Hermetically sealed packaged electronic system

Claim 1

A hermetically sealed packaged electronic system, comprising: a substrate; a plurality of module contact pads disposed on a desired surface of said substrate; a barrier support frame disposed on said desired surface, said frame having a perimeter dividing each of said plurality of module contact pads into an inner portion and an outer portion; a plurality of electronic components having interconnection pads thereon, all of said components being positioned within the perimeter of said barrier support frame; a polymer dielectric film overlying and bridging said electronic components, said polymer dielectric film having a plurality of via openings therein, with each of said via openings being aligned with at least some of said interconnection pads and said inner portions of said module contact pads; a pattern of interconnection conductors disposed on said polymer dielectric film and extending through associated via openings to provide electrical connection between at least some of said interconnection pads and said inner portions of said module contact pads; a polymer barrier layer disposed on said polymer dielectric film so as to entirely cover an area enclosed within said barrier support frame and also partially cover said barrier support frame about the entire periphery thereof; a metal barrier layer disposed on said polymer barrier layer and adhering to said barrier support frame about the entire periphery thereof so as to entirely cover a sealed area enclosed within said polymer barrier layer and said barrier support frame; and a protective layer disposed on said polymer barrier layer and bridging any voids that may be present in said metal barrier layer, so as to hermetically seal the volume bounded by said substrate, barrier support frame, metal barrier layer and protective layer.