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US5315155A Expired / Lapsed US ⏱️ 0.0 years remaining

Electronic package with stress relief channel

Assignee: Olin Corp
•
Filing: 1992-07-13
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Granted: 1994-05-24
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Expires: 2012-07-13
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Abstract

Abstract There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the pedestal is less than that of the buffer, such that the at least a portion of the buffer overhangs the pedestal.

Inventors

  • 👤 Brian E. O'Donnelly
  • 👤 Brian Mravic
  • 👤 Jacob Crane
  • 👤 Deepak Mahulikar

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 16:07
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W42/00; H10W42/121; H10W72/00; H10W72/071; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/134; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/073; H10W72/07351; H10W72/07352; H10W72/30; H10W72/321; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/381; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/756

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 82 words
An electronic package assembly, comprising: a leadframe having a plurality of leads, the inner ends of which define a central region; a base containing a recessed channel defining a pedestal disposed adjacent said central region, said recessed channel having a depth of up to 50% the depth of that portion of said base adjacent said recessed channel; a buffer bonded to said pedestal with a portion of said buffer overhanging said pedestal; and a sealing glass bonding said base to said leadframe.
Claim 2
Dependent Claim 82 words
An electronic package assembly, comprising: a leadframe having a plurality of leads, the inner ends of which define a central region; a base containing a recessed channel defining a pedestal disposed adjacent said central region, said recessed channel having a depth of up to 50% the depth of that portion of said base adjacent said recessed channel; a buffer bonded to said pedestal with a portion of said buffer overhanging said pedestal; and a sealing glass bonding said base to said leadframe.
Claim 3
Dependent Claim 20 words
The electronic package assembly of claim 1 wherein said pedestal is defined by a continuous recessed channel in said base.
Claim 4
Dependent Claim 29 words
The electronic package assembly of claim 2 wherein said pedestal has a cross sectional area of from about 60% to about 90% the cross sectional area of said buffer.
Claim 5
Dependent Claim 29 words
The electronic package assembly of claim 3 wherein said pedestal has a cross sectional area of from about 70% to about 80% the cross sectional area of said buffer.
Claim 6
Dependent Claim 28 words
The electronic package assembly of claim 3 wherein said recessed channel has a depth of from about 20% to about 40% the thickness of said adjacent base region.
Claim 7
Dependent Claim 83 words
An electronic package assembly, comprising: a leadframe having a plurality of leads, the inner ends of which define a central region; a metallic base containing a recessed channel forming a pedestal disposed within said central region, said recessed channel having a depth of up to 50% the depth of that portion of said base adjacent said recessed channel; a buffer brazed to said pedestal with a portion of said buffer overhanging said pedestal; and a sealing glass bonding said base to said leadframe.
Claim 8
Dependent Claim 83 words
An electronic package assembly, comprising: a leadframe having a plurality of leads, the inner ends of which define a central region; a metallic base containing a recessed channel forming a pedestal disposed within said central region, said recessed channel having a depth of up to 50% the depth of that portion of said base adjacent said recessed channel; a buffer brazed to said pedestal with a portion of said buffer overhanging said pedestal; and a sealing glass bonding said base to said leadframe.
Claim 9
Dependent Claim 29 words
The electronic package assembly of claim 6 wherein said pedestal has a cross sectional area of from about 60% to about 90% the cross sectional area of said buffer.
Claim 10
Dependent Claim 17 words
The electronic package assembly of claim 7 wherein said bases formed from copper, aluminum, or alloys thereof.
Claim 11
Dependent Claim 18 words
The electronic package assembly of claim 8 wherein said base is formed from a nickel plated copper alloy.
Claim 12
Dependent Claim 17 words
The electronic package assembly of claim 9 wherein said base is formed from either copper alloy C197.
Claim 13
Dependent Claim 43 words
The electronic package assembly of claim 8 wherein said base is formed from an aluminum alloy and coated with an anodization layer in at least those portions of said base which either are exposed to the outside environment or contact said sealing glass.
Claim 14
Dependent Claim 25 words
The electronic package assembly of claim 11 wherein said base is formed from aluminum alloy 3003 and said anodization layer is an integral black color.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-05-23 1997-11-22 1998-05-24 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-05-23 2001-11-22 2002-05-24 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-05-23 2005-11-22 2006-05-24 $7700.00 Window Closed / Lapsed

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