Mold capping semiconductor device

Claim 1

A SEMICONDUCTOR DEVICE COMPRISING: (A) A HEADER MEMBER OF ELECTRICAL INSULATING HEAT CONDUCTIVE MATERIAL HAVING A UNIPLANAR UPPER SURFACE AND A LOWER SURFACE, THE LOWER SURFACE OF SAID HEADER MEMBER DEFINING A BROAD AREA CONTACT FOR THE CONDUCTION OF HEAT FROM SAID HEADER BODY TO A HEAT SINK; (B) A THIN LAYER OF ELECTROCONDUCTIVE MATERIAL ESTABLISHED ON SPACED APART PORTIONS OF THE UNIPLANAR UPPER SURFACE OF SAID HEADER MEMBER TO DEFINE FIRST AND SECOND ELECTRICAL CONTACT REGIONS; (C) A BODY OF SEMICONDUCTOR MATERIAL CONTAINING AT LEAST ONE PN JUNCTION, SAID BODY OF SEMICONDUCTOR MATERIAL BEING MOUNTED WITH A PORTION THEREOF IN OHMIC CONNECTION WITH SAID FIRST ELECTRICAL CONTACT REGION AND BEING PROVIDED WITH A LEAD WIRE OHMICALLY CONNECTING ANOTHER PORTION THEREOF WITH SAID SECOND ELECTRICAL CONTACT REGION; (D) A FIRST ELECTROCONDUCTIVE LEAD HAVING ONE OF ITS ENDS SECURED IN OHMIC CONTACT WITH SAID FIRST ELECTRICAL CONTACT REGION AND HAVING ITS OTHER END PROJECTING BEYOND SAID HEADER MEMBER; (E) A SECOND ELECTROCONDUCTIVE RIBBON LEAD HAVING ONE OF ITS ENDS SECURED IN OHMIC CONTACT WITH SAID SECOND ELECTRICAL CONTACT REGION AND HAVING ITS OTHER END PROJECTING BEYOND SAID HEADER MEMBER; (F) A BUFFER COATING OF ELASTIC MATERIAL DISPOSED OVER SAID SEMICONDUCTOR MATERIAL AND SURROUNDING THE FREE PORTION OF SAID LEAD WIRE; AND (G) A SOLID PLASTIC CAP MOLDED OVER THE UPPER PORTION OF SAID HEADER MEMBER TO COVER SAID BUFFER COATING, SAID ELECTRICAL CONTACT REGIONS, SAID SEMICONDUCTOR BODY AND LEAD WIRE AND THE SECURED ENDS OF SAID FIRST AND SECOND RIBBON LEADS TO THEREBY EXPOSE ONLY THE FREE ENDS OF SAID RIBBON LEADS AND THE LOWERMOST PORTION OF SAID HEADER MEMBER INCLUDING SAID LOWER SURFACE.