive sub-layer formed on the upper surface of said first conductive sub-layer, a portion of said second conductive sub-layer contacting said insulating layer through said first plurality of slots in said first conductive sub-layer; wherein said first conductive sub-layer and said second conductive sub-layer are mechanically linked through said first plurality of slots in said first conductive sub-layer and said portion of said second conductive sub-layer.

Claim 34

In an integrated circuit device including at least an insulating layer and a multilayer conductive wiring layer having a length substantially larger than each of a width and a thickness, said multilayer conductive wiring layer comprising: a first conductive sub-layer formed on at least a portion of the insulating layer, said first conductive sub-layer having an upper surface and a lower surface, said lower surface being in contact with said at least a portion of the insulating layer, said first conductive sub-layer further having a first plurality of slots formed therethrough from said upper surface to said lower surface; a second conductive sub-layer formed on the upper surface of said first conductive sub-layer, a portion of said second conductive sub-layer contacting said insulating layer through said first plurality of slots in said first conductive sub-layer; wherein said first conductive sub-layer and said second conductive sub-layer are mechanically linked through said first plurality of slots in said first conductive sub-layer and said portion of said second conductive sub-layer.

Claim 35

A multilayer conductive wire structure formed over an insulating layer, comprising: a first conductive layer formed on a surface of the insulating layer; a second conductive layer formed on the first conductive layer to a selected thickness, a plurality of first grooves being formed through the thickness of the second conductive layer; and a third conductive layer formed on the second conductive layer and extending into said plurality of first grooves through the thickness of the second conductive layer so as to contact the first conductive layer, whereby the second and third conductive layers are interlocked to one another by material of the third conductive layer extending through the first grooves in the second conductive layer.

Claim 36

A multilayer conductive wire structure formed over an insulating layer, comprising: a first conductive layer formed on a surface of the insulating layer; a second conductive layer formed on the first conductive layer to a selected thickness, a plurality of first grooves being formed through the thickness of the second conductive layer; and a third conductive layer formed on the second conductive layer and extending into said plurality of first grooves through the thickness of the second conductive layer so as to contact the first conductive layer, whereby the second and third conductive layers are interlocked to one another by material of the third conductive layer extending through the first grooves in the second conductive layer.

Claim 37

The multilayer wiring structure according to claim 29, wherein: a plurality of second grooves are formed in the first conductive layer in correspondence with the plurality of first grooves formed in the second conductive layer, and material of the third conductive layer extends through the first grooves in the second conductive layer and through corresponding second grooves in the first conductive layer, whereby the second and third conductive layers are mechanically interlocked with each other and with the first conductive layer by the presence of material of the third conductive layer extending into the second and first grooves in both of the first and second conductive layers respectively.

Claim 38

The multilayer conductive wire structure formed over an insulating layer, comprising: a first conductive layer formed on a surface of the insulating layer; a second conductive layer formed on the first conductive layer to a selected thickness, a plurality of grooves being formed part way into the selected thickness from an outer surface of the second conductive layer; and a third conductive layer formed on the outer surface of the second conductive layer and extending into said plurality of grooves of the second conductive layer to fill said grooves, whereby the second and third conductive layers are interlocked to one another by material of the third conductive layer extending into the plurality of grooves in the second conductive layer.

Claim 39

The multilayer conductive wire structure formed over an insulating layer, comprising: a first conductive layer formed on a surface of the insulating layer; a second conductive layer formed on the first conductive layer to a selected thickness, a plurality of grooves being formed part way into the selected thickness from an outer surface of the second conductive layer; and a third conductive layer formed on the outer surface of the second conductive layer and extending into said plurality of grooves of the second conductive layer to fill said grooves, whereby the second and third conductive layers are interlocked to one another by material of the third conductive layer extending into the plurality of grooves in the second conductive layer.

Claim 40

In an integrated circuit device including at least an insulating layer and a multilayer conductive wiring layer having a length substantially larger than each of a width and a thickness, said multilayer conductive wiring layer comprising: a conductive sub-layer formed on at least a portion of the insulating layer, said conductive sub-layer having an upper surface and a lower surface, said lower surface being in contact with said at least a portion of the insulating layer, said conductive sub-layer further having a plurality of slots formed therethrough from said upper surface to said lower surface; an insulating sub-layer formed on the upper surface of said conductive sub-layer, a portion of said insulating sub-layer extending through said plurality of slots in said conductive sub-layer and contacting said insulating layer; wherein said conductive sub-layer and said insulating sub-layer are mechanically linked through said plurality of slots in said conductive sub-layer and said portion of said insulating sub-layer extending therethrough.

Claim 41

In an integrated circuit device including at least an insulating layer and a multilayer conductive wiring layer having a length substantially larger than each of a width and a thickness, said multilayer conductive wiring layer comprising: a conductive sub-layer formed on at least a portion of the insulating layer, said conductive sub-layer having an upper surface and a lower surface, said lower surface being in contact with said at least a portion of the insulating layer, said conductive sub-layer further having a plurality of slots formed therethrough from said upper surface to said lower surface; an insulating sub-layer formed on the upper surface of said conductive sub-layer, a portion of said insulating sub-layer extending through said plurality of slots in said conductive sub-layer and contacting said insulating layer; wherein said conductive sub-layer and said insulating sub-layer are mechanically linked through said plurality of slots in said conductive sub-layer and said portion of said insulating sub-layer extending therethrough.

