Semiconductor device

Abstract

Abstract PURPOSE:To reduce manufacturing cost while increasing mounting density on a board by forming a capacitor into the substrate of a flip chip or onto the surface of the substrate. CONSTITUTION:A metallic wiring 9a connected to a DC potential pin 2a in metallic wirings 9 connecting pins 2 and lands 3 is connected to the upper metallic electrode 12 of the capacitor, and a metallic wiring 9b connected to a grounding pin 2b is connected to the lower metallic electrode 10 of the capacitor. Accordingly, the capacitor is connected in parallel with a semiconductor element 4 between the pins 2a-2b. DC Voltage is applied to the DC potential pin 2a, but a noise component escapes to the grounding potential pin 2b through the capacitor because the impedance of the capacitor is reduced to high frequency when noises of high frequency are overlapped to DC voltage, and the intrusion of noises into the semiconductor element 4 is prevented.

Inventors

• 👤 Hiroshi Miyamoto
• 👤 博司 宮本

Bibliographic Details