Semiconductor device

Abstract

Abstract PURPOSE:To prevent the deterioration of performance resulting from a void, a weld line, etc. and the degradation of appearance by conducting coating molding by an epoxy resin composition containing a specific quantity of granular inorganic fillers having fixed sphericalness. CONSTITUTION:An epoxy resin composition containing granular inorganic fillers having spheroidicity of 0.5-1.0 in the Wadel's sphericalness degree by 10-100% to the whole inorganic fillers is used. Silica powder, alumina powder, etc. are cited as the inorganic fillers. The flowing properties of the epoxy resin composition 6 pressed in from a gate 5 are improved to a power transistor body 3 with a radiator plate 2, and the composition smoothly flows on not only the surface side of the radiator plate 2 but also the back side. Consequently, the resin composition 6 flows at approximately the same velocity both on the surface side and the back side of the radiator plate 2, and the spatial section of the surface side of the radiator plate 2 and the spatial section of the back side are filled with the resin composition approximately simultaneously. Accordingly, a void and a weld line, etc. resulting from the ununiformity of the flow of the resin composition 6 are not generated.

Inventors

• 👤 Yoshiharu Chichihara
• 👤 乳原　義治
• 👤 Kazuto Yamanaka
• 👤 山中　一人

Bibliographic Details