← Back to Patent Explorer
US3492157A Expired / Lapsed US ⏱️ 0.0 years remaining

Resin-sealed semiconductor device and manufacturing method for the same

Assignee: Toshiba Corp
•
Filing: 1967-06-09
•
Granted: 1970-01-27
•
Expires: 1987-06-09
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

No abstract record available.

Inventors

  • 👤 Shintaro Ito
  • 👤 Koichi Suzuki

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 22:22
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/473; H10W74/01; H10W74/016; H10W76/00; H10W76/40; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171; Y10T29/49172

Claims Analysis

Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.

References Cited (Backward Citations)

US2940161A Cited
US2937110A Cited
US3135625A Cited
US3156580A Cited
US3240619A Cited
US3235937A Cited
US3298087A Cited
US3278813A Cited
US3283224A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1973-01-26 1973-07-28 1974-01-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1977-01-26 1977-07-28 1978-01-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1981-01-26 1981-07-28 1982-01-27 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag