Patent US5404265A successfully refreshed from Google Patents.
US5404265A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Interconnect capacitors
Assignee: Fujitsu Ltd
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Filing: 1992-08-28
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Granted: 1995-04-04
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Expires: 2012-08-28
Abstract
Abstract A bypass capacitor for use with an integrated circuit module, and method of making the same, are shown. The integrated circuit module comprises an integrated circuit "chip" mounted in opposing relationship to a carrier substrate and having a plurality of interconnects, such as solder bumps or wire interconnects, for providing signal lines and supplying power to the chip. Some of the interconnects are, instead, used to form capacitors such that bypass capitance is placed in close proximity to the chip, while not using up valuable real estate on the chip or on the carrier substrate. Various embodiments of such bypass capacitors are shown.
Inventors
- 👤 Larry L. Moresco
- 👤 David G. Love
- 👤 Wen-chou V. Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 17:39
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/601; H10W72/00; H10W72/20; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W72/241; H10W72/251; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/43; Y10T29/435
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
84 words
An integrated circuit module, comprising: an integrated circuit chip, a carrier substrate for supporting said integrated circuit chip in flip-chip relationship to said carrier substrate, said integrated circuit chip being mounted directly on said carrier substrate, interconnection means comprising a plurality of discrete connector elements disposed between said integrated circuit chip and said carrier substrate, a capacitor on or between said integrated circuit chip and said carrier substrate, at least one plate of said capacitor being formed from one of said discrete connector elements.
Claim 2
Dependent Claim
84 words
An integrated circuit module, comprising: an integrated circuit chip, a carrier substrate for supporting said integrated circuit chip in flip-chip relationship to said carrier substrate, said integrated circuit chip being mounted directly on said carrier substrate, interconnection means comprising a plurality of discrete connector elements disposed between said integrated circuit chip and said carrier substrate, a capacitor on or between said integrated circuit chip and said carrier substrate, at least one plate of said capacitor being formed from one of said discrete connector elements.
Claim 3
Dependent Claim
13 words
The module of claim 1 wherein said discrete connector elements comprise solder bumps.
Claim 4
Dependent Claim
13 words
The module of claim 1 wherein said discrete connector elements comprise wire interconnects.
Claim 5
Dependent Claim
22 words
The module of claim 3 wherein one of said wire interconnects is disposed in a solder filled recess in said carrier substrate.
Claim 6
Dependent Claim
60 words
An integrated circuit module, comprising: an integrated circuit chip, a carrier substrate for said integrated circuit chip, interconnection means comprising a plurality of solder bumps disposed between said integrated circuit chip and said carrier substrate, wherein a dielectric material is disposed between opposing solder bumps mounted on said carrier substrate and on said integrated circuit chip thereby forming a capacitor.
Claim 7
Dependent Claim
60 words
An integrated circuit module, comprising: an integrated circuit chip, a carrier substrate for said integrated circuit chip, interconnection means comprising a plurality of solder bumps disposed between said integrated circuit chip and said carrier substrate, wherein a dielectric material is disposed between opposing solder bumps mounted on said carrier substrate and on said integrated circuit chip thereby forming a capacitor.
Claim 8
Dependent Claim
44 words
A capacitor formed between two opposing substrates, comprising: a first solder bump mounted on a first substrate, a second solder bump mounted on a second substrate in opposition to said first solder bump, a dielectric material disposed between said first and second solder bumps.
Claim 9
Dependent Claim
44 words
A capacitor formed between two opposing substrates, comprising: a first solder bump mounted on a first substrate, a second solder bump mounted on a second substrate in opposition to said first solder bump, a dielectric material disposed between said first and second solder bumps.
Claim 10
Dependent Claim
52 words
A capacitor formed between two opposing substrates, comprising: a wire interconnect mounted on a first substrate, an opposing solder bump mounted on a second substrate, said wire interconnect being inserted into said solder bump when said solder bump is reflowed, and a dielectric layer between said solder bump and said wire interconnect.
Claim 11
Dependent Claim
52 words
A capacitor formed between two opposing substrates, comprising: a wire interconnect mounted on a first substrate, an opposing solder bump mounted on a second substrate, said wire interconnect being inserted into said solder bump when said solder bump is reflowed, and a dielectric layer between said solder bump and said wire interconnect.
