US5349240A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device package having a sealing silicone gel with spherical fillers
Assignee: Denso Corp
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Filing: 1992-10-26
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Granted: 1994-09-20
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Expires: 2012-10-26
Abstract
Abstract A semiconductor element mounted on a board is sealed with a sealing resin, The semiconductor element is electrically bonded to the board through a soldering bump. The sealing resin includes a silicone gel as a base resin and a filler filled into a silicone gel. A diameter of the filler is equal to or shorter than the distance between the semiconductor element and the board, and a shape of the filler is spherical to improve a thermal conductivity of the sealing resin. The relationship between a coefficient α of a linear expansion and a complex modulus of elasticity G* of the sealing resin is defined as follows to reduce a force pushing up the semiconductor element: α≦0.033(G*-451).sup.-0.56.
Inventors
- 👤 Ryoichi Narita
- 👤 Yutaka Fukuda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 06:53
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W40/00; H10W40/70; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/531; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
151 words
A resin-sealed semiconductor device comprising: a board having a conductor pattern formed thereon; a semiconductor element including at least one soldering bump having a predetermined height facing said board and electrically bonded to said conductor pattern through said soldering bump; and a sealing resin entering a space between said semiconductor element and said board and sealing said semiconductor element; wherein said sealing resin includes a silicone gel as a base resin; and a spherical filler filled into said silicone gel, a diameter of said filler being at most a distance between said semiconductor element and said board, and volume percentage of said filler in said silicone gel being adjusted in such a way that a relationship between a coefficient α of linear expansion of said sealing resin and complex modulus of elasticity G* (dyn/cm 2 , at 1H z , 30° C.) of said sealing resin meets retirement of following formula:
Claim 2
Dependent Claim
151 words
A resin-sealed semiconductor device comprising: a board having a conductor pattern formed thereon; a semiconductor element including at least one soldering bump having a predetermined height facing said board and electrically bonded to said conductor pattern through said soldering bump; and a sealing resin entering a space between said semiconductor element and said board and sealing said semiconductor element; wherein said sealing resin includes a silicone gel as a base resin; and a spherical filler filled into said silicone gel, a diameter of said filler being at most a distance between said semiconductor element and said board, and volume percentage of said filler in said silicone gel being adjusted in such a way that a relationship between a coefficient α of linear expansion of said sealing resin and complex modulus of elasticity G* (dyn/cm 2 , at 1H z , 30° C.) of said sealing resin meets retirement of following formula:
Claim 3
Dependent Claim
4 words
α≦0. 033(G*-451) -0 .56.
Claim 4
Dependent Claim
4 words
α≦0. 033(G*-451) -0 .56.
Claim 5
Dependent Claim
16 words
A resin-sealed semiconductor device according to claim 1, wherein said semiconductor device is a flip-chip IC.
Claim 6
Dependent Claim
18 words
A resin-sealed semiconductor device according to claim 1, wherein said silicone gel is of an additional reaction type.
Claim 7
Dependent Claim
23 words
A resin-sealed semiconductor device according to claim 1, wherein thermal conductivity of said filler is higher than thermal conductivity of said silicone gel.
Claim 8
Dependent Claim
24 words
A resin-sealed semiconductor device according to claim 4, wherein said filler is made of at lease one of alumina, aluminum nitride and crystal silica.
Claim 9
Dependent Claim
15 words
A resin-sealed semiconductor device according to claim 5, wherein said filler is made of alumina.
Claim 10
Dependent Claim
25 words
A resin-sealed semiconductor device according to claim 1, wherein said device is used under a condition of a temperature change width up to 200° C.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-09-19 | 1998-03-21 | 1998-09-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-09-19 | 2002-03-21 | 2002-09-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-09-19 | 2006-03-21 | 2006-09-20 | $7700.00 | Window Closed / Lapsed |