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US4337182A Expired / Lapsed US ⏱️ 0.0 years remaining

Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation

Assignee: Phillips Petroleum Co
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Filing: 1981-03-26
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Granted: 1982-06-29
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Expires: 2001-03-26
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Abstract

Abstract A composition, suitable for encapsulation-type molding, containing from about 30 to 50 weight percent poly (arylene sulfide), about 10 to about 30 weight percent glass fibers, about 30 to about 60 weight percent of a component that can be glass beads or fused silica and about 0.5 to about 3 weight percent of organic silane. Preferably the composition also contains up to about 2 weight percent of a processing aid. A method for preparing a composition suitable for molding in which there is compounded a masterbatch of glass fiber and poly (arylenesulfide), the masterbatch is reduced to particles, and the masterbatch particles are blended with a sufficient amount of organic silane, additional poly (arylene sulfide) and a component chosen from glass beads and fused silica to provide a composition of about 30 to about 50 weight percent poly (arylene sulfide), about 10 to about 30 weight percent glass fibers, about 30 to about 60 weight percent glass beads, or fused silica and 0.5 to about 3 weight percent organic silane. An article of manufacture comprising a semiconductor chip encapsulated in a molded composition as described above.

Inventors

  • 👤 Donald G. Needham

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 16:09
CPC Classifications
H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/301; C; C08; C08K; C08K13/00; C08K13/04; C08K3/00; C08K3/34; C08K3/36; C08K5/00; C08K5/54; C08K7/00; C08K7/02; C08K7/04; C08K7/14; C08K7/16; C08K7/18; C08K7/20

Claims Analysis

Total Claims: 17
Claim 1
Independent Claim 103 words
A method for preparing a composition suitable for molding said method comprising: (a) melt compounding a masterbatch of glass fiber and poly (arylene sulfide); (b) reducing said masterbatch to particles; (c) and blending said masterbatch particles with a sufficient amount of organic silane, additional poly (arylene sulfide) and a component chosen from glass beads and fused silica to provide a composition of about 30 to about 50 weight percent poly (arylene sulfide), about 10 to about 30 weight percent in glass fibers, about 30 to about 60 percent glass beads or fused silica, and about 0.5 to about 3 weight percent organic silane.
Claim 2
Independent Claim 103 words
A method for preparing a composition suitable for molding said method comprising: (a) melt compounding a masterbatch of glass fiber and poly (arylene sulfide); (b) reducing said masterbatch to particles; (c) and blending said masterbatch particles with a sufficient amount of organic silane, additional poly (arylene sulfide) and a component chosen from glass beads and fused silica to provide a composition of about 30 to about 50 weight percent poly (arylene sulfide), about 10 to about 30 weight percent in glass fibers, about 30 to about 60 percent glass beads or fused silica, and about 0.5 to about 3 weight percent organic silane.
Claim 3
Dependent Claim 25 words
A method of claim 1 wherein said silane is chosen from among gamma-glycidoxypropyltrimethoxysilane, methyltrimethoxysilane, polyvisoxymethoxysilane, vinyltris(2-methoxyethoxy) silane, beta-(3,4-epoxycyclohexyl) ethyltrimethoxy silane, and N-beta(n-vinylbenzylamine)ethyl gamma-aminopropyltrimethoxysilane monohydrogen chloride.
Claim 4
Dependent Claim 40 words
A method of claim 1 wherein there is also blended into the composition in step (c), at least one of, up to about 2 weight percent of a processing aid and up to about 3 weight percent of a colorant.
Claim 5
Dependent Claim 13 words
A method of claim 1 or 3 wherein said component is glass beads.
Claim 6
Dependent Claim 13 words
A method of claim 1 or 3 wherein said component is fused silica.
Claim 7
Dependent Claim 9 words
A composition made by the method of claim 1.
Claim 8
Dependent Claim 9 words
A composition made by the method of claim 3.
Claim 9
Dependent Claim 59 words
A composition suitable for molding comprising: (a) from about 30 to about 50 weight percent poly (arylene sulfide), (b) from about 10 to about 30 weight percent glass fibers, (c) from about 30 to about 60 weight percent of a component chosen from glass beads and fused silica, and (d) about 0.5 to about 3 weight percent organic silane.
Claim 10
Dependent Claim 59 words
A composition suitable for molding comprising: (a) from about 30 to about 50 weight percent poly (arylene sulfide), (b) from about 10 to about 30 weight percent glass fibers, (c) from about 30 to about 60 weight percent of a component chosen from glass beads and fused silica, and (d) about 0.5 to about 3 weight percent organic silane.
Claim 11
Dependent Claim 29 words
A composition of claim 8 also comprising: (e) up to about 2 weight percent of a processing aid and (f) up to about 3 weight percent of a colorant.
Claim 12
Dependent Claim 13 words
A composition of claim 8 or 9 wherein said component is glass beads.
Claim 13
Dependent Claim 13 words
A composition of claim 8 or 9 wherein said component is fused silica.
Claim 14
Dependent Claim 13 words
A semiconductor chip encapsulated in a molded composition of claim 8 or 9.
Claim 15
Dependent Claim 11 words
A semiconductor chip encapsulated in a molded composition of claim 10.
Claim 16
Dependent Claim 11 words
A semiconductor chip encapsulated in a molded composition of claim 11.
Claim 17
Dependent Claim 63 words
A method for preparing an encapsulated semiconductor chip comprising (1) introducing a semiconductor chip into an injection mold, (2) introducing a melt of the molding composition of claim 8 or 9 into said mold surrounding said chip, (3) subjecting said composition to molding conditions to produce a molded object, (4) cooling said molded object, and (5) releasing said molded object from the mold.

References Cited (Backward Citations)

US3496427A Cited
US3626051A Cited
US3679941A Cited
US3988286A Cited
US4034466A Cited
US4001863A Cited
US4134874A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1985-06-28 1985-12-28 1986-06-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1989-06-28 1989-12-28 1990-06-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1993-06-28 1993-12-28 1994-06-29 $7700.00 Window Closed / Lapsed

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