Claim 12
Dependent Claim
17 words
The capacitor of claim 7 wherein said solder bump has a well for receiving said wire interconnect.
Claim 13
Dependent Claim
18 words
The capacitor of claim 8 wherein said well in said solder bump is lined with a dielectric material.
Claim 14
Dependent Claim
15 words
The capacitor of claim 7 wherein said wire interconnect is coated with a dielectric material.
Claim 15
Dependent Claim
74 words
A capacitor formed between two opposing substrates, comprising: a wire interconnect mounted on a surface of a first substrate, a mating recess formed in a dielectric upper layer of a second substrate, said second substrate having a metal layer beneath said recess in said upper dielectric layer, such that a capacitor is formed when said first and second substrates are mounted in an opposing relationship and said wire interconnect is inserted into said recess.
Claim 16
Dependent Claim
74 words
A capacitor formed between two opposing substrates, comprising: a wire interconnect mounted on a surface of a first substrate, a mating recess formed in a dielectric upper layer of a second substrate, said second substrate having a metal layer beneath said recess in said upper dielectric layer, such that a capacitor is formed when said first and second substrates are mounted in an opposing relationship and said wire interconnect is inserted into said recess.
Claim 17
Dependent Claim
64 words
A capacitor formed between two opposing substrates, comprising: a wire interconnect mounted on a first substrate, said wire interconnect comprising a dielectric coating, a solder-filled recess formed in a dielectric upper layer of a second substrate, such that a capacitor is formed when said first and second substrates are mounted in an opposing relationship and said wire interconnect is inserted into said solder-filled recess.
Claim 18
Dependent Claim
64 words
A capacitor formed between two opposing substrates, comprising: a wire interconnect mounted on a first substrate, said wire interconnect comprising a dielectric coating, a solder-filled recess formed in a dielectric upper layer of a second substrate, such that a capacitor is formed when said first and second substrates are mounted in an opposing relationship and said wire interconnect is inserted into said solder-filled recess.
Claim 19
Dependent Claim
69 words
A capacitor formed between two opposing substrates, comprising: a via formed in a first substrate, a first metal layer formed in said via and conforming to the shape thereof, means for making electrical contact with said first metal layer, a dielectric layer formed over said first metal layer, a solder plug filling the via over said dielectric layer, and an interconnect positioned within and extending above said solder plug.
Claim 20
Dependent Claim
69 words
A capacitor formed between two opposing substrates, comprising: a via formed in a first substrate, a first metal layer formed in said via and conforming to the shape thereof, means for making electrical contact with said first metal layer, a dielectric layer formed over said first metal layer, a solder plug filling the via over said dielectric layer, and an interconnect positioned within and extending above said solder plug.
Claim 21
Dependent Claim
72 words
A capacitor formed between two opposing substrates, comprising: a first active circuit substrate, a second carrier substrate in opposing relation to said first substrate, said first active circuit substrate being mounted directly on said second carrier substrate, a capacitor intermediate said first and second substrates, wherein at least one of said capacitor plates is made of solder which is reflowed when said first and second substrates are mounted in said opposing relationship.
Claim 22
Dependent Claim
72 words
A capacitor formed between two opposing substrates, comprising: a first active circuit substrate, a second carrier substrate in opposing relation to said first substrate, said first active circuit substrate being mounted directly on said second carrier substrate, a capacitor intermediate said first and second substrates, wherein at least one of said capacitor plates is made of solder which is reflowed when said first and second substrates are mounted in said opposing relationship.
Claim 23
Independent Claim
51 words
A method of making a capacitor between two interconnected substrates, comprising the steps of: forming an array of interconnects on one of said substrates, and coating some of the interconnects within said array with a dielectric material, such that capacitors are formed when said substrates are mounted in an opposing relationship.
Claim 24
Independent Claim
51 words
A method of making a capacitor between two interconnected substrates, comprising the steps of: forming an array of interconnects on one of said substrates, and coating some of the interconnects within said array with a dielectric material, such that capacitors are formed when said substrates are mounted in an opposing relationship.
Claim 25
Dependent Claim
20 words
The method of claim 15 further comprising the step of forming a second array of interconnects on said other substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-04-03 | 1998-10-03 | 1999-04-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-04-03 | 2002-10-03 | 2003-04-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-04-03 | 2006-10-03 | 2007-04-04 | $7700.00 | Window Closed / Lapsed |