Integrated circuit device

Abstract

Abstract PURPOSE:To save the mounting area for a bypass capacitor on a printed circuit board and to improve the circuit board reliability by providing a ceramic package with such a capacitor for suppressing noises. CONSTITUTION:The integrated circuit device is composed of a ceramic plate 1 on the upper surface side, a cement junction part 2, an upper ceramic plate 3 on the bottom surface side, a lower ceramic plate 4 on the bottom surface side and outer terminals 5. The upper ceramic plate 3 on the bottom surface side and the lower ceramic plate 4 on the bottom surface side are bonded with a bonding agent so as to fill a gap. At this time, a capacitor 6 and a junction part 7, which are projecting from the junction surface of the upper ceramic plate 3 on the bottom surface side are housed in a recess part 9, which is provided in the lower ceramic plate 4 on the bottom surface side. When this integrated circuit including the capacitor 6 is mounted on a printed circuit board, no mounting area is required for an external bypass capacitor which is conventionally used. Since the capacitor 6 is enclosed in the ceramic package having high moisture resistance, the circuit board reliability can be improved.

Inventors

• 👤 Norio Sugimoto
• 👤 杉本　則郎

Bibliographic Details