Semiconductor package

Abstract

Abstract PURPOSE:To reduce the mounting space on a print circuited sheet while eliminating patterns for mounting terminal resistors and bypass capacitors to reduce reflection and noise by a method wherein metallic pads for mounting terminal resistors or bypass capacitors are provided on the sides of a package main body. CONSTITUTION:The title semiconductor package is provided with connecting chip mounted with those of a print circuited sheet as well as metallic pads connected to the signal, power supply and gland of another semiconductor chip for mounting terminal resistors 5 or bypass capacitors on the sides thereof. For example, multiple pins 2 to connect signal, power supply and gland of LSI chip to those of the print circuited sheet are implanted in the rear of an LSI package main body 1 while the metallic pads 3 for signal.power supply connected to those of LSI chip as wel as the other metallic pads 4 for gland connected to the gland of LSI chip are provided on the sides of said main body 1. Finally, terminal resistors 5 are mounted between said pads 3 and 4.

Inventors

• 👤 Toshiharu Sofue
• 👤 敏晴 祖父江
• 👤 Kenichi Omae
• 👤 大前　憲一

Bibliographic Details