Claim 42

A conductive multilayer wiring structure formed on a surface of an insulating layer, comprising: a first conductive layer formed on a portion of said surface of said insulating layer, with a first plurality of slots formed through a thickness of the first conductive layer; a second conductive layer formed on said first conductive layer, said second conductive layer having formed therein a second plurality of slots parallel to and non-overlappingly located relative to the slots in said first conductive layer; and a third conductive layer formed on said second conductive layer, with material of the third conductive layer extending into and through a thickness of the second conductive layer so as to contact corresponding portions of said first conductive layer, whereby said first, second and third conductive layers are sequentially interlocked to each other by said slots and materials extending therethrough.

Claim 43

A conductive multilayer wiring structure formed on a surface of an insulating layer, comprising: a first conductive layer formed on a portion of said surface of said insulating layer, with a first plurality of slots formed through a thickness of the first conductive layer; a second conductive layer formed on said first conductive layer, said second conductive layer having formed therein a second plurality of slots parallel to and non-overlappingly located relative to the slots in said first conductive layer; and a third conductive layer formed on said second conductive layer, with material of the third conductive layer extending into and through a thickness of the second conductive layer so as to contact corresponding portions of said first conductive layer, whereby said first, second and third conductive layers are sequentially interlocked to each other by said slots and materials extending therethrough.

Claim 44

The multilayer wiring structure according to claim 29, wherein: said first conductive layer is formed to have a plurality of transverse grooves which are oriented in a direction perpendicular to an orientation of said first grooves in said second conductive layer, with material of said second conductive layer extending into said transverse grooves of the first conductive layer.

Claim 45

A multilayer conductive wiring structure formed on a surface of an insulating layer, comprising: a first conductive layer formed on a portion of said surface of said insulating layer, with a plurality of projections formed on a surface of the first conductive layer along a lengthwise direction thereof; and a second conductive layer formed on said surface of said first conductive layer so as to cover and extend between said plurality of projections formed thereon, whereby said first and second conductive layers are mechanically interlocked by coaction between said plurality of projections of said first conductive layer and said second conductive layer extending between and covering the same.

Claim 46

A multilayer conductive wiring structure formed on a surface of an insulating layer, comprising: a first conductive layer formed on a portion of said surface of said insulating layer, with a plurality of projections formed on a surface of the first conductive layer along a lengthwise direction thereof; and a second conductive layer formed on said surface of said first conductive layer so as to cover and extend between said plurality of projections formed thereon, whereby said first and second conductive layers are mechanically interlocked by coaction between said plurality of projections of said first conductive layer and said second conductive layer extending between and covering the same.

Claim 47

The multilayer wiring structure according to claim 35, wherein: said second conductive layer is formed to a thickness exceeding a height of said plurality of projections of said first conductive layer, and has an upper surface comprising protrusions corresponding to individual ones of said projections of said first conductive layer.

Claim 48

A conductive multilayer wiring structure formed on a surface of an insulating layer, comprising: a first conductive layer formed on a portion of said surface of said insulating layer, with a plurality of elongate lengthwise protrusions formed on a surface of the first conductive layer to a first height; a second conductive material deposited on said first conductive material, including portions of said first conductive layer between adjacent projections thereof, such that said second conductive material is provided to a thickness equal to that of said projections; and a third conductive layer formed on said second conductive layer and said projections of said first conductive layer.

Claim 49

A conductive multilayer wiring structure formed on a surface of an insulating layer, comprising: a first conductive layer formed on a portion of said surface of said insulating layer, with a plurality of elongate lengthwise protrusions formed on a surface of the first conductive layer to a first height; a second conductive material deposited on said first conductive material, including portions of said first conductive layer between adjacent projections thereof, such that said second conductive material is provided to a thickness equal to that of said projections; and a third conductive layer formed on said second conductive layer and said projections of said first conductive layer.

Claim 50

A multilayer conductive wiring structure formed on a surface of an insulating material, comprising: a first conductive material formed on a portion of said surface of said insulating layer; a second conductive layer formed on said first conductive layer; and a third conductive layer formed on a surface of said second conductive layer; with a plurality of grooves formed through a total thickness of said second and third conductive layers taken together.

Claim 51

A multilayer conductive wiring structure formed on a surface of an insulating material, comprising: a first conductive material formed on a portion of said surface of said insulating layer; a second conductive layer formed on said first conductive layer; and a third conductive layer formed on a surface of said second conductive layer; with a plurality of grooves formed through a total thickness of said second and third conductive layers taken together.

Claim 52

The multilayer wiring structure according to claim 38, wherein: said first conductive layer is provided with grooves extending through a thickness thereof and in respective correspondence with said grooves formed in said second and third conductive layers.